Patents by Inventor Takashi Suga

Takashi Suga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6697744
    Abstract: The electromagnetic-wave-generating-source search method includes the steps of calculating a first electric field strength at a measuring point based on a current distribution belonging to an object to be measured; calculating a second electric field strength at said measuring point by employing the current distribution at a preselected position on said measuring object, the preselected position corresponding to a portion of the current distribution of said measuring object; and calculating a relative ratio of said first electric field strength with respect to said second electric field strength, thereby determining the source generating a remote electric field.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: February 24, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Kouichi Uesaka, Takashi Suga
  • Publication number: 20030231088
    Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.
    Type: Application
    Filed: February 26, 2003
    Publication date: December 18, 2003
    Inventors: Hiroshi Kikuchi, Norio Nakazato, Hideko Ando, Takashi Suga, Satoru Isomura, Takashi Kubo, Hiroyasu Sasaki, Masanori Fukuhara, Naotaka Tanaka, Fujiaki Nose
  • Publication number: 20030218238
    Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.
    Type: Application
    Filed: March 20, 2003
    Publication date: November 27, 2003
    Inventors: Hiroshi Kikuchi, Norio Nakazato, Hideko Ando, Takashi Suga, Satoru Isomura, Takashi Kubo, Hiroyasu Sasaki, Masanori Fukuhara, Naotaka Tanaka, Fujiaki Nose
  • Patent number: 6625554
    Abstract: The present invention provides a magnetic field measuring method and system for determining the magnetic field of an integrated circuit (IC) inside the IC package, including the pre-packaged IC. In one embodiment, induced voltages due only to the magnetic field are determined at measurement heights on the order of the line spacings in an integrated circuit. A magnetic probe is used; the probe has a loop of wire parallel to the current, for measuring the induced voltage of the horizontal component of the magnetic field. The induced voltage due to the electric field is removed by using a calculation including the difference of two measurements. The magnetic field distribution for the integrated circuit may be determined by using the above procedure on a grid like pattern above the IC.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: September 23, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Suga, Kouichi Uesaka, Satoshi Nakamura, Yoshihiko Hayashi
  • Patent number: 6624536
    Abstract: An electronic apparatus is comprised of a circuit apparatus; and an electromagnetic wave absorbing device arranged in the vicinity of the circuit apparatus in an insulating manner with respect to a circuit of the circuit apparatus, and having a metal loop, a portion of which is made of a high resistor. The metal loop contains a first member having a resistor having a resistance value smaller than, or equal to several ohms; and a second member having a resistor having a resistance value larger than, or equal to several ohms, and connected so as to form an electric loop in combination with the first member.
    Type: Grant
    Filed: July 27, 1999
    Date of Patent: September 23, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Sawada, Hiromu Ishihara, Hitoshi Yokota, Takashi Suga, Tsutomu Hara
  • Publication number: 20030169133
    Abstract: The invention provides a transmission line that is fabricated by forming the bottom base that is formed by means of a process in which a groove is formed on a circuit substrate, a conductive film is formed on the surface of the groove, the groove is filled with dielectric material, and a metal conductor is formed on the dielectric material, by forming the top base that is formed by means of a process in which a groove is formed, a conductive film is formed on the surface of the groove, and the groove is filled with dielectric material, and by putting the top base on the bottom base so that the metal conductor is interposed between the top base and the bottom base. Thereby, a transmission line with reduced leakage of the electromagnetic field is provided. Furthermore, an electronic parts or electronic apparatus with good high frequency performance that use the above-mentioned transmission line is provided.
    Type: Application
    Filed: August 15, 2002
    Publication date: September 11, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Makoto Torigoe, Takashi Suga, Kouichi Uesaka
  • Patent number: 6614663
    Abstract: In a circuit board having a multilayer structure comprising a ground pattern and a power-supply pattern both, for example, by forming a plurality of slits along each side of the ground pattern or the power-supply pattern, a long thin conduction path connecting a corner and a side center of the ground pattern is formed and resistive elements are placed in the middles of the conduction path to short, circuit the corner and a side center of the ground pattern. Therefore, portions corresponding to an antinode and a node or antinode and an antinode of a standing wave are short-circuited. The standing wave is generated when electric power is supplied to ICs and LSIs mounted on the circuit board. Thus, noise sources caused by the standing wave cancel each other. As a result, the occurrence of an antiresonance phenomenon and an increase in impedance of the power supplying system caused by the standing wave can be suppressed.
    Type: Grant
    Filed: July 27, 1999
    Date of Patent: September 2, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Yokota, Tsutomu Hara, Mariko Kasai, Takashi Suga, Hideo Sawada, Hiromu Ishihara
  • Patent number: 6608550
    Abstract: A reader and/or writer apparatus having an antenna lying substantially in a plane for generating an electromagnetic field to supply power to an IC card and a conductor member to be disposed in a plane substantially parallel to the plane of the antenna, wherein the distance between the antenna and the conductor member is no greater than 20 mm. A power supplying system supplies power using electromagnetic waves from the reader and/or writer apparatus to the IC card. The IC card includes a circuit for converting the supplied power to a D.C. voltage and for supplying the D.C. voltage to an internal circuit of the IC card.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: August 19, 2003
    Assignees: Hitachi, Ltd., Kokusai Electric Co., Ltd.
    Inventors: Yoshihiko Hayashi, Takashi Suga, Kouichi Uesaka, Ryouzou Yoshino, Keisuke Igarashi
  • Publication number: 20030091258
    Abstract: The provision of a coplanar waveguide coupled with a microstrip line with a transmission line substrate that is used between two functional units of different impedance characteristics allows the input and output impedance matching to be performed, the impedance matching between which coplanar waveguide and microstrip line is performed by the variation of the signal linewidth. It allows the transmission characteristics of the optical transmission device in high frequency band to improve.
    Type: Application
    Filed: March 28, 2002
    Publication date: May 15, 2003
    Applicant: OpNext Japan, Inc.
    Inventors: Kouichi Uesaka, Takashi Suga, Hisaaki Kanai, Yoshinori Nagoya
  • Publication number: 20030052395
    Abstract: A semiconductor device includes a semiconductor die having patterned circuitry, a plurality of terminals coupled to the die, and an indication providing signal noise information of at least one of the terminals.
    Type: Application
    Filed: September 13, 2002
    Publication date: March 20, 2003
    Applicant: HITACHI, LTD.
    Inventors: Satoshi Nakamura, Takashi Suga, Atsushi Nakamura, Hitoshi Yokota, Tsutomu Hara, Kouichi Uesaka, Tatsuji Noma, Makoto Torigoe
  • Publication number: 20030001596
    Abstract: The present invention provides a magnetic field measuring method and system for determining the magnetic field of an integrated circuit (IC) inside the IC package, including the pre-packaged IC. In one embodiment, induced voltages due only to the magnetic field are determined at measurement heights on the order of the line spacings in an integrated circuit. A magnetic probe is used; the probe has a loop of wire parallel to the current, for measuring the induced voltage of the horizontal component of the magnetic field. The induced voltage due to the electric field is removed by using a calculation including the difference of two measurements. The magnetic field distribution for the integrated circuit may be determined by using the above procedure on a grid like pattern above the IC.
    Type: Application
    Filed: June 22, 2001
    Publication date: January 2, 2003
    Inventors: Takashi Suga, Kouichi Uesaka, Satoshi Nakamura, Yoshihiko Hayashi
  • Publication number: 20020167324
    Abstract: The electromagnetic wave generating source searching method includes the steps of calculating a first electric field strength at a measuring point based upon a current distribution owned by an object to be measured; calculating a second electric field strength at said measuring point by employing such a current distribution at a preselected position on said measuring object, which corresponds to a portion of the current distribution of said measuring object; and calculating a relative ratio of said first electric field strength with respect to said second electric field strength, thereby judging a source for generating a remote electric field.
    Type: Application
    Filed: February 1, 2002
    Publication date: November 14, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Kouichi Uesaka, Takashi Suga
  • Publication number: 20020158640
    Abstract: The electromagnetic wave generating source searching method includes the steps of calculating a first electric field strength at a measuring point based upon a current distribution owned by an object to be measured; calculating a second electric field strength at said measuring point by employing such a current distribution at a preselected position on said measuring object, which corresponds to a portion of the current distribution of said measuring object; and calculating a relative ratio of said first electric field strength with respect to said second electric field strength, thereby judging a source for generating a remote electric field.
    Type: Application
    Filed: August 17, 2001
    Publication date: October 31, 2002
    Inventors: Kouichi Uesaka, Takashi Suga
  • Patent number: 6427065
    Abstract: The present invention comprises a power transmission system, an IC card, and an information communication system using an IC card. In the power transmission system, power is transmitted by radio from the power transmission device to the IC card. In the IC card, the transmitted induced power is converted into a DC voltage, the transmitted induced power or a voltage corresponding to the induced power is detected, and a desired DC voltage to be suppled to the internal circuit is obtained in controlling resistance the detected induced power or the voltage corresponding to the induced power.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: July 30, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Suga, Yoshihiko Hayashi, Ryouzou Yoshino, Kenji Nagai
  • Publication number: 20020011662
    Abstract: A low-impedance connection is provided between an LSI and a capacitor (for example, existing internal capacitance of an electronic part) in the power supply path to limit power supply noise, which can be a factor in high-speed logic circuit malfunctions. For example, a packaging substrate and a semiconductor device using the same are provided which reduce power supply path inductance, which is a major factor in impedance.
    Type: Application
    Filed: April 23, 2001
    Publication date: January 31, 2002
    Inventors: Yasumoto Komiya, Takashi Suga, Yoshihiko Hayashi
  • Patent number: 6321067
    Abstract: The present invention comprises a power transmission system, an IC card, and an information communication system using an IC card. In the power transmission system, power is transmitted by radio from the power transmission device to the IC card. In the IC card, the transmitted induced power is converted into a DC voltage, the transmitted induced power or a voltage corresponding to the induced power is detected, and a desired DC voltage to be suppled to the internal circuit is obtained in controlling resistance the detected induced power or the voltage corresponding to the induced power.
    Type: Grant
    Filed: September 15, 1997
    Date of Patent: November 20, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Suga, Yoshihiko Hayashi, Ryouzou Yoshino, Kenji Nagai
  • Publication number: 20010000659
    Abstract: A reader and/or writer apparatus having an antenna lying substantially in a plane for generating an electromagnetic field to supply power to an IC card and a conductor member to be disposed in a plane substantially parallel to the plane of the antenna, wherein the distance between the antenna and the conductor member is no greater than 20 mm. A power supplying system supplies power using electromagnetic waves from the reader and/or writer apparatus to the IC card. The IC card includes a circuit for converting the supplied power to a D.C. voltage and for supplying the D.C. voltage to an internal circuit of the IC card.
    Type: Application
    Filed: December 22, 2000
    Publication date: May 3, 2001
    Inventors: Yoshihiko Hayashi, Takashi Suga, Kouichi Uesaka, Ryouzou Yoshino, Keisuke Igarashi
  • Patent number: 6194993
    Abstract: A reader and/or writer apparatus, a power feeding system and a power feeding and communication transmission and/or reception system in a proximate wireless card system arranged so that power which satisfies the requirement of the Radio Law (500 &mgr;V/m at a distance of 3 m from the reader and/or writer apparatus) regarding the radiated electric field is supplied sufficiently from the reader and/or writer apparatus to the proximate wireless card (IC card). The reader and/or writer apparatus has a spirally shaped or coil-shaped antenna for generating electromagnetic fields both to supply operational power to an IC card and to perform transmission and/or reception of signals for communication to and/or from the IC card and a conductor member for forming a mirror image of the antenna on its back side.
    Type: Grant
    Filed: June 19, 1998
    Date of Patent: February 27, 2001
    Assignees: Hitachi, Ltd., Kokusai Electric Co., Ltd.
    Inventors: Yoshihiko Hayashi, Takashi Suga, Kouichi Uesaka, Ryouzou Yoshino, Keisuke Igarashi
  • Patent number: 6176433
    Abstract: The present invention provides a reader and/or writer for performing both the supply of operating power to an IC card and transmission of a communication signal to the IC card or transmission and reception thereof to and from the IC card, wherein a main coil or a spiral antenna for generating an electromagnetic field for the two or at least power supply, and auxiliary coils or spiral antennas for generating magnetic fields opposite in phase to the electromagnetic field generated by the main coil or spiral antenna to thereby restrain the intensity of the electromagnetic field in the distance are provided side by side.
    Type: Grant
    Filed: May 15, 1998
    Date of Patent: January 23, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Kouichi Uesaka, Yoshihiko Hayashi, Takashi Suga, Masami Makuuchi, Ryozo Yoshino
  • Patent number: 6164532
    Abstract: The present invention provides a power transmission/communication system for transmitting power from a reader and/or writer to an IC card by an electromagnetic wave and performing transmission or transmission and reception of a communication signal between the reader and/or writer and the IC card by an electromagnetic wave, wherein the intensity of a magnetic field induced by the electromagnetic wave outputted from the reader and/or writer, i.e., the magnitude of power induced thereby and the time required to transmit the power are controlled.
    Type: Grant
    Filed: May 5, 1998
    Date of Patent: December 26, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Suga, Yoshihiko Hayashi, Kouichi Uesaka, Masami Makuuchi, Ryozo Yoshino