Abstract: There is provided a circuit substrate to be mounted in an electronic apparatus, and the circuit substrate has a power supply and a GND. The GND of the circuit substrate is electrically connected to GNDs of other components of the electronic apparatus through connecting parts. The circuit substrate has a part or circuit that implements a low impedance in an intended frequency range between the peripheral conductor of the connecting part opening to be used for the connection and the power supply of the circuit substrate.

Abstract: A method for designing a device that comprises a first semiconductor chip, a second semiconductor chip and an adjustment target is disclosed. The first semiconductor chip comprises an input pad, a first power supply pad and a first ground pad. The second semiconductor chip comprises an output pad coupled to the input pad. The adjustment target is connected to the first and the second semiconductor chips. A main target variable is calculated from an input circuit chip model, an output circuit chip model of the second semiconductor chip in frequency domain and a target impedance model of the adjustment target in frequency domain. The input circuit chip model is created by representing the first semiconductor chip in frequency domain in consideration of a first capacitor model between the input pad and the first power supply pad, a second capacitor model between the input pad and the first ground pad, and a chip internal capacitor model between the first power supply pad and the first ground pad.

Abstract: A method and apparatus for measuring an electric field distribution according to the present invention calculates a distribution of electric field intensity and its direction at arbitrary positions on the surface of the electronic apparatus or its circumference with use of data of measurement positions and measurement results of a potential distribution on a surface of an electronic apparatus. Further, it clearly indicates a flow of electromagnetic energy on the surface or in the circumference of the electronic apparatus by applying mathematical treatments to a magnetic field distribution at circumferential positions of the electronic apparatus. Thus, a distribution of high-frequency electric field generated from the electronic apparatus is measured with high accuracy.

Abstract: A circuit board having: a through hole to mount the circuit board to a casing or an electronic apparatus; and a coil-shaped conductive pattern provided on a plane perpendicular to the through hole so as to intersect a circumference around the through hole as a center.

Abstract: A method for designing a semiconductor package is disclosed, wherein the semiconductor package comprises a semiconductor chip and an adjustment target. A first target variable is calculated in consideration of a first transition state where an output level of the semiconductor chip changes from a low level to a high level. A second target variable is calculated in consideration of a second transition state where an output level of the semiconductor chip changes from the high level to the low level. Inferior one of the first and the second target variables is selected as a main target variable. The main target variable and a predetermined constraint represented in frequency domain are compared to decide design guidelines for the adjustment target.

Abstract: A magnetic field probe apparatus includes a loop-like conductor and feeder lines spaced at a distance from the loop-like conductor. The shape of the loop-like conductor and the arrangement of the feeder lines are adjusted in such a manner that the resonance frequency determined by the combination of the inductance of the loop-like conductor line and the capacitance formed between the looped-conductor and the feeder lines, is matched to the frequency of the magnetic field generated by and in the vicinity of a measurement object (e.g. electronic device) or the frequency of the electric signal which generates the magnetic field. With the magnetic field probe apparatus according to this invention, the magnetic field in the vicinity of the measurement object can be measured with high sensitivity.

Abstract: A junction-current probe is provided which can measure a current flowing in a junction port adapted to connect a circuit board or an electronic apparatus to a chassis under the condition that the circuit board or electronic apparatus is packaged to the chassis. Structurally, the current probe has a circular or rectangular insulator having a hole in the center, a coiled conductor wire for converting linkage flux into voltage, an insulating member for preventing the insulator from making electrical contact with surroundings, an extraction lead for connecting opposite ends of the conductor wire to a cable and the cable for connection to a measurement unit. The current probe is reduced in thickness within in a range in which the condition of packaging to the chassis can remain unchanged.

Abstract: A method for designing a semiconductor apparatus comprising a semiconductor package in consideration of power integrity for a semiconductor chip included in the semiconductor package is disclosed. A target variable for an adjustment target is calculated on the basis of target information about the adjustment target, wherein the target variable is represented in frequency domain, and the adjustment target includes a part of the semiconductor package. The target variable is compared with a predetermined constraint, which is represented in frequency domain, to identify a problematic section, wherein the problematic section corresponds to a frequency region at which the target variable exceeds the predetermined constraint. Design guidelines are decided to solve the identified problematic section.

Abstract: Disclosed is a multichip package or system-in package which the logic chip includes a selector circuit which, by transmitting a test mode select signal or a test mode select command to the logic chip, enables access from a logic signal pin connected to the logic chip, to a memory control signal to each of the “m” number of memory chips; and the memory control signal, when viewed from the logic chip, is connected using a one-for-one wiring scheme or a one-for-up-to-m branch wiring scheme, between the selector circuit and each of the “m” number of memory chips. This multichip package or system-in package is low in noise and high in operational reliability.

Abstract: According to the present invention, unnecessary electromagnetic radiation from the hard disk alone is measured by connecting one end of a hard disk drive which has an interface cable and a power cable extending out from the other end thereof to a conductive jig extended along the extension direction of these cables; configuring a coaxial-structured transmission line with the jig, the hard disk drive and the cables which are arranged in this order along the extension direction of the cables and a hollow conductive enclosure covering the jig, the hard disk drive and the cables; and measuring common-mode current flowing through the interface cable and the power cable and potential of the conductive enclosure at the same.

Abstract: A method and apparatus for measuring an electric field distribution according to the present invention calculates a distribution of electric field intensity and its direction at arbitrary positions on the surface of the electronic apparatus or its circumference with use of data of measurement positions and measurement results of a potential distribution on a surface of an electronic apparatus. Further, it clearly indicates a flow of electromagnetic energy on the surface or in the circumference of the electronic apparatus by applying mathematical treatments to a magnetic field distribution at circumferential positions of the electronic apparatus. Thus, a distribution of high-frequency electric field generated from the electronic apparatus is measured with high accuracy.

Abstract: The present invention relates to an optical transmission module comprising two substrates, each of which has an electronic part mounted on the substrate and a terminal area for inputting/outputting an electric signal into/from the electronic part, wherein an electrical connection is made between the terminal areas of said two substrates by use of a flexible substrate having a structure constituted of at least three layers, and thereby a high frequency signal is transmitted between the electronic part mounted on one substrate and the electronic part mounted on the other substrate through the flexible substrate while confining an electromagnetic field. In addition, the present invention provides an optical transmission module characterized in that a slit formed in a ground plane on a connection section of a three-layer flexible substrate reduces a disturbance in electromagnetic field, making it possible to improve the transmission characteristic of a high frequency signal.

Abstract: There is provided a thin and small size connector-less optical transmission module M which assures excellent high frequency characteristic. This optical transmission module comprises transmission line substrates and a coaxial cable for connecting these transmission line substrates and is connected to the transmission line substrate via a contact sleeve which is provided with projections fixed to the external conductor of the coaxial cable and projected in the extending direction of the coaxial cable. Since an electromagnetic field mode alleviating portion formed of a dielectric material is provided to the core wire of the coaxial cable, the thin and small size optical transmission module M can assure less amount of radiation of an interference electromagnetic wave, high frequency characteristic through connection with the coaxial cable.

Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Abstract: A semiconductor device includes a semiconductor die having patterned circuitry, a plurality of terminals coupled to the die, and an indication providing signal noise information of at least one of the terminals.

Abstract: The provision of a coplanar waveguide coupled with a microstrip line with a transmission line substrate that is used between two functional units of different impedance characteristics allows the input and output impedance matching to be performed, the impedance matching between which coplanar waveguide and microstrip line is performed by the variation of the signal linewidth. It allows the transmission characteristics of the optical transmission device in high frequency band to improve.

Abstract: The present invention relates to an optical transmission module comprising two substrates, each of which has an electronic part mounted on the substrate and a terminal area for inputting/outputting an electric signal into/from the electronic part, wherein an electrical connection is made between the terminal areas of said two substrates by use of a flexible substrate having a structure constituted of at least three layers, and thereby a high frequency signal is transmitted between the electronic part mounted on one substrate and the electronic part mounted on the other substrate through the flexible substrate while confining an electromagnetic field.

Abstract: A recording medium includes a computer readable program for controlling a computer. The program comprises (a) code for calculating a current distribution by using a strength and phase of magnetic field measured from a measuring object; (b) code for calculating a first electric field strength at a measuring point from the current distribution; (c) code for calculating a second electric field strength at the measuring point by using a current distribution of a predetermined position on a part of the current distribution of the measuring object; and (d) code for calculating a ratio related to the first electric field strength in association with the second electric field strength.

Abstract: There is provided a thin and small size connector-less optical transmission module M which assures excellent high frequency characteristic. This optical transmission module comprises transmission line substrates and a coaxial cable for connecting these transmission line substrates and is connected to the transmission line substrate via a contact sleeve which is provided with projections fixed to the external conductor of the coaxial cable and projected in the extending direction of the coaxial cable. Since an electromagnetic field mode alleviating portion formed of a dielectric material is provided to the core wire of the coaxial cable, the thin and small size optical transmission module M can assure less amount of radiation of an interference electromagnetic wave, high frequency characteristic through connection with the coaxial cable.