Abstract: A semiconductor wafer has an edge support ring around a perimeter of the semiconductor wafer and conductive layer formed over a surface of the semiconductor wafer within the edge support ring. A first stencil is disposed over the edge support ring with first openings aligned with the conductive layer. The first stencil includes a horizontal portion over the edge support ring, and a step-down portion extending the first openings to the conductive layer formed over the surface of the semiconductor wafer. The horizontal portion may have a notch with the edge support ring disposed within the notch. A plurality of bumps is dispersed over the first stencil to occupy the first openings over the conductive layer. A second stencil is disposed over the edge support ring with second openings aligned with the conductive layer to deposit a flux material in the second openings over the conductive layer.

Abstract: A semiconductor wafer has an edge support ring around a perimeter of the semiconductor wafer and conductive layer formed over a surface of the semiconductor wafer within the edge support ring. A first stencil is disposed over the edge support ring with first openings aligned with the conductive layer. The first stencil includes a horizontal portion over the edge support ring, and a step-down portion extending the first openings to the conductive layer formed over the surface of the semiconductor wafer. The horizontal portion may have a notch with the edge support ring disposed within the notch. A plurality of bumps is dispersed over the first stencil to occupy the first openings over the conductive layer. A second stencil is disposed over the edge support ring with second openings aligned with the conductive layer to deposit a flux material in the second openings over the conductive layer.

Abstract: A method of forming semiconductor devices includes providing a wafer having a first side and second side, electrically conductive pads at the second side, and an electrically insulative layer at the second side with openings to the pads. The first side of the wafer is background to a desired thickness and an electrically conductive layer is deposited thereon. Nickel layers are simultaneously electrolessly deposited over the electrically conductive layer and over the pads, and diffusion barrier layers are then simultaneously deposited over the nickel layers. Another method of forming semiconductor devices includes depositing backmetal (BM) layers on the electrically conductive layer including a titanium layer, a nickel layer, and/or a silver layer. The BM layers are covered with a protective coating and a nickel layer is electrolessly deposited over the pads. A diffusion barrier layer is deposited over the nickel layer over the pads, and the protective coating is removed.

Abstract: An inductor array chip includes a magnetic laminated body and a plurality of inductors. The magnetic laminated body includes a plurality of stacked magnetic layers. The plurality of inductors are arranged inside the magnetic laminated body. The inductance of a first inductor differs from the inductance of a second inductor. The inductors include a plurality of coil-shaped conductors and via-hole conductors. The plurality of coil-shaped conductors are arranged between the magnetic layers. The via-hole conductors electrically connect the plurality of coil-shaped conductors. The inductors include a plurality of inductors in which the section sizes of the coil-shaped conductors differ from one another.

Abstract: A power supply module includes a substrate, a switching control IC and a coil. The coil includes a plurality of metal posts, first ends of which are mounted on a first surface of the substrate, wiring conductors that are in conductive contact with the first ends of the metal posts, and post connection conductors that are in conductive contact with second ends of the metal posts. The power supply module further includes a magnetic core that strengthens magnetic flux generated by the coil, and a sealing resin that seals the metal posts and the magnetic core.

Abstract: In a common-mode choke coil, first annular conductors are helically defined from the lower layer to the upper layer, and first annular conductors are helically defined from the upper layer to the lower layer. Further, second annular conductors are helically defined from the lower layer to the upper layer, and second annular conductors are helically defined from the upper layer to the lower layer. The first annular conductors and the second annular conductors are disposed alternately in a lamination direction. The first annular conductors and the second annular conductors are disposed such that substantial portions of the annular conductors adjacent to each other in the layer direction do not overlap in a planar view. This structure achieves a compact common-mode choke coil with which the loss of normal-mode signals is small, and which is highly capable of removing common-mode noise.

Abstract: A method of forming semiconductor devices includes providing a wafer having a first side and second side, electrically conductive pads at the second side, and an electrically insulative layer at the second side with openings to the pads. The first side of the wafer is background to a desired thickness and an electrically conductive layer is deposited thereon. Nickel layers are simultaneously electrolessly deposited over the electrically conductive layer and over the pads, and diffusion barrier layers are then simultaneously deposited over the nickel layers. Another method of forming semiconductor devices includes depositing backmetal (BM) layers on the electrically conductive layer including a titanium layer, a nickel layer, and/or a silver layer. The BM layers are covered with a protective coating and a nickel layer is electrolessly deposited over the pads. A diffusion barrier layer is deposited over the nickel layer over the pads, and the protective coating is removed.

Abstract: An antenna device includes a multilayer body as a base body, an antenna coil, and a capacitor chip. The multilayer body includes a magnetic layer including a first main surface and a second main surface, a first non-magnetic layer provided on the first main surface of the magnetic layer, and a second non-magnetic layer provided on the second main surface of the magnetic layer. The antenna coil includes a first coil pattern provided with the first non-magnetic layer and a second coil pattern provided with the second non-magnetic layer. The capacitor chip is connected to the antenna coil and provided on the second non-magnetic layer.

Abstract: A composite electronic component with a built-in coil is provided which can be produced inexpensively, which can effectively increase insulating reliability, and which has the antistatic function. Coil wirings are disposed inside a sintered body that is formed by stacking a plurality of ferrite layers, which are fired as an integral unit. Voltage nonlinear members are incorporated in the sintered body at a different height position from those of the coil wirings. First inner electrodes and second inner electrodes are disposed in opposing relation with the voltage nonlinear members interposed therebetween. A magnetic circuit forming portion is constituted by a part of the ferrite layers and the coil wirings in a portion in which the coil wirings are arranged, and an antistatic portion is constituted in a portion in which the remaining ferrite layers, the voltage nonlinear members, and the first and second inner electrodes are arranged.

Abstract: An ESD protection device includes an alumina multilayer substrate, a hollow portion, a discharge electrode pair, discharge-assisting electrodes, and a vitreous substance. The hollow portion is disposed inside of the alumina multilayer substrate. The electrodes of the discharge electrode pair are disposed opposite to each other at an interface between the hollow portion and the alumina multilayer substrate. The discharge-assisting electrodes are disposed dispersedly between the opposite electrodes of the discharge electrode pair. The vitreous substance covers the discharge-assisting electrodes in the inside of the hollow portion. A trial discharge is executed so as to induce creepage discharge between the electrodes of the discharge electrode pair in advance.

Abstract: In a common-mode choke coil, first annular conductors are helically defined from the lower layer to the upper layer, and first annular conductors are helically defined from the upper layer to the lower layer. Further, second annular conductors are helically defined from the lower layer to the upper layer, and second annular conductors are helically defined from the upper layer to the lower layer. The first annular conductors and the second annular conductors are disposed alternately in a lamination direction. The first annular conductors and the second annular conductors are disposed such that substantial portions of the annular conductors adjacent to each other in the layer direction do not overlap in a planar view. This structure achieves a compact common-mode choke coil with which the loss of normal-mode signals is small, and which is highly capable of removing common-mode noise.

Abstract: To ensure a sufficient communication distance and to concurrently suppress a conductor loss, a coil antenna includes a magnetic core including a first peripheral surface including at least a first principal surface, a first coil conductor located on the first principal surface and wound around a predetermined winding axis, a first base material layer stacked on the first principal surface, including at least a first surface parallel or substantially parallel to the first principal surface, and made of a material having a lower magnetic permeability than the magnetic core, and a second coil conductor located on at least the first surface. Opposite ends of the second coil conductor are coupled to the first coil conductor on the first principal surface, and a direction in which a current flows through the first coil conductor on the first principal surface is substantially the same as a direction in which a current flows through the second coil conductor on the first surface.

Abstract: In a common-mode choke coil, first annular conductors are helically defined from the lower layer to the upper layer, and first annular conductors are helically defined from the upper layer to the lower layer. Further, second annular conductors are helically defined from the lower layer to the upper layer, and second annular conductors are helically defined from the upper layer to the lower layer. The first annular conductors and the second annular conductors are disposed alternately in a lamination direction. The first annular conductors and the second annular conductors are disposed such that substantial portions of the annular conductors adjacent to each other in the layer direction do not overlap in a planar view. This structure achieves a compact common-mode choke coil with which the loss of normal-mode signals is small, and which is highly capable of removing common-mode noise.

Abstract: To ensure a sufficient communication distance and to concurrently suppress a conductor loss, a coil antenna includes a magnetic core including a first peripheral surface including at least a first principal surface, a first coil conductor located on the first principal surface and wound around a predetermined winding axis, a first base material layer stacked on the first principal surface, including at least a first surface parallel or substantially parallel to the first principal surface, and made of a material having a lower magnetic permeability than the magnetic core, and a second coil conductor located on at least the first surface. Opposite ends of the second coil conductor are coupled to the first coil conductor on the first principal surface, and a direction in which a current flows through the first coil conductor on the first principal surface is substantially the same as a direction in which a current flows through the second coil conductor on the first surface.

Abstract: A composite electronic component with a built-in coil is provided which can be produced inexpensively, which can effectively increase insulating reliability, and which has the antistatic function. Coil wirings are disposed inside a sintered body that is formed by stacking a plurality of ferrite layers, which are fired as an integral unit. Voltage nonlinear members are incorporated in the sintered body at a different height position from those of the coil wirings. First inner electrodes and second inner electrodes are disposed in opposing relation with the voltage nonlinear members interposed therebetween. A magnetic circuit forming portion is constituted by a part of the ferrite layers and the coil wirings in a portion in which the coil wirings are arranged, and an antistatic portion is constituted in a portion in which the remaining ferrite layers, the voltage nonlinear members, and the first and second inner electrodes are arranged.

Abstract: A X-ray waveguide includes a core for guiding X-rays having a wavelength band in which the real part of refractive index of material is smaller than 1 and a cladding for confining the X-rays in the core. The core has a one-dimensional periodic structure in which a plurality of layers respectively formed of inorganic materials having different real parts of refractive index are periodically laminated. The core and the cladding are configured so that a critical angle for total reflection for the X-rays at an interface between the core and the cladding is larger than a Bragg angle due to a periodicity of the one-dimensional periodic structure. A critical angle for total reflection for the X-rays at an interface between layers in the one-dimensional periodic structure is smaller than the Bragg angle due to the periodicity of the one-dimensional periodic structure.

Abstract: An inductor array chip includes a magnetic laminated body and a plurality of inductors. The magnetic laminated body includes a plurality of stacked magnetic layers. The plurality of inductors are arranged inside the magnetic laminated body. The inductance of a first inductor differs from the inductance of a second inductor. The inductors include a plurality of coil-shaped conductors and via-hole conductors. The plurality of coil-shaped conductors are arranged between the magnetic layers. The via-hole conductors electrically connect the plurality of coil-shaped conductors. The inductors include a plurality of inductors in which the section sizes of the coil-shaped conductors differ from one another.

Abstract: An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced and a method of manufacturing the same. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A first supporting body 5 having a penetration hole 6 penetrating it from the front surface to the back surface is attached to a front surface of a semiconductor substrate 2 with an adhesive layer 4 being interposed therebetween. A device element 1 and wiring layers 3 are formed on the front surface of the semiconductor substrate 2. A second supporting body 7 is attached to the first supporting body 5 with an adhesive layer 8 being interposed therebetween so as to cover the penetration hole 6. The device element 1 is sealed in a cavity 9 surrounded by the semiconductor substrate 2, the first supporting body 5 and the second supporting body 7.

Abstract: An X-ray imaging apparatus acquiring a differential phase contrast image of a test object without using a light-shielding mask for X-ray. The apparatus includes an X-ray source, a splitting element configured to spatially divide an X-ray emitted from an X-ray source and a scintillator configured to emit light when a divided X-ray beam divided at the splitting element is incident on the scintillator. The apparatus also includes a light-transmission limiting unit configured to limit transmitting amount of the light emitted from the scintillator and a plurality of light detectors each configured to detect the amount of light that has transmitted through the light-transmission limiting unit. The light-transmission limiting unit is configured such that a light intensity detected at each of the light detectors changes in response to a change in an incident position of the X-ray beam.

Abstract: An ESD protection device includes an alumina multilayer substrate, a hollow portion, a discharge electrode pair, discharge-assisting electrodes, and a vitreous substance. The hollow portion is disposed inside of the alumina multilayer substrate. The electrodes of the discharge electrode pair are disposed opposite to each other at an interface between the hollow portion and the alumina multilayer substrate. The discharge-assisting electrodes are disposed dispersedly between the opposite electrodes of the discharge electrode pair. The vitreous substance covers the discharge-assisting electrodes in the inside of the hollow portion. A trial discharge is executed so as to induce creepage discharge between the electrodes of the discharge electrode pair in advance.