Abstract: A semiconductor device has an insulating substrate, a semiconductor element which is mounted on the insulating substrate, a hollow casing which surrounds a peripheral edge of the insulating substrate to contain the semiconductor element therein, and a sealing material which is charged into the casing to seal the inside of the casing. The casing has protrusion portions each of which partially protrudes from an upper surface of the casing. Thus, it is possible to provide a semiconductor device in which poor external appearance or lowering of adhesion to a cover can be prevented even when a sealing material is injected up to the vicinity of an upper surface of a casing.

Abstract: A packaged device of one embodiment includes a device layer section, and first and second packaging members. The device layer section is one where a movable microdevice including a movable part and a terminal part is formed. The first packaging member is joined to the device layer section, and includes a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region. The second packaging member is joined to a side of the device layer section opposite the first packaging member.

Abstract: A semiconductor device includes an insulating substrate including a metal plate, an insulating plate, and a circuit plate laminated sequentially in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode provided on a surface of the semiconductor element, the circuit plate, or the electrode and the circuit plate; a plastic housing having a hollow shape to receive the insulating substrate, the semiconductor element, and the wiring member therein, the plastic housing having an inner frame on an inner surface and a step formed in a front end of the inner frame; and a sealing material made of a thermosetting resin to seal the insulating substrate, the semiconductor element, and the wiring member inside the plastic housing.

Abstract: An electronic device having a variable capacitance element, includes a support substrate providing physical support, a pair of anchors formed on the support substrate, and having support portions in a direction perpendicular to a surface of the substrate, a movable electrode supported by the support portions of the pair of anchors, having opposing first and second side surfaces constituting electrode surfaces, and at least partially capable of elastic deformation, a first fixed electrode supported above the support substrate, and having a first electrode surface opposing to the first side surface of the movable electrode, and a second fixed electrode supported above the support substrate, and having a second electrode surface opposing to the second side surface of the movable electrode.

Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

Abstract: A semiconductor device has an insulating substrate, a semiconductor element which is mounted on the insulating substrate, a hollow casing which surrounds a peripheral edge of the insulating substrate to contain the semiconductor element therein, and a sealing material which is charged into the casing to seal the inside of the casing. The casing has protrusion portions each of which partially protrudes from an upper surface of the casing. Thus, it is possible to provide a semiconductor device in which poor external appearance or lowering of adhesion to a cover can be prevented even when a sealing material is injected up to the vicinity of an upper surface of a casing.

Abstract: A component mounting line has a screen printing apparatus and component mounting apparatuses. The screen printing apparatus carries in substrates based on substrate carrying-in order data which is determined so that alternate carrying-in in which a first type substrate and a second type substrate are alternately carried in and continuous carrying-in in which the first type substrate or the second type substrate which has a shorter line tact time is continuously carried in are mixed.

Abstract: A component mounting line has a screen printing apparatus and component mounting apparatuses. Each component mounting apparatus includes a first substrate carrying lane and a second substrate carrying lane, carries a first type substrate on which a first pattern has been printed in the first substrate carrying lane, performs a component mounting-relevant operation on the first type substrate, carries a second type substrate on which a second pattern has been printed in the second substrate carrying lane, and performs a component mounting-relevant operation on the second type substrate. The screen printing apparatus selects a type of the substrate to be carried in depending on whether a substrate is carried in the second component mounting apparatus downstream from the screen printing apparatus.

Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

Abstract: There is provided a method for fabricating a device, preferably for a micro electro electro mechanical system. The method includes forming a first electrode on a substrate, where the first electrode has a first sloped end at least at one end thereof; forming a sacrificial layer on the first electrode, where the sacrificial layer has a first sloped edge, the first sloped edge and the first sloped end are overlapped each other so that a thickness of the first sloped edge decreases as a thickness of the first sloped end increases; forming a first spacer on the first electrode, where the first spacer has contact with the first sloped edge; forming a beam electrode on the sacrificial layer and the first spacer; and removing the sacrificial layer after the forming the beam electrode.

Abstract: A driving method for driving an electrostatic actuator including a fixed electrode and a movable electrode opposing each other with a dielectric layer interposed therebetween, includes applying a first voltage, between the fixed electrode and the movable electrode, to bring the movable electrode into contact with the dielectric layer, and applying a second voltage, between the fixed electrode and the movable electrode, after application of the first voltage is stopped and before the movable electrode moves away from the dielectric layer. Here, the second voltage has a polarity opposite to a polarity of the first voltage and an absolute value smaller than an absolute value of the first voltage.

Abstract: An electronic device having a variable capacitance element, includes a support substrate providing physical support, a pair of anchors formed on the support substrate, and having support portions in a direction perpendicular to a surface of the substrate, a movable electrode supported by the support portions of the pair of anchors, having opposing first and second side surfaces constituting electrode surfaces, and at least partially capable of elastic deformation, a first fixed electrode supported above the support substrate, and having a first electrode surface opposing to the first side surface of the movable electrode, and a second fixed electrode supported above the support substrate, and having a second electrode surface opposing to the second side surface of the movable electrode.

Abstract: A method of manufacturing a semiconductor apparatus according to aspects of the invention can include the steps of coating solder on an predetermined area in the upper surface of a lead frame, mounting a chip on solder and melting solder with a hot plate for bonding the chip to the lead frame. The method can also include wiring with bonding wires, turning lead frame upside down, placing lead frame turned upside down on heating cradle, coating solder, the melting point of which is lower than the solder melting point and mounting electronic part on solder; and melting solder with heating cradle for bonding electronic part to lead frame. The bonding with solder can be conducted at a high ambient temperature. Aspects of the semiconductor apparatus can facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps.

Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

Abstract: A variable capacitive element includes a first fixed electrode and a second fixed electrode that are insulated from each other, a movable electrode arranged to face the first fixed electrode and the second fixed electrode, a dielectric layer provided between the movable electrode and the first fixed electrode as well as the second fixed electrode, a first wiring part for applying a first driving voltage to the first fixed electrode with reference to a potential of the movable electrode, and a second wiring part for applying a second driving voltage to the second fixed electrode with reference to the potential of the movable electrode, the second driving voltage having a polarity different from a polarity of the first driving voltage.

Abstract: A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.

Abstract: A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.

Abstract: A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.

Abstract: A burst wave is applied to an excitation element of a touch panel main body from an oscillation section so as to excite surface acoustic waves, and the excited surface acoustic waves are received by a receiving element of the touch panel main body. The received signals are A/D converted by a receiving section, and a control section calculates the contact position and the contact width of the object in contact with the touch panel main body, based on time-series changes in the received strength. Based on the received strength of surface acoustic waves, the control section controls the wave number of the burst wave to be applied to the excitation element.