Abstract: An event monitoring system includes a processor and a storage unit. The storage unit holds an event message including a character string related to an event occurring in an information system and guide information including one or more guides. The guide includes a guide message including a predetermined character string, notified in response to the event, and information regarding a coping method for the event. The processor compares the event message and the guide, associates the guide with the event in a case where the guide further includes information for identifying a variable portion of the guide message and a portion other than the variable portion of the guide message coincides with a portion other than a portion corresponding to the variable portion in the event message, and receives an input of information indicating a correct answer of a guide to be associated with the event in a case where the guide does not include the information for identifying the variable portion.

Abstract: A cemented carbide including tungsten carbide grains and a binder phase, in which a total content of the tungsten carbide grains and the binder phase in the cemented carbide is no less than 80 vol %, a content of the binder phase in the cemented carbide is no less than 0.1 vol % and no more than 20 vol %, in a histogram showing distribution of orientation differences between adjacent pairs each consisting of two of the tungsten carbide grains adjacent to each other in the cemented carbide, a first peak is present in a class of the orientation differences of no less than 29.5° and less than 30.5°.

Abstract: Edge trimming is performed on a wafer while a cleaning liquid is supplied to the center of a face side of the wafer and the wafer is rotated to form a film of the cleaning liquid that covers the face side of the wafer. The film of the cleaning liquid prevents the face side of the wafer from being dried, lowering the probability that swarf will be introduced into devices on the face side of the wafer. In addition, the consumption of the cleaning liquid can be reduced compared with a step of performing edge trimming on the wafer while supplying a curtain of cleaning liquid to the entire face side of the wafer.

Abstract: A skin stimulation brush includes stimulation brush pins, each including a base bottom member made of a metal, which is connected to an electric circuit so as to allow conduction of electricity from the electric circuit; a body member being an elongated tubular body, which has a proximal end portion at which the base bottom member is disposed; an electrode member connected to an opening of the body member on a distal end side, and having a distal end being exposed; and a metal shaft inserted into a tubular inner portion of the body member with an air gap, which is configured to couple the base bottom member and the electrode member while being in a compressed state in a length direction of the body member. The metal shaft has pliability that allows bending in a radial direction. The body member has elasticity that allows bending in a radial direction.

Abstract: A composite sintered material includes: a plurality of diamond grains having an average grain size of less than or equal to 10 ?m; a plurality of cubic boron nitride grains having an average grain size of less than or equal to 2 ?m; and a plurality of aluminum oxide grains having an average grain size of less than or equal to 0.5 ?m; and a remainder of a binder phase, wherein at least parts of adjacent diamond grains are bound to one another, the binder phase includes cobalt, in the composite sintered material, a content of the diamond grains is from 30 to 92 volume %, a content of the cubic boron nitride grains is from 3 to 40 volume %, a content of the aluminum oxide grains is from 2 to 15 volume %, and a content of the cobalt is from 3 to 30 volume %.

Abstract: A processing apparatus that processes a workpiece includes a chuck table that holds the workpiece including multiple streets that intersect each other on a holding surface, a processing unit that processes the workpiece held by the chuck table along a corresponding one of the streets, and a controller. When processing is suspended with an unprocessed region left while the processing unit is caused to process the workpiece from one end to the other end of the street, the controller rotates the chuck table by 180 degrees and causes the processing unit to process the unprocessed region of the workpiece from the other end of the street.

Abstract: Edge trimming is performed on a wafer while a cleaning liquid is supplied to the center of a face side of the wafer and the wafer is rotated to form a film of the cleaning liquid that covers the face side of the wafer. The film of the cleaning liquid prevents the face side of the wafer from being dried, lowering the probability that swarf will be introduced into devices on the face side of the wafer. In addition, the consumption of the cleaning liquid can be reduced compared with a step of performing edge trimming on the wafer while supplying a curtain of cleaning liquid to the entire face side of the wafer.

Abstract: According to a certain embodiment, a pin plunger includes: a first contact member; a second contact member that faces the first contact member and is apart from the first contact member; a spring arranged between the first contact member and the second contact member; and a housing that houses the first contact member, the second contact member, and the spring. The housing comprises a bimetal inside or outside the housing. The bimetal comprises a first metal and a second metal, the first metal having a thermal expansion coefficient different from a thermal expansion coefficient of the second metal. The elastic force decreased or increased by contracting or expanding of the spring due to a temperature change is compensated with a warping force due to stretching of the first metal and the second metal.

Abstract: According to a certain embodiment, a pin plunger includes: a first contact member; a second contact member that faces the first contact member and is apart from the first contact member; a spring arranged between the first contact member and the second contact member; and a housing that houses the first contact member, the second contact member, and the spring. The housing comprises a bimetal inside or outside the housing. The bimetal comprises a first metal and a second metal, the first metal having a thermal expansion coefficient different from a thermal expansion coefficient of the second metal. The elastic force decreased or increased by contracting or expanding of the spring due to a temperature change is compensated with a warping force due to stretching of the first metal and the second metal.

Abstract: A processing apparatus includes a cutting blade mounted on a spindle, the cutting blade having a cutting edge for cutting a workpiece held on a holding table, a measuring portion for measuring an edge projection amount of the cutting edge at a predetermined frequency, and a data processing portion. The data processing portion includes a lower limit recording portion for recording a lower limit of the edge projection amount of the cutting edge as an allowable limit for use of the cutting blade, a storing portion for storing blade information including the edge projection amount measured by the measuring portion and a cutting distance traveled by the cutting blade at the time of measurement of the edge projection amount.

Abstract: An edge trimming method for cutting an outer peripheral portion of a workpiece having a chamfered part on the outer peripheral portion. The method includes a cut in step of relatively moving a rotating cutting blade and a chuck table to cause the blade to cut into the outer peripheral portion, a cutting step of, after the cut in step, rotating the chuck table and causing the outer peripheral portion to be cut, to form an annular step, and a moving step of, after the cutting step, moving the blade in a direction of its axis of rotation to form another annular step adjacent to the first-mentioned annular step. The cut in, cutting, and moving steps are repeated in this order, and a stepped oblique region is formed on the outer peripheral portion, with a thickness increasing from an outermost peripheral edge toward an inner side of the workpiece.

Abstract: Provided is a cutting method of cutting a workpiece by using a cutting apparatus including a chuck table configured to hold the workpiece and a cutting unit having a cutting blade configured to cut the workpiece held by the chuck table and an ultrasonic vibrator configured to ultrasonically vibrate the cutting blade in a radial direction of the cutting blade. The cutting method includes a holding step of holding the workpiece by the chuck table, and a cutting step of performing ultrasonic cutting that cuts the workpiece by the cutting blade vibrated ultrasonically and normal cutting that cuts the workpiece by the cutting blade not vibrated ultrasonically on the same cutting line of a plurality of cutting lines set on the workpiece.

Abstract: There is provided a processing method of a wafer for processing the wafer that includes, on a front surface side, a device region in which a device is formed in each of plural regions marked out by plural planned dividing lines and includes a recess part on the back surface side and includes an annular reinforcing part at a peripheral part. The processing method of a wafer includes a holding step of holding the bottom surface of the recess part, a cutting step of cutting the wafer along the planned dividing lines by a cutting blade to divide the device region into plural device chips and form grooves on the front surface side of the reinforcing part, and a dividing step of dividing the reinforcing part along the planned dividing lines with the grooves being the points of origin by giving an external force to the reinforcing part.

Abstract: A workpiece processing method includes a protective film forming step of coating an upper surface of a wafer with a protective film including a water-soluble resin, a laser processing step of applying a laser beam of such a wavelength as to be absorbed in the wafer to the upper surface to subject the wafer to ablation, and a cleaning step of removing the protective film from the upper surface of the wafer together with debris generated in the laser processing step. The cleaning step includes a first cleaning sub-step of spinning a spinner table holding the wafer and supplying a cleaning fluid to the upper surface of the wafer and a second cleaning sub-step of supplying a mixed fluid of gas and the cleaning fluid to the upper surface of the wafer held by the spinning spinner table, to clean the wafer.

Abstract: A wafer processing method includes: a wafer providing step of providing a wafer by placing a thermoplastic polymer sheet on an upper surface of a substrate on which the wafer is supported and positioning a back surface of the wafer on an upper surface of the polymer sheet; a sheet thermocompression bonding step of evacuating an enclosing environment in which the wafer is provided through the polymer sheet on the substrate, heating the polymer sheet, and pressing the wafer toward the polymer sheet to pressure-bond the wafer through the polymer sheet to the substrate; and a dividing step of positioning a cutting blade on the front surface of the wafer and cutting the wafer along the division lines to divide the wafer into individual device chips.

Abstract: A processing apparatus includes a cutting blade mounted on a spindle, the cutting blade having a cutting edge for cutting a workpiece held on a holding table, a measuring portion for measuring an edge projection amount of the cutting edge at a predetermined frequency, and a data processing portion. The data processing portion includes a lower limit recording portion for recording a lower limit of the edge projection amount of the cutting edge as an allowable limit for use of the cutting blade, a storing portion for storing blade information including the edge projection amount measured by the measuring portion and a cutting distance traveled by the cutting blade at the time of measurement of the edge projection amount.

Abstract: An optical device wafer processing method for dividing an optical device wafer along a plurality of division lines to obtain a plurality of individual device chips includes applying a laser beam to a wafer substrate along each division line to thereby form a laser processed groove along each division line, and next forming a V groove along each laser processed groove on the optical device wafer by using a cutting blade having a V-shaped tip in the condition where each laser processed groove is removed by the cutting blade. A crack is formed so as to extend from the bottom of each laser processed groove due to a load applied from the cutting blade, thereby dividing the optical device wafer into the individual device chips. The depth of each laser processed groove is set smaller than the depth of cut by the cutting blade.

Abstract: A reporting method includes: obtaining an address that is assigned to a target device and that is included in a control signal used for a communication with an access point in a plurality of access points; storing identification information in a storage in association with the address of the target device; storing, when receiving report destination information, the report destination information in the storage in association with the address of the target device if identification information reported in association with the report destination information is stored in the storage; referring to the storage when obtaining information of a control signal received by one of the plurality of access points; and reporting, when a source address of the control signal exists in the storage, to a report destination stored in association with the source address that there is an access from the target device.

Abstract: An apparatus controls transfer apparatuses that transfer a packet transmitted and received by terminals in a network. Upon receiving detection information notified from a server that detects unauthorized communication of a terminal by using the packet, the apparatus identifies the terminal and a type of the unauthorized communication, based on the detection information. The apparatus determines a transfer apparatus to be controlled, by referencing first information that stores information identifying the transfer apparatus in association with the terminal, and determines a control to be performed on the transfer apparatus by referencing second information that stores information on the control in association with the type of the unauthorized communication.

Abstract: A wafer processing method includes: a wafer providing step of providing a wafer by placing a thermoplastic polymer sheet on an upper surface of a substrate on which the wafer is supported and positioning a back surface of the wafer on an upper surface of the polymer sheet; a sheet thermocompression bonding step of evacuating an enclosing environment in which the wafer is provided through the polymer sheet on the substrate, heating the polymer sheet, and pressing the wafer toward the polymer sheet to pressure-bond the wafer through the polymer sheet to the substrate; and a dividing step of positioning a cutting blade on the front surface of the wafer and cutting the wafer along the division lines to divide the wafer into individual device chips.