Abstract: A lever-type connector electrically detects a connected state of housings and has an improved reliability in its connection detecting function. A magnet (33) is provided integrally in an operable portion (31) of a lever (30), and a lead switch (50) is provided at the bottom surface of a receptacle (41). The lever (30) is operated to engage cam pins (44) with cam grooves (35), and female and male housings (10, 40) are properly connected by the cam action and the lead switch (50) is turned on by a magnetic force of the magnet (33). Whether the two housings (10, 40) are connected properly can be detected electrically by connecting the lead switch (50) with a detecting circuit or the like.

Abstract: A circuit board terminal (10) has a board connecting portion (12) with a pair of resilient contacts (14) that bulge out with a deformation space (15) therebetween. A resiliently deformable strut (17) bridges the facing inner surfaces of the two resilient contacts (14). The board connecting portion (12) can be inserted into a through hole (23) in a circuit board (20). Thus, the resilient contacts (14) are pressed against the inner surface of the through hole (23) by a resilient force of the strut (17) acting in elongating directions and their own resilient forces acting in opening directions.

Abstract: A lever-type connector electrically detects a connected state of housings and has an improved reliability in its connection detecting function. A magnet (33) is provided integrally in an operable portion (31) of a lever (30), and a lead switch (50) is provided at the bottom surface of a receptacle (41). The lever (30) is operated to engage cam pins (44) with cam grooves (35), and female and male housings (10, 40) are properly connected by the cam action and the lead switch (50) is turned on by a magnetic force of the magnet (33). Whether the two housings (10, 40) are connected properly can be detected electrically by connecting the lead switch (50) with a detecting circuit or the like.

Abstract: A rolling apparatus is disclosed which forms a thin walled portion on part of a steel strip by allowing the steel strip to intervene between a pair of upper and lower rolling rolls, in which the upper rolling roll is vertically movable. The steel strip which has been pressed between a pair of upper and lower rolling rolls is repeatedly moved on a traveling table to upstream side and downstream side alternately, thereby forming the thin walled portion having a width corresponding to the movement quantity. In forming the thin walled portion, the steel strip is grasped on both upstream side and downstream side with a plurality of clamping means and is subjected to a tension due to tension imparting means, thereby facilitating formation of the thin walled portion.

Abstract: The present invention relates to an image processing circuit and an image processing method, and is applied to, for example, a video camera, an electronic still camera and the like, for compressing the dynamic range at a high compression rate with evading the lowering of an impression concerning the contrast and the unnatural edge emphasis. The present invention smoothes an input image X while preserving the edge to obtain a gain correction coefficient, and corrects the pixel value x(i, j) of the input image X with the gain correction coefficient.

Abstract: An image capturing device has a base plate with a solid-state optical sensor mounted on the top surface. The base plate has a plurality of apertures defined therethrough. A glass frame is detachably mounted on the base plate and has an opening defined therethrough and a piece of glass mounted at the upper end of the opening. A lens retainer is detachably mounted on the glass frame and has a tubular portion with a hole in alignment with the optical sensor, a male thread formed at an outer periphery of the tubular portion; and an adjusting ring covering the tubular portion and having a female thread engaged with the male thread on the tubular portion and a lens installed therein.

Abstract: A vehicular body panel or component part having a reinforcing backing plate reconciled to a part of a blank material at a position wherein a bending formation is implemented. The backing plate has one or more than two apertures formed in at least one lateral raw at a location equivalent to the position of the bending formation. When forming the blank material and the backing plate concurrently by bending operation, the backing plate becomes intimate with the blank sheet to avoid the backing plate from locally separating from the blank material and from forming a gap relative thereto, with a resultant improved product quality.

Abstract: A device and a method for image processing make it possible to significantly improve the contrast and the sharpness of the whole image, in comparison with the ordinary. By amplifying the portions other than the edges, while conserving the edges with the pixel values which change abruptly out of input image data, it is possible to enhance and display the portions other than the edges, and so it is possible to significantly improve the contrast and the sharpness of the whole image, in comparison with the ordinary.

Abstract: An image pickup apparatus and method for controlling an exposure so as to maintain proper brightness for a target or desired object regardless of the background brightness. Such image pickup apparatus may include a level sensing unit having a number of level sensing or detecting devices including a first level sensing device for sensing an imaging output level of a specific luminance level area on an imaged screen and a second level sensing device for sensing an imaging output level of a skin tone area on the imaged screen. The image pickup apparatus may further include a control device for controlling the quantity of light received in an image pickup unit in accordance with the sensed or detected output levels. Additionally, the present color image pickup apparatus may be operable in a plurality of exposure modes in accordance with the imaging condition. As a result, an imaging output may be provided which has relatively high or excellent image quality.

Abstract: An electrostatic precipitator for removing fine particles from gas is described. The precipitator includes an array of dust collection pipes, each negatively charged and serving as an electrode. Each pipe has a pin-like positively charged discharge electrode centrally located within it. Mist-laden gas is caused to flow through the pipes and is electrostatically cleaned. A slit is formed in the pipes to permit some cleaned gas to be mixed with uncleaned gas and reintroduced into the pipes to reduce the density of the fine particles in the gas entering the pipes. The pipes may be vertically or horizontally arranged.

Abstract: A photoresist pattern is formed on a quartz substrate. The quartz substrate is dipped into a silicon oxide supersaturated solution of hydrofluoric acid, and a silicon oxide is precipitated out of the supersaturated solution, thereby forming an SiO.sub.2 film on that exposed surface of the quartz substrate which is not covered with the photoresist pattern. After that, the photoresist pattern is ashed by oxygen plasma, and the ashed pattern is removed. The SiO.sub.2 film remaining on the quartz substrate serves as a phase shifter.

Abstract: In a powder beam etching machine, slopes are formed in upper and lower edge surfaces of a rib formed along an outer margin of a platen and through-holes are formed around four corners. With such an arrangement, the powders adhered work may readily be removed by injection of air during a cleaning operation.

Abstract: An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

Abstract: A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound.

Abstract: An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.

Abstract: An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.

Abstract: A method for forming a highly precise resist pattern with good reproducibility has the steps of: applying a resist material to a substrate to form a resist film; baking the resist film; cooling the resist film in a controlled manner; selectively irradiating the resist film with one of electromagnetic waves in a predetermined wavelength range and particle beam having predetermined energy; and developing the resist film to form a resist pattern.

Abstract: A resin-encapsulated semiconductor device is of the structure wherein a silicon chip on a die pad is encapsulated with a molding resin. The rear surface of the die pad remote from the silicon chip, preferably the entire surfaces of the elements are treated with a primer, typically a silane coupling agent and a low stress epoxy resin encapsulant is used, preventing the encapsulating resin from separating and cracking upon subsequent dipping in solder bath.

Abstract: A method for forming a resist pattern comprises the steps of coating a resist on a substrate, baking the resist, selectively radiating electromagnetic waves or particle rays onto a surface of the resists, and developing the resist. The method further comprises, after the baking step and before the developing step, the step of cooling the resist in such a manner that a temperature control plate is disposed parallel to and adjacent to the substrate.

Abstract: A method for forming a highly precise resist pattern with good reproducibility has the steps of: applying a resist material to a substrate to form a resist film; baking the resist film; cooling the resist film in a controlled manner; selectively irradiating the resist film with one of electromagnetic waves in a predetermined wavelength range and particle beam having predetermined energy; and developing the resist film to form a resist pattern.