Patents by Inventor Takashi Mochizuki

Takashi Mochizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11774298
    Abstract: Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: October 3, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Melvin Verbaas, Kentaro Asakura, Takashi Mochizuki, Takahisa Mase, Nobutaka Yoshioka, Saki Matsuo
  • Publication number: 20230249732
    Abstract: The present disclosure provides a walking type electric transporter capable of being continuously used for a long time while preventing breakage of a storage battery due to a collision of cargo. A storage battery is accommodated in a box-shaped battery casing, the battery casing is detachably attached to a transporter main body portion, and the battery casing holds the storage battery while having spaces in such a manner that an upper portion and a front portion in an interior and an upper surface and a front surface of the storage battery are respectively separated from each other.
    Type: Application
    Filed: February 10, 2023
    Publication date: August 10, 2023
    Inventors: Yuya KATO, Takashi MOCHIZUKI, Koji SATO, Atsushi YOKOI, Akiko HATA, Keisuke MOMMA
  • Publication number: 20230149019
    Abstract: Provided is a filling liquid (161) for filling a balloon (170) for a method for occluding a tubular organ, including a microcapsule (162) in which a balloon-dissolving substance that dissolves the balloon (170) is encapsulated, wherein the microcapsule is destroyable by an ultrasonic beam; and a liquid that is harmless in the tubular organ and does not dissolve the balloon. Further provided is a method for terminating a tubular organ occlusion including a step of applying an ultrasonic beam to a balloon (170) that is filled with the filling liquid (161) and occludes a tubular organ, thereby breaking the balloon (170) as a result.
    Type: Application
    Filed: June 23, 2017
    Publication date: May 18, 2023
    Inventors: Toshio Chiba, Hiromasa Yamashita, Takashi Mochizuki, Kazuo Maruyama, Ryo Suzuki
  • Publication number: 20220311021
    Abstract: In a resin frame equipped MEA, an electrolyte membrane has an outer peripheral overlapping portion that overlaps with an inner peripheral portion of a resin frame member. An ion flow blocking member is provided on the outer peripheral overlapping portion. The ion flow blocking member blocks the flow of iron ions, copper ions, or the like. The ion flow blocking member is formed in an annular shape, and surrounds an electrical power generating region of the MEA. The ion flow blocking member can be provided in the form of a physical barrier or a chemical barrier.
    Type: Application
    Filed: February 27, 2022
    Publication date: September 29, 2022
    Inventors: Masaru ODA, Takaaki SHIKANO, Shohei TOYOTA, Tatsuro HARUKI, Takashi MOCHIZUKI
  • Patent number: 11396704
    Abstract: A substrate holder according to one embodiment of the present disclosure comprises a stage made of a dielectric material and configured to support a substrate; an attraction electrode provided in the stage and configured to electrostatically attract the substrate; and a heater configured to heat the stage. By applying a DC voltage to the attraction electrode, the substrate is electrostatically attached to a surface of the stage by a Johnsen-Rahbek force. The stage comprises an annular close contact area with which the substrate comes into close contact at a position corresponding to an outer periphery of the substrate on the surface of the stage; and a groove provided in an annular shape in a portion outside the close contact area, and a conductive deposition film formed by the raw material gas is accumulated in the groove.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: July 26, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Toshiaki Fujisato, Takashi Mochizuki, Daisuke Toriya, Kouki Suzuki, Hwajun Noh
  • Patent number: 11393911
    Abstract: A semiconductor device has: a semiconductor substrate; a drift layer of a first conductivity type; a well region of a second conductivity type; a high-concentration region of the second conductivity type, a source region of the first conductivity type; an insulating film provided on the drift layer; a first contact metal film in contact with the source region and the high-concentration region through a first opening provided in the insulating film; and a second contact metal film formed on a surface of the first contact metal film and contacting the high-concentration region through a second opening provided in the first contact metal film; a source electrode film formed on a surface of a contact metal layer including the first contact metal film and the second contact metal film. The first contact metal film includes titanium nitride, and the second contact metal film includes titanium.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: July 19, 2022
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Teppei Takahashi, Tetsuto Inoue, Akihiko Sugai, Takashi Mochizuki, Shunichi Nakamura
  • Patent number: 11150142
    Abstract: There is provided a thermocouple-fixing jig for fixing a thermocouple to a linear heater, the thermocouple-fixing jig comprising a first member and a second member configured to hold the linear heater therebetween, wherein the second member comprises a first holding portion and a second holding portion that hold a temperature detection part of the thermocouple.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: October 19, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hideaki Yamasaki, Takashi Mochizuki, Takeshi Itatani
  • Publication number: 20210247240
    Abstract: Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.
    Type: Application
    Filed: February 12, 2020
    Publication date: August 12, 2021
    Inventors: Melvin Verbaas, Kentaro Asakura, Takashi Mochizuki, Takahisa Mase, Nobutaka Yoshioka, Saki Matsuo
  • Patent number: 11069512
    Abstract: A film forming apparatus, for forming a film on a target substrate using a processing gas excited by plasma, includes: a processing chamber for accommodating the substrate; a mounting table for mounting thereon the substrate in the processing chamber; a gas injection member provided to face the substrate mounted on the mounting table and configured to inject the processing gas toward the target substrate on the mounting table; and a plasma generation unit for exciting the processing gas by generating plasma between the gas injection member and the mounting table. The gas injection member has a gas injection surface facing the mounting table. Gas injection holes are formed in the gas injection surface. A gas injection hole forming region, on the gas injection surface, where the gas injection holes are formed is smaller than a region on the gas injection surface which corresponds to the target substrate.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: July 20, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shinya Okabe, Takashi Mochizuki, Hideaki Yamasaki, Nagayasu Hiramatsu, Kazuki Dempoh
  • Patent number: 10998204
    Abstract: There is provided a method of processing a substrate by a substrate processing apparatus including a substrate mounting table having a refrigerant passage and a heater, and a chiller. The method includes adjusting a temperature of the substrate mounting table to a first temperature to process the substrate; and adjusting the temperature of the substrate mounting table to a second temperature higher than the first temperature to process the substrate. The temperature of the substrate mounting table becomes the second temperature by allowing the refrigerant at a first flow rate to flow from the chiller to the refrigerant passage and operating the heater. The temperature of the substrate mounting table becomes the first temperature by allowing the refrigerant at a second flow rate larger than the first flow rate to flow from the chiller to the refrigerant passage and operating the heater, or stopping an operation of the heater.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: May 4, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takashi Mochizuki, Toshiaki Fujisato
  • Publication number: 20210119008
    Abstract: A semiconductor device has: a semiconductor substrate; a drift layer of a first conductivity type; a well region of a second conductivity type; a high-concentration region of the second conductivity type, a source region of the first conductivity type; an insulating film provided on the drift layer; a first contact metal film in contact with the source region and the high-concentration region through a first opening provided in the insulating film; and a second contact metal film formed on a surface of the first contact metal film and contacting the high-concentration region through a second opening provided in the first contact metal film; a source electrode film formed on a surface of a contact metal layer including the first contact metal film and the second contact metal film. The first contact metal film includes titanium nitride, and the second contact metal film includes titanium.
    Type: Application
    Filed: April 11, 2018
    Publication date: April 22, 2021
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Teppei TAKAHASHI, Tetsuto INOUE, Akihiko SUGAI, Takashi MOCHIZUKI, Shunichi NAKAMURA
  • Publication number: 20210005493
    Abstract: When performing processing on a substrate in a plasma-free atmosphere, the substrate is reliably attracted to perform processing with high uniformity in the plane of the substrate. An apparatus includes a DC power source and a processing gas supply part. The DC power source has a positive electrode connected to one of an electrode of an electrostatic chuck and a conductive member, and a negative electrode connected to the other of the electrode and the conductive member, and attracts the substrate to a dielectric layer of the electrostatic chuck by electrostatic attraction force generated by applying voltage between the conductive member located at a processing position and the electrode in a state in which plasma is not formed inside a processing container. The processing gas supply part performs processing by supplying a processing gas to the substrate in a state in which the substrate is attracted to the dielectric layer.
    Type: Application
    Filed: October 12, 2018
    Publication date: January 7, 2021
    Inventors: Toshiaki FUJISATO, Tadahiro ISHIZAKA, Takashi MOCHIZUKI, Daisuke TORIYA
  • Publication number: 20200361270
    Abstract: This lift axle device comprises: a first air spring which corresponds to a first axle; a second air spring which corresponds to a second axle that reciprocates between a down position and lift position; an air bellows; a pneumatic circuit which has a solenoid valve; and a control circuit. The control circuit controls the supply of electric power to the solenoid valve. If the pressure transitions to less than a first pressure, the second axle is placed in the lift position. If the pressure transitions to at least a second pressure, the second axle is placed in the down position. If the pressure transitions to at least the first pressure and less than the second pressure, the second axle is caused to maintain the position thereof.
    Type: Application
    Filed: August 21, 2018
    Publication date: November 19, 2020
    Inventors: Takashi MOCHIZUKI, Hiroyuki YOZA
  • Publication number: 20200165723
    Abstract: A substrate holder according to one embodiment of the present disclosure comprises a stage made of a dielectric material and configured to support a substrate; an attraction electrode provided in the stage and configured to electrostatically attract the substrate; and a heater configured to heat the stage. By applying a DC voltage to the attraction electrode, the substrate is electrostatically attached to a surface of the stage by a Johnsen-Rahbek force. The stage comprises an annular close contact area with which the substrate comes into close contact at a position corresponding to an outer periphery of the substrate on the surface of the stage; and a groove provided in an annular shape in a portion outside the close contact area, and a conductive deposition film formed by the raw material gas is accumulated in the groove.
    Type: Application
    Filed: November 27, 2019
    Publication date: May 28, 2020
    Inventors: Toshiaki FUJISATO, Takashi MOCHIZUKI, Daisuke TORIYA, Kouki SUZUKI, Hwajun NOH
  • Publication number: 20190355597
    Abstract: There is provided a method of processing a substrate by a substrate processing apparatus including a substrate mounting table having a refrigerant passage and a heater, and a chiller. The method includes adjusting a temperature of the substrate mounting table to a first temperature to process the substrate; and adjusting the temperature of the substrate mounting table to a second temperature higher than the first temperature to process the substrate. The temperature of the substrate mounting table becomes the second temperature by allowing the refrigerant at a first flow rate to flow from the chiller to the refrigerant passage and operating the heater. The temperature of the substrate mounting table becomes the first temperature by allowing the refrigerant at a second flow rate larger than the first flow rate to flow from the chiller to the refrigerant passage and operating the heater, or stopping an operation of the heater.
    Type: Application
    Filed: May 15, 2019
    Publication date: November 21, 2019
    Inventors: Takashi MOCHIZUKI, Toshiaki FUJISATO
  • Patent number: 10471420
    Abstract: The present invention provides a cation exchange resin, and a cation exchange membrane and an electrolyte membrane for a fuel cell using the same. The cation exchange resin comprises a divalent hydrophobic unit; and a divalent hydrophilic unit having divalent hydrophilic groups which are repeated via carbon-carbon bond. The divalent hydrophilic groups being composed of one aromatic ring, or being composed of a plurality of aromatic rings which are bonded to each other via a divalent hydrocarbon group, a divalent silicon-containing group, a divalent nitrogen-containing group, a divalent phosphorus-containing group, a divalent oxygen-containing group, a divalent sulfur-containing group, or carbon-carbon bond, and at least one of the aromatic rings having a cation exchange group; wherein the hydrophobic unit and the hydrophilic unit are bonded to each other via carbon-carbon bond.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: November 12, 2019
    Assignees: UNIVERSITY OF YAMANASHI, TAKAHATA PRECISION CO., LTD.
    Inventors: Kenji Miyatake, Makoto Uchida, Jyunpei Miyake, Takashi Mochizuki, Hideaki Ono, Manai Shimada, Naoki Yokota, Natsumi Yoshimura
  • Publication number: 20190301947
    Abstract: There is provided a thermocouple-fixing jig for fixing a thermocouple to a linear heater, the thermocouple-fixing jig comprising a first member and a second member configured to hold the linear heater therebetween, wherein the second member comprises a first holding portion and a second holding portion that hold a temperature detection part of the thermocouple.
    Type: Application
    Filed: April 1, 2019
    Publication date: October 3, 2019
    Inventors: Hideaki YAMASAKI, Takashi MOCHIZUKI, Takeshi ITATANI
  • Patent number: 10378782
    Abstract: An outdoor unit (100, 110), comprising a housing (1, 20) having fans (2) provided thereon and a compressor (4) and heat exchanger (3-1, 3-2, 23-1, 23-2) disposed on a base (10, 210) thereof; a left-right pair of side covers (8, 28, 9, 29) each being bent and having two surfaces, one surface covering a portion of a side of housing (1, 20), and the other surface covering a portion of the front of the housing (1, 20); a controller housing (7) fixed to the upper section of the surface of at least one side cover (8, 28, 9, 29), of said left-right pair of said covers (8, 28, 9, 29), that covers a portion of the front of the housing (1, 20), said controller housing (7) being fixed at a height allowing the compressor (4) to be moved into and out of the housing unobstructed.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: August 13, 2019
    Assignee: Hitachi-Johnson Controls Air Conditioning, Inc.
    Inventors: Takumi Kamiaka, Masayoshi Murofushi, Atsuhiko Fukasawa, Shuntaro Inoue, Takashi Mochizuki
  • Publication number: 20180245805
    Abstract: An outdoor unit (100, 110), comprising a housing (1, 20) having fans (2) provided thereon and a compressor (4) and heat exchanger (3-1, 3-2, 23-1, 23-2) disposed on a base (10, 210) thereof; a left-right pair of side covers (8, 28, 9, 29) each being bent and having two surfaces, one surface covering a portion of a side of housing (1, 20), and the other surface covering a portion of the front of the housing (1, 20); a controller housing (7) fixed to the upper section of the surface of at least one side cover (8, 28, 9, 29), of said left-right pair of said covers (8, 28, 9, 29), that covers a portion of the front of the housing (1, 20), said controller housing (7) being fixed at a height allowing the compressor (4) to be moved into and out of the housing unobstructed.
    Type: Application
    Filed: September 9, 2016
    Publication date: August 30, 2018
    Inventors: Takumi KAMIAKA, Masayoshi MUROFUSHI, Atsuhiko FUKASAWA, Shuntaro INOUE, Takashi MOCHIZUKI
  • Publication number: 20180178210
    Abstract: A cation exchange resin having improved chemical properties and mechanical properties, and a cation exchange membrane and an electrolyte membrane for a fuel cell using the same are provided. A cation exchange resin is used, the cation exchange resin comprising: a divalent hydrophobic unit; and a divalent hydrophilic unit having divalent hydrophilic groups which are repeated via carbon-carbon bond, the divalent hydrophilic groups being composed of one aromatic ring, or being composed of a plurality of aromatic rings which are bonded to each other via a divalent hydrocarbon group, a divalent silicon-containing group, a divalent nitrogen-containing group, a divalent phosphorus-containing group, a divalent oxygen-containing group, a divalent sulfur-containing group, or carbon-carbon bond, at least one of the aromatic rings having a cation exchange group; wherein the hydrophobic unit and the hydrophilic unit are bonded to each other via carbon-carbon bond.
    Type: Application
    Filed: June 29, 2016
    Publication date: June 28, 2018
    Applicants: University of Yamanashi, Takahata Precision Japan Co., Ltd.
    Inventors: Kenji MIYATAKE, Makoto UCHIDA, Jyunpei MIYAKE, Takashi MOCHIZUKI, Hideaki ONO, Manai SHIMADA, Naoki YOKOTA, Natsumi YOSHIMURA