Abstract: A beam having a base material of silicon monocrystal and at least one projection which is integrally formed so as to be supported at least at one end thereof and which has two surfaces having an orientation plane (111), includes a bottom surface in a plane which is common with a plane of the base material; a groove penetrating from the bottom surface to a top of the projection; and a protecting member having a resistance property against a crystal anisotropic etching liquid and covering an inner wall of the groove.

Abstract: As a method of fabricating aspherical microstructures, a protruding microstructure is formed on a substrate, an aspherical-profile forming layer is formed on the substrate and the protruding microstructure, and the aspherical-profile forming layer is hardened. An aspherical profile is formed on the protruding microstructure due to a surface tension of the aspherical-profile forming layer in the step of forming the aspherical-profile forming layer, and the aspherical profile is maintained through the step of hardening the aspherical-profile forming layer.

Abstract: In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.

Abstract: In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.

Abstract: In view of the fact that luminescent compounds and polymers capable of emitting blue light for a long time and excellent in durability have not been developed, the present invention provides blue light-emitting compounds having special structures, blue light-emitting polymers having special repeating units, processes of producing the compounds, and luminescent elements including the polymers.

Abstract: In a fabrication method of a microstructure array, such as a mold for forming a microlens array, a first insulating mask layer is formed on a conductive portion of s substrate, an array of openings for the microstructure array and at least an opening for an alignment marker are formed in the first insulating mask layer during a common process to expose the conductive portion of the substrate at the openings, and first plated or electrodeposited layers are grown in the openings and on the first insulating mask layer using the conductive portion of the substrate as a cathode. The opening for the alignment marker is surrounded by the array of openings for the microstructure array, and a pattern of the opening for the alignment marker is determined such that a current density distribution at the time of electroplating or electrodeposition can be oppressed.

Abstract: Disclosed in a non-contacting electric potential sensor capable of being readily reduced in its size, which includes a detecting electrode, an electrically-conductive movable shutter, and a driving unit for driving the electrically-conductive movable shutter. The detecting electrode is to be placed facing a measurement object whose electric potential is to be measured. The electrically-conductive movable shutter is disposed so as to be movably located in a spacing formed between the detecting electrode and the measurement object when the detecting electrode is placed facing the measurement object, so that an exposure degree of the detecting electrode against the measurement object can be controlled. The driving unit includes a current injecting unit for selectively injecting current into the electrically-conductive movable shutter in a direction approximately perpendicular to a moving direction of the electrically-conductive movable shutter.

Abstract: A method for fabricating a mold for a microlens having a desired radius (R) of curvature by electroplating. In this method, a minimum radius (Rmin) of curvature is utilized to achieve the desired curvature radius.

Abstract: As a method of fabricating aspherical microstructures, a protruding microstructure is formed on a substrate, an aspherical-profile forming layer is formed on the substrate and the protruding microstructure, and the aspherical-profile forming layer is hardened. An aspherical profile is formed on the protruding microstructure due to a surface tension of the aspherical-profile forming layer in the step of forming the aspherical-profile forming layer, and the aspherical profile is maintained through the step of hardening the aspherical-profile forming layer.

Abstract: A mold for a microlens includes a substrate at least a portion of which is electrically conductive, such as an electrically-conductive substrate or a substrate with an electrode layer, an insulating mask layer formed on the substrate and including an opening or plural openings, and a plated layer electroplated in the opening and on the mask layer. A first condition that a diameter or width (&phgr;) of the opening has a relation of &phgr;≦0.35R, wherein (R) is a radius of curvature of the plated layer right above the opening, or a second condition that the diameter or width (&phgr;) of the opening is &phgr;≦10 &mgr;m, is met.

Abstract: As a method of fabricating aspherical microstructures, a protruding microstructure is formed on a substrate, an aspherical-profile forming layer is formed on the substrate and the protruding microstructure, and the aspherical-profile forming layer is hardened. An aspherical profile is formed on the protruding microstructure due to a surface tension of the aspherical-profile forming layer in the step of forming the aspherical-profile forming layer, and the aspherical profile is maintained through the step of hardening the aspherical-profile forming layer.

Abstract: In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.

Abstract: In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.

Abstract: In a fabrication method of a microstructure array, such as a mold for forming a microlens array, a first insulating mask layer is formed on a conductive portion of s substrate, an array of openings for the microstructure array and at least an opening for an alignment marker are formed in the first insulating mask layer during a common process to expose the conductive portion of the substrate at the openings, and first plated or electrodeposited layers are grown in the openings and on the first insulating mask layer using the conductive portion of the substrate as a cathode. The opening for the alignment marker is surrounded by the array of openings for the microstructure array, and a pattern of the opening for the alignment marker is determined such that a current density distribution at the time of electroplating or electrodeposition can be oppressed.

Abstract: In a fabrication method of a microstructure array, such as a mold for forming a microlens array, a first insulating mask layer is formed on a conductive portion of s substrate, an array of openings for the microstructure array and at least an opening for an alignment marker are formed in the first insulating mask layer during a common process to expose the conductive portion of the substrate at the openings, and first plated or electrodeposited layers are grown in the openings and on the first insulating mask layer using the conductive portion of the substrate as a cathode. The opening for the alignment marker is surrounded by the array of openings for the microstructure array, and a pattern of the opening for the alignment marker is determined such that a current density distribution at the time of electroplating or electrodeposition can be oppressed.

Abstract: A fabrication method of fabricating an array of microstructures is provided. The method includes the step of preparing a substrate with a surface including a usable region and a dummy region continuously set around the usable region, at least the usable region and the dummy region of the substrate are electrically conductive and have a conductive portion. The method also includes the steps of forming a first insulating layer on the conductive portion, and forming a plurality of openings in the first insulating layer, the openings being arranged in a predetermined array pattern. Additionally, the method includes the step of performing one of electroplating and electrodeposition using the conductive portion as an electrode to form a first plated or electrodeposited layer in the openings and on the first insulating layer in both the usable region and the dummy region.

Abstract: A mold for a microlens includes a substrate at least a portion of which is electrically conductive, such as an electrically-conductive substrate or a substrate with an electrode layer, an insulating mask layer formed on the substrate and including an opening or plural openings, and a plated layer electroplated in the opening and on the mask layer. A first condition that a diameter or width (&phgr;) of the opening has a relation of &phgr;≦0.35R, wherein (R) is a radius of curvature of the plated layer right above the opening, or a second condition that the diameter or width (&phgr;) of the opening is &phgr;≦10 &mgr;m, is met.

Abstract: As a method of fabricating aspherical microstructures, a protruding microstructure is formed on a substrate, an aspherical-profile forming layer is formed on the substrate and the protruding microstructure, and the aspherical-profile forming layer is hardened. An aspherical profile is formed on the protruding microstructure due to a surface tension of the aspherical-profile forming layer in the step of forming the aspherical-profile forming layer, and the aspherical profile is maintained through the step of hardening the aspherical-profile forming layer.

Abstract: In a fabrication method of a microstructure array, such as a mold for forming a microlens array, a first insulating mask layer is formed on a conductive portion of s substrate, an array of openings for the microstructure array and at least an opening for an alignment marker are formed in the first insulating mask layer during a common process to expose the conductive portion of the substrate at the openings, and first plated or electrodeposited layers are grown in the openings and on the first insulating mask layer using the conductive portion of the substrate as a cathode. The opening for the alignment marker is surrounded by the array of openings for the microstructure array, and a pattern of the opening for the alignment marker is determined such that a current density distribution at the time of electroplating or electrodeposition can be oppressed.

Abstract: This invention there provides a detergent for cleaning tire wheels, which is applied in a foamy state onto the tire wheels, thereby allowing a grime adhered to the surface of the tire wheels to come off from the tire wheels, which contains a surfactant, at least one alkali compound selected from the group consisting of ammonia and amino group-containing alkali compounds, and a color change indicator capable of changing its own color when transferred from an alkaline condition to a neutral condition, in which the alkali compound is contained in the detergent in such an amount that the compound is eliminated from the detergent by reaction with carbon dioxide for the same period of time as required to release most amounts of grime from the surface of tire wheels, and a method of cleaning tire wheels with the detergent.