Patents by Inventor Takashi Kikuchi

Takashi Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080032103
    Abstract: A multilayer printed circuit board can be used in high-frequency applications, is not easily affected by environmental changes, and has stable dielectric characteristics. A multilayer printed circuit board suitable for use in the high-frequency range includes at least two printed wiring sheets laminated with an interlayer bonding member therebetween. At least one of the at least two printed wiring sheets includes an insulating film, an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the insulating film, and a metal wiring layer disposed on the adhesive layer. The interlayer bonding member contains a thermoplastic polyimide.
    Type: Application
    Filed: April 27, 2005
    Publication date: February 7, 2008
    Applicants: KANEKA TEXAS CORPORATION, KANEKA CORPORATION
    Inventors: Takashi Kikuchi, Hiroyuki Tsuji, Takashi Itoh, Shigeru Tanaka, Eiichiro Kuribayashi, Greg Clements
  • Publication number: 20070292701
    Abstract: Disclosed is a non-thermoplastic polyimide film obtained by imidating a polyamic acid-containing solution which is obtained by reacting an aromatic diamine containing 3,4?-diaminodiphenyl ether and 2,2-bis{4-(4-aminophenoxy)phenyl}propane with an aromatic acid dianhydride by a specific polymerization process. This polyimide film exhibits good adherability with respect to a metal foil via an adhesive layer containing a thermoplastic polyimide without being subjected to a special surface treatment.
    Type: Application
    Filed: September 15, 2005
    Publication date: December 20, 2007
    Inventors: Takashi Kikuchi, Hisayasu Kaneshiro
  • Publication number: 20070263953
    Abstract: An optical switching element comprising: a multimode waveguide having an electro-optical effect; one or a plurality of first single mode waveguides; a plurality of second single mode waveguides; a first electrode arranged in the vicinity of one edge on one side of the multimode waveguide; a second electrode arranged in the vicinity of the other edge on the same side of the multimode waveguide; and a third electrode arranged on the other side of the multimode waveguide, over the first electrode and the second electrode being arranged so as to be positioned on luminescent spots in an optical mode field generated by the light propagating through the multimode waveguide, and an optical path being switched between the first single mode waveguide and the second single mode waveguide by applying voltage between the first electrode and the third electrode and between the second electrode and the third electrode, is provided.
    Type: Application
    Filed: November 29, 2006
    Publication date: November 15, 2007
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Roshan Thapliya, Shigetoshi Nakamura, Takashi Kikuchi
  • Publication number: 20070260036
    Abstract: Disclosed is a polyimide film having good adherability to an adhesive, especially to a polyimide adhesive. Specifically, disclosed is a non-thermoplastic polyimide film whose raw material is composed of a diamine essentially containing 2,2-bisaminophenoxylphenylpropane and praphenylene diamine, and an acid dianhydride component essentially containing a pyromellitic dianhydride and 3,3?,4,4?-benzophenone tetracarboxylic dianhydride. Thus non-thermoplastic polyimide film is characterized by having an average birefringence of less than 0.14.
    Type: Application
    Filed: September 9, 2005
    Publication date: November 8, 2007
    Inventors: Hisayasu Kaneshiro, Takashi Kikuchi
  • Publication number: 20070194454
    Abstract: This invention is to provide a nonvolatile memory device that enhances a size reduction and mass productivity while ensuring reliability and signal transmission performance. A nonvolatile memory chip having a first side formed with no pads and a second side formed with pads is mounted on a mounting substrate. A control chip for controlling the nonvolatile memory chip is mounted on the nonvolatile memory chip. The control chip has a first pad row corresponding to the pads of the nonvolatile memory chip. The first pad row is mounted adjacent to the first side of the nonvolatile memory chip. The first pad row of the control chip and a first electrode row formed on the mounting substrate are connected via a first wire group. The pads of the nonvolatile memory chip and a second electrode row formed on the mounting substrate are connected via a second wire group. The first electrode row and the second electrode row are connected through wirings formed in the mounting substrate.
    Type: Application
    Filed: January 23, 2007
    Publication date: August 23, 2007
    Inventors: Kazuko HANAWA, Takashi Kikuchi, Koichi Kanemoto, Michiaki Sugiyama, Chikako Imura
  • Publication number: 20070179271
    Abstract: A non-thermoplastic polyimide film exhibits high adherability without expensive surface treatment and is made from a precursor solution having high storage stability. The non-thermoplastic polyimide film comprises a non-thermoplastic polyimide resin having a block component derived from a thermoplastic polyimide. Preferably, the block component of the thermoplastic polyimide is present in an amount of 20 to 60 mol % of the entire polyimide so that the precursor solution thereof exhibits high storage stability and that the film can exhibit high adherability, in particular, high adherability to polyimide adhesives.
    Type: Application
    Filed: January 26, 2007
    Publication date: August 2, 2007
    Inventors: Hisayasu Kaneshiro, Hiroyuki Tsuji, Takashi Kikuchi
  • Publication number: 20070158869
    Abstract: A process for producing an adhesive film includes laminating an adhesive layer containing thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method, wherein a chemical dehydrator and a catalyst are contained in a precursor solution of the highly heat-resistant polyimide and/or a solution containing either the thermoplastic polyimide or a precursor of the thermoplastic polyimide.
    Type: Application
    Filed: November 17, 2006
    Publication date: July 12, 2007
    Inventors: Masami Yanagida, Hisayasu Kaneshiro, Takashi Kikuchi, Hiroyuki Tsuji
  • Publication number: 20070144669
    Abstract: A method for producing a heat-resistant flexible laminate in which appearance defects, such as wrinkles and waviness, can be prevented and dimensional stability can be improved is provided. A method for producing a flexible laminate including a heat-resistant adhesive film (A) and a metal foil (B) bonded to at least one surface of the heat-resistant adhesive film (A) includes a step of performing thermal lamination by passing the heat-resistant adhesive film (A) and the metal foil (B) between at least one pair of metal rollers through a protective film; a step of slowly cooling a laminate including the heat-resistant adhesive film (A), the metal foil (B), and the protective film; and a step of separating the protective film. The slow cooling step is preferably performed by providing a heating mechanism, in particular, a slow-cooling roller, of which temperature is set lower than the surface temperature of the metal rollers.
    Type: Application
    Filed: December 20, 2004
    Publication date: June 28, 2007
    Applicant: KANEKA CORPORATION
    Inventors: Takashi Kikuchi, Hiroyuki Tsuji
  • Publication number: 20070113972
    Abstract: Disclosed is a method of manufacturing a flexible laminate substrate having an improved appearance and dimensional stability after removal of a metal foil. Specifically disclosed is a method of manufacturing a flexible laminate substrate 5 wherein a metal foil 2 is bonded to at least one surface of a heat-resistant adhesive film 3. The method comprises a step wherein the heat-resistant adhesive film 3 and the metal foil 2 are thermally laminated between a pair of metal rolls 4 via a protective film 1, thereby forming a laminate 7 wherein the heat-resistant adhesive film 3, the metal foil 2, and the protective film 1 are bonded together, and another step wherein the protective film 1 is removed. The tension of the laminate 7 at the time when the protective film 1 is removed is higher than the tension of the laminate 7 before the removal of the protective film 1.
    Type: Application
    Filed: December 20, 2004
    Publication date: May 24, 2007
    Applicant: KANEKA CORPORATION
    Inventors: Takashi Kikuchi, Hiroyuki Tsuji
  • Publication number: 20070034326
    Abstract: It is an object of the present invention to provide a method for producing a flexible laminate in which the appearance and dimensional stability after removal of metal foils are improved. The present invention provides a method for producing a flexible laminate 5 including a heat-resistant adhesive film 3 and a metal foil 2 bonded to at least one surface of the heat-resistant adhesive film 3. The method includes a step of performing thermal lamination by passing the heat-resistant adhesive film 3 and the metal foil 2 between a pair of metal rolls 4 through a protective film 1, and a step of separating the protective film 1. The molecular orientation ratio of the protective film 1 is in a range of 1.0 to 1.7.
    Type: Application
    Filed: December 20, 2004
    Publication date: February 15, 2007
    Inventors: Takashi Kikuchi, Hiroyuki Tsuji
  • Publication number: 20070013083
    Abstract: Improvement in the mountability of a semiconductor device is aimed at. By preparing a package substrate which has a plurality of lands of NSMD structure, and the taking-out wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in the location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is aimed at.
    Type: Application
    Filed: July 10, 2006
    Publication date: January 18, 2007
    Inventors: Takashi Kikuchi, Koichi Kanemoto, Michiaki Sugiyama, Hiroshi Kawakubo
  • Patent number: 7149127
    Abstract: A flash memory card comprises a flash memory and a controller. The flash memory stores data. The controller detects frequency variation of an external clock signal inputted from a host to generate an internal clock signal. The controller controls the flash memory in response to the internal clock signal. The controller includes a clock-frequency control unit and a clock generator. The clock-frequency control unit detects frequency variation of the external clock signal to generate a detection signal. The clock generator receives the detection signal to generate the internal clock signal. A frequency of the internal clock signal varies corresponding to the frequency variation of the external clock signal.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: December 12, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Takashi Kikuchi
  • Patent number: 7140674
    Abstract: A vehicle body frame structure capable of realizing the connection to a side body in the form of structural connection. The vehicle body frame structure includes a side body whose skeleton is formed by a body panel that forms a side face of the vehicle body and a reinforcement member that is formed into a shape extending along the inside of the body panel and joined to the body panel, a front frame member that forms a front body disposed to form a shape extending from the side body to the front of the vehicle body, and an outer frame member joined to the front frame member from side of the vehicle body and secured to the reinforcement member by means of bolts extending through the body panel.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: November 28, 2006
    Assignees: Mitsubishi Jidosha Kogyo Kabushiki Kaisha, Mitsubishi Jidosha Engineering Kabushiki Kaisha
    Inventors: Shinsuke Miyoshi, Takashi Yakata, Takayuki Yatabe, Takashi Kikuchi, Keishi Goto, Koji Shibata
  • Publication number: 20060216502
    Abstract: A bonding sheet that can be bonded with a metal foil by thermal lamination and has excellent adhesiveness and reduced warpage, and a one-side metal-clad laminate are provided. A bonding sheet has an adhesive layer containing a thermoplastic resin disposed on one side of a heat resistant film and a non-adhesive layer containing a non-thermoplastic resin and a thermoplastic resin disposed on the other side of the heat resistant film. The ratio of the non-thermoplastic resin to the thermoplastic resin in the non-adhesive layer is 82/18 to 97/3 on a weight basis.
    Type: Application
    Filed: December 8, 2003
    Publication date: September 28, 2006
    Inventors: Takashi Kikuchi, Naoki Hase, Hiroyuki Tsuji, Yasuo Fushiki
  • Patent number: 7108359
    Abstract: A plurality of ink jet printer heads can be obtained from a single substrate through the following steps: a piezoelectric body forming step of cutting a piezoelectric member into a desired width to form a piezoelectirc body, a fitting recess forming step of forming a recess for fitting therein of the piezoelectric body in a base member, a substrate forming step of embedding the piezoelectric body into the recess to form a substrate, a grooving step of forming a plurality of desired grooves in parallel in the substrate, a head substrate forming step of forming an electrically conductive film on inner walls of the grooves to form a head substrate, an electroconductive pattern forming step of making connection to the electrically conductive film for the application of voltage thereto, a top plate joining step of joining a top plate to the head substrate to form a head substrate-top plate composite, a head forming step of cutting the head substrate-top plate composite at a desired position to form a head, and a n
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: September 19, 2006
    Assignee: Toshiba TEC Kabushiki Kaisha
    Inventors: Masashi Shimosato, Shinji Koizumi, Takashi Kikuchi
  • Patent number: 7083225
    Abstract: Coupling members include a first coupling portion (X) that couples rear quarter inner members to upper surfaces of rear suspension base members, a second coupling portion (Y) that couples upper surfaces of the rear suspension base members together, which are located on the right and the left in pairs, and a third coupling portion (Z) that joins the second coupling portion to couple the rear quarter inner members together, which are located on the right and the left in pairs, the coupling member being integrally formed, and there is formed a bulkhead structure in a portion surrounded by the first, second and third coupling portions.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: August 1, 2006
    Assignees: Mitsubishi Jidosha Kogyo Kabushiki Kaisha, Mitsubishi Jidosha Engineering Kabushiki Kaisha
    Inventors: Takashi Yakata, Hideki Honjo, Shinsuke Miyoshi, Takashi Kikuchi, Keishi Goto
  • Publication number: 20060054262
    Abstract: A method for manufacturing a heat resistant flexible laminate effectively enabling avoidance of not only visual defects but occurrence of dimensional changes, and a heat resistant flexible laminate are provided. In a process for laminating a heat resistant adhesive material and a metallic foil by thermal lamination, a film-like protective material is disposed between a pressurized surface and the metallic foil at the time of thermal lamination. At this time, coefficients of linear expansion in a temperature range of 200 degree C. to 300 degree C. of the heat resistant adhesive material and the protective material are within a range of a coefficient of linear expansion of the metallic foil ±10 ppm/degrees C. Thereby, occurrence of visual defects is not only effectively avoidable, but excellent dimensional change after etching may be exhibited.
    Type: Application
    Filed: October 9, 2003
    Publication date: March 16, 2006
    Inventors: Takashi Kikuchi, Naoki Hase, Hiroyuki Tsuji, Yasuo Fushiki
  • Patent number: 6910732
    Abstract: In a side body structure, a front reinforce is provided between a side body outer panel and a side body inner panel and also, a rear roof side reinforce is provided so as to couple the front reinforce to a rear pillar reinforce along the upper edge of an opening of a rear door, and vehicle body rigidity of the periphery of the opening of the rear door as well as the periphery of an opening of a front door is enhanced.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: June 28, 2005
    Assignees: Mitsubishi Jidosha Kogyo Kabushiki Kaisha, Mitsubishi Jidosha Engineering Kabushiki Kaisha
    Inventors: Shinsuke Miyoshi, Satoshi Arakawa, Takashi Yakata, Keishi Goto, Takashi Kikuchi
  • Publication number: 20050073896
    Abstract: A flash memory card comprises a flash memory and a controller. The flash memory stores data. The controller detects frequency variation of an external clock signal inputted from a host to generate an internal clock signal. The controller controls the flash memory in response to the internal clock signal. The controller includes a clock-frequency control unit and a clock generator. The clock-frequency control unit detects frequency variation of the external clock signal to generate a detection signal. The clock generator receives the detection signal to generate the internal clock signal. A frequency of the internal clock signal varies corresponding to the frequency variation of the external clock signal.
    Type: Application
    Filed: September 27, 2004
    Publication date: April 7, 2005
    Inventor: Takashi Kikuchi
  • Publication number: 20050047689
    Abstract: A sliding bearing 4 is constructed by an upper split bearing half 8 and a lower split bearing half 9. The upper split bearing half 8 has a sliding surface 8a, in which an oil groove 10 which allows an lubricating oil to flow therein is formed over the entire circumferential extent of the sliding surface 8a. The oil groove extends through a crush relief 8c to be open to a junction area 8b, and the oil groove has a bottom 10a which is formed so that a portion disposed toward the junction area as considered in the circumferential direction of the crush relief is located closer to the center of the upper split bearing half in comparison to a central portion. An ingress in large quantities of foreign particles within the oil groove onto the sliding surface of the sliding bearing and into a connecting rod bearing after passing through a lubricating oil feed passage is suppressed, and an oil leakage through the crush relief is reduced, allowing a lubricating oil pressure to be secured and augmented.
    Type: Application
    Filed: August 19, 2004
    Publication date: March 3, 2005
    Inventors: Masao Yamazaki, Masao Takahashi, Yasuhiro Hikita, Junichi Natsume, Toshimitsu Shiba, Takashi Kikuchi, Tatsuhiro Terada, Takashi Shimura