Patents by Inventor Takashi Katsuki
Takashi Katsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8230740Abstract: An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation.Type: GrantFiled: July 14, 2009Date of Patent: July 31, 2012Assignee: Fujitsu LimitedInventors: Takashi Katsuki, Fumihiko Nakazawa, Hiroaki Inoue
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Publication number: 20120175757Abstract: A method of manufacturing a semiconductor apparatus according to aspects of the invention can include the steps of coating solder on an predetermined area in the upper surface of a lead frame, mounting a chip on solder and melting solder with a hot plate for bonding the chip to the lead frame. The method can also include wiring with bonding wires, turning lead frame upside down, placing lead frame turned upside down on heating cradle, coating solder, the melting point of which is lower than the solder melting point and mounting electronic part on solder; and melting solder with heating cradle for bonding electronic part to lead frame. The bonding with solder can be conducted at a high ambient temperature. Aspects of the semiconductor apparatus can facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps.Type: ApplicationFiled: January 11, 2012Publication date: July 12, 2012Applicant: FUJI ELECTRIC CO., LTD.Inventor: Takashi Katsuki
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Patent number: 8040327Abstract: Each of transducers of a touch panel device includes a piezoelectric thin film, a plate electrode disposed at one surface of the piezoelectric thin film and a comb-like electrode disposed at the other surface of the piezoelectric thin film. The comb-like electrode has a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode fingers is connected. A plurality of wiring electrodes is provided at the outer side of any of the transducers in parallel with the bus electrode of the transducer and is connected to the bus electrode and the plate electrode of any of the transducers. Each of the wiring electrodes includes an electrode base portion formed by printing silver paste containing fine particles on the substrate and an electrode main body formed by printing silver paste containing large particles and fine particles in a mixed manner on the electrode base portion.Type: GrantFiled: August 8, 2008Date of Patent: October 18, 2011Assignee: Fujitsu LimitedInventors: Satoshi Sano, Takashi Katsuki, Yuji Takahashi, Fumihiko Nakazawa
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Publication number: 20110221300Abstract: A driving method for driving an electrostatic actuator including a fixed electrode and a movable electrode opposing each other with a dielectric layer interposed therebetween, includes applying a first voltage, between the fixed electrode and the movable electrode, to bring the movable electrode into contact with the dielectric layer, and applying a second voltage, between the fixed electrode and the movable electrode, after application of the first voltage is stopped and before the movable electrode moves away from the dielectric layer. Here, the second voltage has a polarity opposite to a polarity of the first voltage and an absolute value smaller than an absolute value of the first voltage.Type: ApplicationFiled: February 1, 2011Publication date: September 15, 2011Applicant: FUJITSU LIMITEDInventors: Takeaki SHIMANOUCHI, Masahiko Imai, Takashi Katsuki, Osamu Toyoda, Satoshi Ueda
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Publication number: 20110216469Abstract: There is provided a method for fabricating a device, preferably for a micro electro electro mechanical system. The method includes forming a first electrode on a substrate, where the first electrode has a first sloped end at least at one end thereof; forming a sacrificial layer on the first electrode, where the sacrificial layer has a first sloped edge, the first sloped edge and the first sloped end are overlapped each other so that a thickness of the first sloped edge decreases as a thickness of the first sloped end increases; forming a first spacer on the first electrode, where the first spacer has contact with the first sloped edge; forming a beam electrode on the sacrificial layer and the first spacer; and removing the sacrificial layer after the forming the beam electrode.Type: ApplicationFiled: March 1, 2011Publication date: September 8, 2011Applicant: FUJITSU LIMITEDInventors: Takashi Katsuki, Takeaki Shimanouchi, Masahiko Imai, Osamu Toyoda, Satoshi Ueda
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Publication number: 20110096462Abstract: A variable capacitive element includes a first fixed electrode and a second fixed electrode that are insulated from each other, a movable electrode arranged to face the first fixed electrode and the second fixed electrode, a dielectric layer provided between the movable electrode and the first fixed electrode as well as the second fixed electrode, a first wiring part for applying a first driving voltage to the first fixed electrode with reference to a potential of the movable electrode, and a second wiring part for applying a second driving voltage to the second fixed electrode with reference to the potential of the movable electrode, the second driving voltage having a polarity different from a polarity of the first driving voltage.Type: ApplicationFiled: October 22, 2010Publication date: April 28, 2011Applicant: FUJITSU LIMITEDInventors: Takeaki SHIMANOUCHI, Masahiko Imai, Takashi Katsuki, Satoshi Ueda
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Patent number: 7932900Abstract: Surface acoustic waves are propagated in a lower-left oblique direction and a lower-right oblique direction from an excitation element located on the upper side of a non-piezoelectric substrate and then received by receiving elements located on the left side and the right side, while surface acoustic waves are propagated in an upper-left oblique direction and an upper-right oblique direction from an excitation element located on the lower side of the non-piezoelectric substrate and then received by the receiving elements located on the left side and the right side. Based on the received results at the two receiving elements, a position of an object in contact with the non-piezoelectric substrate is detected.Type: GrantFiled: November 28, 2006Date of Patent: April 26, 2011Assignee: Fujitsu LimitedInventors: Satoshi Sano, Takashi Katsuki, Yuji Takahashi, Fumihiko Nakazawa
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Patent number: 7914355Abstract: First electrodes partially configuring light-emitting elements are patterned in the form of stripes on a first major surface of a transparent substrate. Next, piezoelectric elements functioning a SAW touch sensor are formed on a second major surface of the transparent substrate. Next, the light-emitting elements forming step of forming light-emitting elements on the first electrodes which are patterned in advance is sequentially executed. After the formation of the piezoelectric elements, since the step of forming the light-emitting elements is executed, the light-emitting elements can be prevented from being damaged by receiving heat in the formation of the piezoelectric elements.Type: GrantFiled: February 8, 2006Date of Patent: March 29, 2011Assignees: Tohoku Pioneer Corporation, Fujitsu Limited, Fujitsu Component LimitedInventors: Fumihiko Nakazawa, Takashi Katsuki, Yuji Takahashi, Satoshi Sato, Satoshi Sasaki, Tamotsu Watanabe, Kunizo Ogoshi, Michiko Endo
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Patent number: 7859522Abstract: A touch panel device includes an excitation transducer for exciting a surface acoustic wave upon application of a burst wave and a reception transducer for receiving the surface acoustic wave and converting the same into a reception signal that are arranged at a peripheral portion of a detection area so that a position of an object touching the detection area is detected in accordance with a change in the reception signal. A control method for eliminating noises in the touch panel device includes the steps of detecting a differential between a reception signal due to a burst wave and another reception signal due to another burst wave, deciding that there is a noise if the detected differential exceeds a preset threshold value, and performing a control operation so that the detection of an object based on the reception signal is not performed in accordance with the decision.Type: GrantFiled: August 16, 2005Date of Patent: December 28, 2010Assignee: Fujitsu LimitedInventors: Yuji Takahashi, Fumihiko Nakazawa, Satoshi Sano, Takashi Katsuki
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Publication number: 20100218977Abstract: A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.Type: ApplicationFiled: January 15, 2010Publication date: September 2, 2010Applicant: FUJITSU LIMITEDInventors: Hiroaki Inoue, Takashi Katsuki, Fumihiko Nakazawa
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Publication number: 20100085332Abstract: A burst wave is applied to an excitation element of a touch panel main body from an oscillation section so as to excite surface acoustic waves, and the excited surface acoustic waves are received by a receiving element of the touch panel main body. The received signals are A/D converted by a receiving section, and a control section calculates the contact position and the contact width of the object in contact with the touch panel main body, based on time-series changes in the received strength. Based on the received strength of surface acoustic waves, the control section controls the wave number of the burst wave to be applied to the excitation element.Type: ApplicationFiled: December 9, 2009Publication date: April 8, 2010Applicant: FUJITSU LIMITEDInventors: Yuji TAKAHASHI, Fumihiko NAKAZAWA, Satoshi SANO, Takashi KATSUKI
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Publication number: 20100067208Abstract: A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.Type: ApplicationFiled: July 16, 2009Publication date: March 18, 2010Applicant: FUJITSU LIMITEDInventors: Hiroaki INOUE, Takashi KATSUKI, Fumihiko NAKAZAWA
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Patent number: 7667694Abstract: A burst wave is applied to an excitation element of a touch panel main body from an oscillation section so as to excite surface acoustic waves, and the excited surface acoustic waves are received by a receiving element of the touch panel main body. The received signals are A/D converted by a receiving section, and a control section calculates the contact position and the contact width of the object in contact with the touch panel main body, based on time-series changes in the received strength. Based on the received strength of surface acoustic waves, the control section controls the wave number of the burst wave to be applied to the excitation element.Type: GrantFiled: October 30, 2003Date of Patent: February 23, 2010Assignee: Fujitsu LimitedInventors: Yuji Takahashi, Fumihiko Nakazawa, Satoshi Sano, Takashi Katsuki
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Publication number: 20100024547Abstract: An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation.Type: ApplicationFiled: July 14, 2009Publication date: February 4, 2010Applicant: FUJITSU LIMITEDInventors: Takashi KATSUKI, Fumihiko Nakazawa, Hiroaki Inoue
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Patent number: 7630536Abstract: To provide a printing inspection apparatus and a printing inspection method enabling an optimal inspection mode in which a balance is kept between the improvement of production efficiency and the securing of a printing accuracy. In a printing inspection for inspecting a printing state of cream solder on a substrate after screen printing, inspection data is generated by dividing unit shape and position data, indicating the shapes and the positions of element solder print portions to be printed on electrodes provided on a circuit forming surface of the substrate to be used to bond electronic components, into data groups according to a grouping condition chosen in response to an inspection mode. A go/no-go judgment at the time of inspection is made per data group, and a judgment result is displayed for each data group. It is thus possible to choose an optimal inspection mode flexibly in response to the characteristics of a substrate as the subject to be inspected.Type: GrantFiled: July 24, 2003Date of Patent: December 8, 2009Assignee: Panasonic CorporationInventors: Takahiro Fukagawa, Yuji Otake, Takashi Katsuki, Minoru Murakami, Kimiyuki Yamasaki
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Patent number: 7605523Abstract: A piezoelectric device (X) includes a substrate (11) a piezoelectric film (12), a first electrode (13), and a second electrode (14). At least one of the first electrode (13) and the second electrode (14) is interposed between the substrate (11) and the piezoelectric film (12), and made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au.Type: GrantFiled: November 22, 2005Date of Patent: October 20, 2009Assignee: Fujitsu LimitedInventors: Takashi Katsuki, Fumihiko Nakazawa, Satoshi Sano, Yuji Takahashi
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Publication number: 20090156083Abstract: First electrodes partially configuring light-emitting elements are patterned in the form of stripes on a first major surface of a transparent substrate. After the step of forming the first electrodes, piezoelectric elements functioning a SAW touch sensor is formed on a second major surface of the transparent substrate. Furthermore, after the step of forming the piezoelectric elements, the light-emitting elements forming step of forming light-emitting elements on the first electrodes which are patterned in advance is sequentially executed. Since the first electrodes are formed in the form of stripes, the piezoelectric elements can be prevented from being damaged by an etching solution used at this time. After the formation of the piezoelectric elements, since the step of forming the light-emitting elements is executed, the light-emitting elements can be prevented from being damaged by receiving heat in the formation of the piezoelectric elements.Type: ApplicationFiled: February 8, 2006Publication date: June 18, 2009Applicants: TOHOKU PIONEER CORPORATION, FUJITSU LIMITED, FUJITSU COMPONENT LIMITEDInventors: Fumihiko Nakazawa, Takashi Katsuki, Yuji Takahashi, Satoshi Sato, Satoshi Sasaki, Tamotsu Watanabe, Kunizo Ogoshi, Michiko Endo
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Publication number: 20090139328Abstract: A method is provided for making packaged micro-devices each including a micro movable element, a first packaging member formed with a recess, and a second packaging member formed with another recess. The micro movable element has a movable part. In accordance with the method, a device wafer is prepared for forming a plurality of micromovable elements. A first packaging wafer, formed with a plurality of recesses corresponding in position to the movable parts of the respective movable elements, is bonded to one surface of the device wafer. A second packaging wafer, formed with a plurality of recesses, is bonded to the other surface of the device wafer. The resulting laminate assembly is cut into separate products.Type: ApplicationFiled: February 27, 2008Publication date: June 4, 2009Applicants: FUJITSU LIMITED, FUJITSU MEDIA DEVICES LIMITEDInventors: Hiroaki Inoue, Fumihiko Nakazawa, Hiroshi Ishikawa, Takashi Katsuki, Takayuki Yamaji
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Patent number: 7502015Abstract: A transducer for excitation including two electrode, and at least one of the two electrodes is a comb-like electrode including a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode finger is connected. When dividing the transducer into two areas in the length direction of the bus electrode, at least one connection portion for one of the two electrodes is disposed in one of the two areas, while at least one connection portion for the other electrode is disposed in the other area.Type: GrantFiled: December 22, 2004Date of Patent: March 10, 2009Assignee: Fujitsu LimitedInventors: Takashi Katsuki, Satoshi Sano, Yuji Takahashi, Fumihiko Nakazawa
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Publication number: 20080316187Abstract: Each of transducers of a touch panel device includes a piezoelectric thin film, a plate electrode disposed at one surface of the piezoelectric thin film and a comb-like electrode disposed at the other surface of the piezoelectric thin film. The comb-like electrode has a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode fingers is connected. A plurality of wiring electrodes is provided at the outer side of any of the transducers in parallel with the bus electrode of the transducer and is connected to the bus electrode and the plate electrode of any of the transducers. Each of the wiring electrodes includes an electrode base portion formed by printing silver paste containing fine particles on the substrate and an electrode main body formed by printing silver paste containing large particles and fine particles in a mixed manner on the electrode base portion.Type: ApplicationFiled: August 8, 2008Publication date: December 25, 2008Applicant: FUJITSU LIMITEDInventors: Satoshi Sano, Takashi Katsuki, Yuji Takahashi, Fumihiko Nakazawa