Patents by Inventor Takashi Mochizuki

Takashi Mochizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090229525
    Abstract: The size of drops of liquid raw material spouted into a vaporization chamber is controlled so as to suppress any dispersion of drop size, thereby attaining assured vaporization of the drops. The vaporizer comprises raw material liquid chamber 410 into which a liquid raw material is fed at given pressure; multiple raw material spout nozzles 420 for spouting the liquid raw material stored in the raw material liquid chamber; vaporization chamber 430 for vaporizing the liquid raw material spouted from the multiple raw material spout nozzles so as to form a source gas; and piezoelectric device 440 for periodically changing the volume of internal space of the raw material liquid chamber so as to apply spout pressure to the liquid raw material.
    Type: Application
    Filed: April 17, 2009
    Publication date: September 17, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Takashi MOCHIZUKI
  • Patent number: 7577167
    Abstract: In a method for adaptive transmission timing control, the overlooking of a base path at the side of the base station that occurs when the transmission timing offset amount changes to the extent of falling outside the current delay-profile calculation range, and the side of the mobile station fails to demodulate the control information that contains the transmission timing offset amount, is prevented. A limit is put on the transmission timing offset amount applied in a single transmission timing control iteration. Together with setting the transmission timing offset value such that the main component of the delay profile calculated from the pilot signal transmitted with offset transmission timing falls within the time range of when the current delay profile was calculated, the time range for calculating the next delay profile is shifted such that a delay profile calculated from the pilot signal transmitted with offset transmission timing falls within the shifted range, starting at the earliest component.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: August 18, 2009
    Assignee: NEC Corporation
    Inventors: Shingo Kikuchi, Takashi Mochizuki
  • Patent number: 7542408
    Abstract: A receiver of a multicarrier communication system capable of reducing inter-subcarrier interfering signals is to be provided. Receive signals received by a receiving antenna are amplified by a receiving amplifier, subjected to quadrature demodulation by multipliers with respect to the respective subcarriers, and band-limited by lowpass filters. The signals band-limited by the lowpass filters are converted into digital signals by A/D converters at a sampling frequency fs. With respect to the receive signals converted into digital signals, interfering signals leaking between subcarriers are estimated by using A/D converted by the A/D converters and are canceled. The receive signals reduced in interfering signals are multiplexed into a single sequence by a multiplexer, and decoded by a decoder into output signals.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: June 2, 2009
    Assignee: NEC Corporation
    Inventor: Takashi Mochizuki
  • Publication number: 20090037506
    Abstract: A FFT circuit performs M×R×Q-point fast Fourier transform of received signals, wherein M is an over-sampling rate of the received signals, Q is a chip repetition unit and R is a chip repetition rate. A weighting multiplier multiplies a frequency component having frequency component number equal to an integral multiple of R among M×R×Q frequency components output from the fast Fourier transform circuit by a weighting coefficient for propagation channel equalization, and multiplies the frequency components other than the integral multiple of R. An inverse fast Fourier transform circuit receives outputs of weighting multiplier and performs inverse fast Fourier transform of the frequency component having a frequency number equal to the integral multiple of R.
    Type: Application
    Filed: February 7, 2006
    Publication date: February 5, 2009
    Applicant: NEC
    Inventor: Takashi Mochizuki
  • Publication number: 20080261608
    Abstract: A radio resource allocation method is provided wherein one of a plurality of mobile stations is allocated to one or each of a plurality of frequency blocks. The method comprises: (a) calculating allocation index representing transmission quality of each of said mobile stations in said each of frequency blocks; extracting for said each of frequency blocks, a mobile station having a largest allocation index as a candidate mobile station; (c) extracting a mobile station having a largest allocation index in all of said frequency blocks, as a target mobile station for allocation; and (d) extracting, from among said frequency blocks, frequency block(s) for which said candidate mobile station matches said target mobile station, as candidate frequency block(s).
    Type: Application
    Filed: April 16, 2008
    Publication date: October 23, 2008
    Applicant: NEC CORPORATION
    Inventor: Takashi MOCHIZUKI
  • Patent number: 7333812
    Abstract: During soft handover, base station selector 22 selects the base station that is transmitting the downlink signal with the best downlink reception quality, and notifies the base stations of the ID of this base station, so as to cause only the selected base station to transmit user data. Downlink signal weight decision circuit 23 estimates base stations that have a likelihood of transmitting user data. Downlink TPC command decision circuit 25 uses the downlink signal from the base stations that have a likelihood of transmitting user data, to decide whether the transmission power of the base stations is excessive or insufficient, and to instruct the base stations to increase or decrease their transmission power. Data demodulator 27 uses the downlink signals from base stations that have a likelihood of transmitting user data to demodulate the user data.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: February 19, 2008
    Assignee: NEC Corporation
    Inventor: Takashi Mochizuki
  • Patent number: 7176052
    Abstract: A method of formation of a capacitor forming part of an electric circuit when producing a circuit board, consisting of forming a valve metal bottom electrode layer and a valve metal oxide dielectric layer on the same, then integrally forming a solid electrolyte layer comprised of an organic semiconductor and a top electrode layer comprised of metal on the same, this integral formation step consisting of the step of holding one surface of metal foil for the top electrode at a bonding wedge and making the other surface of the metal foil carry a powder of the organic semiconductor by compression bonding and heating and the step of compression bonding the organic semiconductor powder carried by compression bonding at the dielectric layer by a bonding wedge through metal foil, whereby a solid electrolyte layer comprised of an organic semiconductor sandwiched between the metal foil and dielectric layer and closely bonded with the two is formed, a capacitor built into a circuit board, a circuit board including a cap
    Type: Grant
    Filed: March 2, 2005
    Date of Patent: February 13, 2007
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hiroko Koike, Takashi Mochizuki, Mitsutoshi Higashi
  • Publication number: 20070025326
    Abstract: In a method for adaptive transmission timing control, the overlooking of a base path at the side of the base station that occurs when the transmission timing offset amount changes to the extent of falling outside the current delay-profile calculation range, and the side of the mobile station fails to demodulate the control information that contains the transmission timing offset amount, is prevented. A limit is put on the transmission timing offset amount applied in a single transmission timing control iteration. Together with setting the transmission timing offset value such that the main component of the delay profile calculated from the pilot signal transmitted with offset transmission timing falls within the time range of when the current delay profile was calculated, the time range for calculating the next delay profile is shifted such that a delay profile calculated from the pilot signal transmitted with offset transmission timing falls within the shifted range, starting at the earliest component.
    Type: Application
    Filed: July 26, 2006
    Publication date: February 1, 2007
    Applicant: NEC Corporation
    Inventors: Shingo Kikuchi, Takashi Mochizuki
  • Patent number: 7169195
    Abstract: In a capacitor 10, a first electrode 21, a dielectric layer 23, a solid electrolytic layer 50 and a second electrode 31 are provided. In a manufacturing process, the dielectric layer 23 and a first solid electrolytic layer 24 formed by a chemical polymerization film are provided on the first electrode 21 side, while a second solid electrolytic layer 32 formed by an electrolytic polymerization film is provided on the second electrode 31 side. Then, the solid electrolytic layers are bonded to each other.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: January 30, 2007
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Mitsutoshi Higashi, Takashi Mochizuki
  • Patent number: 7133464
    Abstract: A transmission apparatus includes a filter, multiplier, and controller. The filter reduces leakage power outside the transmission signal band. In the filter, a first attenuation amount more than a predetermined amount or a second attenuation amount not more than the predetermined amount is selectively set in a range higher than the transmission signal band. The multiplier modulates the transmission signal output from the filter. The controller sets one of the first and second attenuation amounts in the filter in accordance with the use situation of a band adjacent to the transmission signal band.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: November 7, 2006
    Assignee: NEC Corporation
    Inventor: Takashi Mochizuki
  • Patent number: 7063129
    Abstract: A heat transport device has an evaporator and a condenser connected through a vapor phase channel and a liquid phase channel and has wicks of the condenser arranged symmetrically around an axis orthogonal to the direction of gravity. The flow of fluid in a liquid phase inside the wicks is not disrupted even when the heat transport device is tilted at any angle relative to the horizontal surface or the vertical surface.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: June 20, 2006
    Assignee: Sony Corporation
    Inventors: Takuya Makino, Takashi Mochizuki, Kazuhito Hori, Kazuyoshi Kiga, Noriaki Sakata
  • Patent number: 7054141
    Abstract: A capacitor includes a dielectric layer, a manganese dioxide layer, an organic solid electrolyte layer, and a carbon paste layer that are stacked in this order between a first electrode, which serves as an anode, and a second electrode, which serves as a cathode. Between the first electrode and the second electrode, an insulating resin layer is formed in the shape of a rectangular frame so as to surround the organic solid electrolyte layer. A lower end portion of the resin layer is fixed to the manganese dioxide layer while an upper end portion of the resin layer is fixed to the second electrode 16. Therefore, complete sealing is established between the first electrode and the second electrode in the outer peripheral end face of the capacitor.
    Type: Grant
    Filed: June 17, 2005
    Date of Patent: May 30, 2006
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Takashi Kurihara, Mitsutoshi Higashi, Takashi Mochizuki
  • Patent number: 6993294
    Abstract: A HSDPA type mobile communication system includes a base station and a mobile station. The base station sets the uplink control channel with the mobile station to transmit a pilot signal. The mobile station measures a reception quality of the pilot signal to transmit the quality information to the base station using the uplink quality control channel. The base station performs transmission control of data for the mobile station using the quality information. The mobile station is set to perform control of starting and stopping transmission of the quality information so that the quality information is transmitted only as required. Therefore, power consumption in the mobile station can be reduced, interference wave power in the uplink can be reduced, and capacity of the uplink can be increased.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: January 31, 2006
    Assignee: NEC Corporation
    Inventors: Takahiro Nobukiyo, Toshifumi Sato, Motoya Iwasaki, Takashi Mochizuki, Naoto Ishii, Kojiro Hamabe
  • Patent number: 6980416
    Abstract: In a capacitor 10, a first electrode 21, a valve metal layer 22, a dielectric layer 23, a chemical polymerization film 24 (a first solid electrolytic layer), a conductive organic material layer 61, an electrolytic polymerization film 25 (a second solid electrolytic layer) and a second electrode 31 are provided on a base material 11, and the conductive organic material layer 61 is obtained by applying and caking a paste-like conductive organic material 60 onto the chemical polymerization film 24.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: December 27, 2005
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Mitsutoshi Higashi, Takashi Mochizuki
  • Publication number: 20050280978
    Abstract: A capacitor includes a dielectric layer, a manganese dioxide layer, an organic solid electrolyte layer, and a carbon paste layer that are stacked in this order between a first electrode, which serves as an anode, and a second electrode, which serves as a cathode. Between the first electrode and the second electrode, an insulating resin layer is formed in the shape of a rectangular frame so as to surround the organic solid electrolyte layer. A lower end portion of the resin layer is fixed to the manganese dioxide layer while an upper end portion of the resin layer is fixed to the second electrode 16. Therefore, complete sealing is established between the first electrode and the second electrode in the outer peripheral end face of the capacitor.
    Type: Application
    Filed: June 17, 2005
    Publication date: December 22, 2005
    Applicant: Shinko Electric industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Takashi Kurihara, Mitsutoshi Higashi, Takashi Mochizuki
  • Publication number: 20050152097
    Abstract: In a capacitor 10, a first electrode 21, a dielectric layer 23, a solid electrolytic layer 50 and a second electrode 31 are provided. In a manufacturing process, the dielectric layer 23 and a first solid electrolytic layer 24 formed by a chemical polymerization film are provided on the first electrode 21 side, while a second solid electrolytic layer 32 formed by an electrolytic polymerization film is provided on the second electrode 31 side. Then, the solid electrolytic layers are bonded to each other.
    Type: Application
    Filed: January 7, 2005
    Publication date: July 14, 2005
    Applicant: SHINKO ELECTRIC INDUSTRIES, CO., LTD.
    Inventors: Hideaki Sakaguchi, Mitsutoshi Higashi, Takashi Mochizuki
  • Publication number: 20050152098
    Abstract: In a capacitor 10, a first electrode 21, a valve metal layer 22, a dielectric layer 23, a chemical polymerization film 24 (a first solid electrolytic layer), a conductive organic material layer 61, an electrolytic polymerization film 25 (a second solid electrolytic layer) and a second electrode 31 are provided on a base material 11, and the conductive organic material layer 61 is obtained by applying and caking a paste-like conductive organic material 60 onto the chemical polymerization film 24.
    Type: Application
    Filed: January 7, 2005
    Publication date: July 14, 2005
    Applicant: SHINKO ELECTRIC INDUSTRIES, CO., LTD.
    Inventors: Hideaki Sakaguchi, Mitsutoshi Higashi, Takashi Mochizuki
  • Publication number: 20050144767
    Abstract: A method of formation of a capacitor forming part of an electric circuit when producing a circuit board, consisting of forming a valve metal bottom electrode layer and a valve metal oxide dielectric layer on the same, then integrally forming a solid electrolyte layer comprised of an organic semiconductor and a top electrode layer comprised of metal on the same, this integral formation step consisting of the step of holding one surface of metal foil for the top electrode at a bonding wedge and making the other surface of the metal foil carry a powder of the organic semiconductor by compression bonding and heating and the step of compression bonding the organic semiconductor powder carried by compression bonding at the dielectric layer by a bonding wedge through metal foil, whereby a solid electrolyte layer comprised of an organic semiconductor sandwiched between the metal foil and dielectric layer and closely bonded with the two is formed, a capacitor built into a circuit board, a circuit board including a cap
    Type: Application
    Filed: March 2, 2005
    Publication date: July 7, 2005
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Hiroko Koike, Takashi Mochizuki, Mitsutoshi Higashi
  • Patent number: 6890792
    Abstract: A method of formation of a capacitor forming part of an electric circuit when producing a circuit board, consisting of forming a valve metal bottom electrode layer and a valve metal oxide dielectric layer on the same, then integrally forming a solid electrolyte layer comprised of an organic semiconductor and a top electrode layer comprised of metal on the same, this integral formation step consisting of the step of holding one surface of metal foil for the top electrode at a bonding wedge and making the other surface of the metal foil carry a powder of the organic semiconductor by compression bonding and heating and the step of compression bonding the organic semiconductor powder carried by compression bonding at the dielectric layer by a bonding wedge through metal foil, whereby a solid electrolyte layer comprised of an organic semiconductor sandwiched between the metal foil and dielectric layer and closely bonded with the two is formed, a capacitor built into a circuit board, a circuit board including a cap
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: May 10, 2005
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hiroko Koike, Takashi Mochizuki, Mitsutoshi Higashi
  • Patent number: 6875177
    Abstract: An ultrasonic diagnostic apparatus forms a three-dimensional echo data acquisition space. A beam address array is composed of a plurality of ultrasonic beam addresses constituting a three-dimensional echo data acquisition space. The beam address array is divided into a plurality of address groups, and address scanning is repeated twice for each of the address groups. Thus, when a differential operation or the like of two data items obtained at the same beam position is performed, the time interval between acquisition of the two data pieces becomes short. The existence or behavior of an ultrasonic contrast agent within tissue of a living body is displayed as a three-dimensional differential image.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: April 5, 2005
    Assignee: Aloka Co., Ltd.
    Inventor: Takashi Mochizuki