Patents by Inventor Takashi Okamura

Takashi Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220199063
    Abstract: The sound absorbing material 50 comprises: a felt-like fiber body 51 which includes 15 to 70% by weight of fine fibers with a fineness of 1 denier or less, 20 to 60% by weight of hollow fibers having inner cavities, and 10 to 40% by weight of binder fibers that join the fibers together; and a nonwoven fabric 52 that is laminated on a surface of the felt-like fiber body 51. The nonwoven fabric 52 includes a plurality of drawn long fibers arranged and oriented in one direction. An average diameter of the plurality of long fibers is in the range of 1 to 4 ?m. The sound absorbing material 50 has a thickness in the range of 8 to 45 mm and a bulk density of 20 kg/m3 or less.
    Type: Application
    Filed: March 19, 2020
    Publication date: June 23, 2022
    Applicant: ENEOS CORPORATION
    Inventors: Kunihiko IBAYASHI, Tomoyuki OKAMURA, Hirofumi AIZONO, Takashi OKABE, Masako KOSHIKAWA
  • Publication number: 20220184768
    Abstract: An edge trimming method for cutting an outer peripheral portion of a workpiece having a chamfered part on the outer peripheral portion. The method includes a cut in step of relatively moving a rotating cutting blade and a chuck table to cause the blade to cut into the outer peripheral portion, a cutting step of, after the cut in step, rotating the chuck table and causing the outer peripheral portion to be cut, to form an annular step, and a moving step of, after the cutting step, moving the blade in a direction of its axis of rotation to form another annular step adjacent to the first-mentioned annular step. The cut in, cutting, and moving steps are repeated in this order, and a stepped oblique region is formed on the outer peripheral portion, with a thickness increasing from an outermost peripheral edge toward an inner side of the workpiece.
    Type: Application
    Filed: November 16, 2021
    Publication date: June 16, 2022
    Inventors: Takashi OKAMURA, Shigenori HARADA
  • Publication number: 20220055242
    Abstract: Provided is a cutting method of cutting a workpiece by using a cutting apparatus including a chuck table configured to hold the workpiece and a cutting unit having a cutting blade configured to cut the workpiece held by the chuck table and an ultrasonic vibrator configured to ultrasonically vibrate the cutting blade in a radial direction of the cutting blade. The cutting method includes a holding step of holding the workpiece by the chuck table, and a cutting step of performing ultrasonic cutting that cuts the workpiece by the cutting blade vibrated ultrasonically and normal cutting that cuts the workpiece by the cutting blade not vibrated ultrasonically on the same cutting line of a plurality of cutting lines set on the workpiece.
    Type: Application
    Filed: August 3, 2021
    Publication date: February 24, 2022
    Inventors: Takashi OKAMURA, Shigenori HARADA
  • Publication number: 20210391217
    Abstract: There is provided a processing method of a wafer for processing the wafer that includes, on a front surface side, a device region in which a device is formed in each of plural regions marked out by plural planned dividing lines and includes a recess part on the back surface side and includes an annular reinforcing part at a peripheral part. The processing method of a wafer includes a holding step of holding the bottom surface of the recess part, a cutting step of cutting the wafer along the planned dividing lines by a cutting blade to divide the device region into plural device chips and form grooves on the front surface side of the reinforcing part, and a dividing step of dividing the reinforcing part along the planned dividing lines with the grooves being the points of origin by giving an external force to the reinforcing part.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 16, 2021
    Inventors: Takashi OKAMURA, Shigenori HARADA, Tomoharu TAKITA
  • Publication number: 20210346990
    Abstract: A workpiece processing method includes a protective film forming step of coating an upper surface of a wafer with a protective film including a water-soluble resin, a laser processing step of applying a laser beam of such a wavelength as to be absorbed in the wafer to the upper surface to subject the wafer to ablation, and a cleaning step of removing the protective film from the upper surface of the wafer together with debris generated in the laser processing step. The cleaning step includes a first cleaning sub-step of spinning a spinner table holding the wafer and supplying a cleaning fluid to the upper surface of the wafer and a second cleaning sub-step of supplying a mixed fluid of gas and the cleaning fluid to the upper surface of the wafer held by the spinning spinner table, to clean the wafer.
    Type: Application
    Filed: April 19, 2021
    Publication date: November 11, 2021
    Inventors: Jinyan ZHAO, Shigenori HARADA, Takashi OKAMURA
  • Patent number: 10879122
    Abstract: A wafer processing method includes: a wafer providing step of providing a wafer by placing a thermoplastic polymer sheet on an upper surface of a substrate on which the wafer is supported and positioning a back surface of the wafer on an upper surface of the polymer sheet; a sheet thermocompression bonding step of evacuating an enclosing environment in which the wafer is provided through the polymer sheet on the substrate, heating the polymer sheet, and pressing the wafer toward the polymer sheet to pressure-bond the wafer through the polymer sheet to the substrate; and a dividing step of positioning a cutting blade on the front surface of the wafer and cutting the wafer along the division lines to divide the wafer into individual device chips.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: December 29, 2020
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Takashi Okamura, Jinyan Zhao
  • Publication number: 20200307010
    Abstract: A processing apparatus includes a cutting blade mounted on a spindle, the cutting blade having a cutting edge for cutting a workpiece held on a holding table, a measuring portion for measuring an edge projection amount of the cutting edge at a predetermined frequency, and a data processing portion. The data processing portion includes a lower limit recording portion for recording a lower limit of the edge projection amount of the cutting edge as an allowable limit for use of the cutting blade, a storing portion for storing blade information including the edge projection amount measured by the measuring portion and a cutting distance traveled by the cutting blade at the time of measurement of the edge projection amount.
    Type: Application
    Filed: March 3, 2020
    Publication date: October 1, 2020
    Inventors: Takafumi OMORI, Shigenori HARADA, Takashi OKAMURA
  • Patent number: 10763390
    Abstract: An optical device wafer processing method for dividing an optical device wafer along a plurality of division lines to obtain a plurality of individual device chips includes applying a laser beam to a wafer substrate along each division line to thereby form a laser processed groove along each division line, and next forming a V groove along each laser processed groove on the optical device wafer by using a cutting blade having a V-shaped tip in the condition where each laser processed groove is removed by the cutting blade. A crack is formed so as to extend from the bottom of each laser processed groove due to a load applied from the cutting blade, thereby dividing the optical device wafer into the individual device chips. The depth of each laser processed groove is set smaller than the depth of cut by the cutting blade.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: September 1, 2020
    Assignee: DISCO CORPORATION
    Inventor: Takashi Okamura
  • Patent number: 10574549
    Abstract: A reporting method includes: obtaining an address that is assigned to a target device and that is included in a control signal used for a communication with an access point in a plurality of access points; storing identification information in a storage in association with the address of the target device; storing, when receiving report destination information, the report destination information in the storage in association with the address of the target device if identification information reported in association with the report destination information is stored in the storage; referring to the storage when obtaining information of a control signal received by one of the plurality of access points; and reporting, when a source address of the control signal exists in the storage, to a report destination stored in association with the source address that there is an access from the target device.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: February 25, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Masayuki Kobayashi, Takashi Okamura, Hiroyuki Nambu, Shu Matsuoka, Kaoru Kenjo
  • Patent number: 10560452
    Abstract: An apparatus controls transfer apparatuses that transfer a packet transmitted and received by terminals in a network. Upon receiving detection information notified from a server that detects unauthorized communication of a terminal by using the packet, the apparatus identifies the terminal and a type of the unauthorized communication, based on the detection information. The apparatus determines a transfer apparatus to be controlled, by referencing first information that stores information identifying the transfer apparatus in association with the terminal, and determines a control to be performed on the transfer apparatus by referencing second information that stores information on the control in association with the type of the unauthorized communication.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: February 11, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Hiroyasu Osaki, Takahiro Shimazaki, Hidehiko Mayumi, Shu Matsuoka, Takashi Okamura, Mitsuru Okajima
  • Publication number: 20200035559
    Abstract: A wafer processing method includes: a wafer providing step of providing a wafer by placing a thermoplastic polymer sheet on an upper surface of a substrate on which the wafer is supported and positioning a back surface of the wafer on an upper surface of the polymer sheet; a sheet thermocompression bonding step of evacuating an enclosing environment in which the wafer is provided through the polymer sheet on the substrate, heating the polymer sheet, and pressing the wafer toward the polymer sheet to pressure-bond the wafer through the polymer sheet to the substrate; and a dividing step of positioning a cutting blade on the front surface of the wafer and cutting the wafer along the division lines to divide the wafer into individual device chips.
    Type: Application
    Filed: July 17, 2019
    Publication date: January 30, 2020
    Inventors: Shigenori HARADA, Takashi OKAMURA, Jinyan ZHAO
  • Patent number: 10470041
    Abstract: A control device includes a control unit configured to transmit a login screen including an input section for an answer to a questionnaire to a mobile terminal that is not permitted to access a wireless access network, when a connection request is received from the mobile terminal, receive login information and an answer to the questionnaire input in the login screen, and issue an access permission to the mobile terminal for communication through the wireless access network when reception of the answer to the questionnaire and authentication of the mobile terminal based on the login information are complete.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: November 5, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Hiroshi Matsuno, Takashi Okamura, Shu Matsuoka, Hidehiko Mayumi, Madoka Tomiya, Mitsuru Okajima, Takahiro Shimazaki, Kaoru Kenjo
  • Patent number: 10379974
    Abstract: A non-transitory computer-readable recording medium stores therein a control program. The control program is executed by a control device that controls an access point conducting a communication by using a first identifier. The control device identifies an access point that becomes a target of disaster setting, in which a communication is conducted by using a second identifier different from the first identifier, on the basis of disaster information obtained from a providing source of information. The control device outputs, to a user interface, information for confirming whether or not the disaster setting is to be applied. Further, the control device sends an instruction to apply the disaster setting to the access point when a request to apply the disaster setting has been obtained.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: August 13, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Takashi Okamura, Mitsuru Okajima, Shu Matsuoka, Takahiro Shimazaki, Hidehiko Mayumi
  • Publication number: 20190177559
    Abstract: A solvent-type gravure ink for a laminate according to the present invention contains a pigment, a binder resin, an organic solvent, and water. The solvent-type gravure ink contains 80 to 100 mass % in total of a polyurethane resin and a vinyl chloride copolymer resin in 100 mass % of the binder resin, and the mass ratio of polyurethane resin to vinyl chloride copolymer resin is 95:5 to 40:60. The solvent-type gravure ink contains 1 to 50 mass % of a structural unit derived from a polyether in 100 mass % of the polyurethane resin. The solvent-type gravure ink contains 0.1 to 15 mass % of a glycol ether-based organic solvent serving as the organic solvent and 0.1 to 5 mass % of the water in 100 mass % of the gravure ink.
    Type: Application
    Filed: July 12, 2017
    Publication date: June 13, 2019
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYO INK CO., LTD.
    Inventors: Harunori NARIHIRO, Hideki YASUDA, Youichi HASHIMOTO, Takashi OKAMURA, Michihiro NODA, Michihisa KOFUJI
  • Patent number: 10264087
    Abstract: An access point notification method causing a control device that controls one or more access points to execute a process, the process include: identifying an access point based on disaster information and transmitting, to the access point, a transition instruction to instruct a transition of a setting of the access point to a disaster setting by which communication using a second identifier, different from a first identifier for which the access point allows communication, is allowed; transmitting to a notification server a request for authentication information; notifying the notification server of the information on the access point, using the authentication information; and causing the notification server to register the information on the access point the setting of which is transferred to the disaster setting and transmit a notification message to the terminal that is the distribution destination.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: April 16, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Kaoru Kenjo, Shu Matsuoka, Takahiro Shimazaki, Takashi Okamura, Hidehiko Mayumi, Mitsuru Okajima
  • Publication number: 20180212098
    Abstract: An optical device wafer processing method for dividing an optical device wafer along a plurality of division lines to obtain a plurality of individual device chips includes applying a laser beam to a wafer substrate along each division line to thereby form a laser processed groove along each division line, and next forming a V groove along each laser processed groove on the optical device wafer by using a cutting blade having a V-shaped tip in the condition where each laser processed groove is removed by the cutting blade. A crack is formed so as to extend from the bottom of each laser processed groove due to a load applied from the cutting blade, thereby dividing the optical device wafer into the individual device chips. The depth of each laser processed groove is set smaller than the depth of cut by the cutting blade.
    Type: Application
    Filed: January 22, 2018
    Publication date: July 26, 2018
    Inventor: Takashi Okamura
  • Patent number: 10017327
    Abstract: Conveying equipment with utilization of a conveying traveling body includes a conveying traveling body which includes a plurality of trolleys in a traveling direction and a load bar connecting these trolleys and a friction drive section which is provided in the traveling path of the conveying traveling body. The load bar is provided immediately below a pair of left and right guide rails for supporting and guiding the conveying traveling body, and a friction drive wheel which is pressure-contacted with a side surface of the load bar to propel the conveying traveling body in the friction drive section is arranged below the guide rails.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: July 10, 2018
    Assignee: Daifuku Co., Ltd.
    Inventors: Takashi Okamura, Yasuhiro Yamauchi
  • Publication number: 20180013649
    Abstract: A reporting method includes: obtaining an address that is assigned to a target device and that is included in a control signal used for a communication with an access point in a plurality of access points; storing identification information in a storage in association with the address of the target device; storing, when receiving report destination information, the report destination information in the storage in association with the address of the target device if identification information reported in association with the report destination information is stored in the storage; referring to the storage when obtaining information of a control signal received by one of the plurality of access points; and reporting, when a source address of the control signal exists in the storage, to a report destination stored in association with the source address that there is an access from the target device.
    Type: Application
    Filed: June 29, 2017
    Publication date: January 11, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Masayuki KOBAYASHI, Takashi Okamura, Hiroyuki NAMBU, Shu Matsuoka, Kaoru Kenjo
  • Publication number: 20170313521
    Abstract: Conveying equipment with utilization of a conveying traveling body includes a conveying traveling body which includes a plurality of trolleys in a traveling direction and a load bar connecting these trolleys and a friction drive section which is provided in the traveling path of the conveying traveling body. The load bar is provided immediately below a pair of left and right guide rails for supporting and guiding the conveying traveling body, and a friction drive wheel which is pressure-contacted with a side surface of the load bar to propel the conveying traveling body in the friction drive section is arranged below the guide rails.
    Type: Application
    Filed: March 23, 2017
    Publication date: November 2, 2017
    Inventors: Takashi Okamura, Yasuhiro Yamauchi
  • Publication number: 20170251071
    Abstract: An access point notification method causing a control device that controls one or more access points to execute a process, the process include: identifying an access point based on disaster information and transmitting, to the access point, a transition instruction to instruct a transition of a setting of the access point to a disaster setting by which communication using a second identifier, different from a first identifier for which the access point allows communication, is allowed; transmitting to a notification server a request for authentication information; notifying the notification server of the information on the access point, using the authentication information; and causing the notification server to register the information on the access point the setting of which is transferred to the disaster setting and transmit a notification message to the terminal that is the distribution destination.
    Type: Application
    Filed: February 1, 2017
    Publication date: August 31, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Kaoru Kenjo, Shu Matsuoka, Takahiro Shimazaki, Takashi Okamura, Hidehiko Mayumi, Mitsuru Okajima