Abstract: A noise suppression sheet comprises a non-magnetic metal layer, a plurality of metal magnetic layers, and a plurality of insulating layers, and the metal magnetic layer and the insulating layer are alternately laminated on the non-magnetic metal layer. The noise suppression sheet can absorb and suppress noise generated from a circuit or the like in an electronic component by being mounted on the electronic component or the like. In the noise suppression sheet, noise is absorbed by each of the metal magnetic layers. Noise that is transmitted without being absorbed by the metal magnetic layer can be reflected by the non-magnetic metal layer and can be absorbed again by the metal magnetic layer, and hence the noise suppression sheet can suppress noise effectively.

Abstract: A computer program causes a computer to execute processing of simulating behavior of an electromagnetic component including a coil at each of a plurality of time points based on an analytic model of the electromagnetic component. The processing comprises creating a look-up table storing a flux linkage of the coil, an inductance of the coil and a current in the coil that are obtained by a magnetic field analysis based on the analytic model in association with one another, and simulating behavior of the electromagnetic component by referring to the look-up table using currents in the coil calculated at a previous simulation step and at a step before the previous simulation step.

Abstract: A vehicle body rear structure includes: left and right rear side frames extending in a fore-and-aft direction in a rear part of a vehicle; a rear subframe attached to the rear side frames; left and right rear wheels supported by the rear subframe via respective suspensions; and a driving source mounted to the rear subframe. The driving source is arranged such that a center of gravity thereof is positioned more rearward than a rotation axis of the rear wheels. The rear subframe includes left and right rear subframe longitudinal members extending in the fore-and-aft direction and a rear subframe cross member extending laterally and joined to the rear subframe longitudinal members. The rear subframe cross member includes a protrusion that protrudes rearward at a laterally central part thereof. A rear end of the protrusion is positioned more rearward than a rear end of the driving source.

Abstract: A power amplifying circuit includes a first amplifying unit that amplifies a first radio-frequency signal and a second amplifying unit that amplifies a second radio-frequency signal. The first amplifying unit includes a first matching circuit that performs impedance matching for a circuit in a preceding stage, and a first amplifying circuit that amplifies the first radio-frequency signal that has passed through the first matching circuit. The second amplifying unit includes a second matching circuit that performs impedance matching for the circuit in the preceding stage, a resistor including a first end and a second end, the first end being electrically connected to the second matching circuit, and a second amplifying circuit that is electrically connected to the second end of the resistor and that amplifies the second radio-frequency signal that has passed through the resistor.

Abstract: A power amplifier module includes a substrate, an amplifier circuit including a plurality of transistors to be mounted on the substrate and a bump connected to the plurality of transistors, a harmonic termination circuit and an output matching circuit that are disposed in or on the substrate and configured to be electrically connected to the amplifier circuit, a connection pad disposed on the substrate and configured to be connected to the bump, and a plurality of connection wiring lines branching from the connection pad. The plurality of connection wiring lines include at least a first connection wiring line that connects the connection pad and the harmonic termination circuit to each other, a second connection wiring line that connects the connection pad and the output matching circuit to each other, and a third connection wiring line that connects the connection pad and an external power supply to each other.

Abstract: A service start method is a service start method executed by a communication system, and the service start method includes: a step of acquiring identification information or authentication information of a device, a customer, or a service; a step of making authentication of the device, the customer, or the service to succeed when the identification information or the authentication information has been acquired together with information that is associated with the customer or a customer's location in advance, or when the identification information or the authentication information has been acquired from a terminal or a line that is associated with the customer in advance; and a step of starting provision of the service for the device for which the authentication has succeeded.

Abstract: A three-way catalyst article, and its use in an exhaust system for internal combustion engines, is disclosed. The catalyst article for treating exhaust gas comprising: a substrate comprising an inlet end and an outlet end with an axial length L; a first catalytic region comprising a first platinum group metal (PGM) component and a first oxygen storage capacity (OSC) material, wherein the first OSC material has a fresh specific surface area (SSA) of at least 10 m2/g; and wherein the first OSC material has an SSA difference of no more than 30 m2/g between the fresh first OSC material and the aged first OSC material.

Abstract: A vehicle body rear structure includes: a pair of left and right rear side frames extending in a fore-and-aft direction in a rear part of a vehicle; a rear subframe attached to the rear side frames; and a pair of left and right shock-absorbing structures respectively provided at rear ends of the rear side frames and extending rearward. The rear subframe includes a pair of left and right rear subframe longitudinal members extending in the fore-and-aft direction and a rear subframe cross member extending laterally and joined to the left and right rear subframe longitudinal members. The rear subframe cross member includes a protrusion that protrudes rearward in a laterally central part thereof. A rear end of the protrusion is positioned more rearward than the rear ends of the rear side frames and more forward than rear ends of the shock-absorbing structures.

Abstract: A material for Cu pillars is formed as cylindrical preforms in advance and connecting these cylindrical preforms to electrodes on a semiconductor chip to form Cu pillars. Due to this, it becomes possible to make the height/diameter ratio of the Cu pillars 2.0 or more. Since electroplating is not used, the time required for production of the Cu pillars is short and the productivity can be improved. Further, the height of the Cu pillars can be raised to 200 ?m or more, so these are also preferable for moldunderfill. The components can be freely adjusted, so it is possible to easily design the alloy components to obtain highly reliable Cu pillars.

Abstract: In writing and reading data at a semiconductor storage device, control is carried out such that, at a time of a burst mode, in a case in which a value of a block address which is, from addresses assigned to a region of an internal address, an address for selecting a sense amplifier block from plural sense amplifier blocks, is a largest value, a first sense amplifier block and a second sense amplifier block are made to access different banks, and, in case in which the value of the block address is not the largest value, the first sense amplifier block and the second sense amplifier block are made to access a same bank of plural banks.

Abstract: A computer program causes a computer to execute processing of simulating behavior of an electromagnetic component including a coil at each of a plurality of time points based on an analytic model of the electromagnetic component. The processing comprises creating a look-up table storing a flux linkage of the coil, an inductance of the coil and a current in the coil that are obtained by a magnetic field analysis based on the analytic model in association with one another, and simulating behavior of the electromagnetic component by referring to the look-up table using currents in the coil calculated at a previous simulation step and at a step before the previous simulation step.

Abstract: This vehicle body substructure includes side sill load transmitting members that are provided inside each of side sills, a floor cross-member that is provided on one of an upper surface and a lower surface of a floor panel laid between the side sills and has extending portions extending toward upper portions of the side sill load transmitting members, an underfloor mounting component that is provided below the floor panel and includes an underfloor cross-member, underfloor frames that are attached to lower portions of the underfloor mounting component and the side sills, and underfloor load transmitting members that are provided in the underfloor frames and face the underfloor cross-member. The underfloor load transmitting member has an upper half portion which faces a lower portion of the side sill load transmitting members, and a lower half portion which is fixed to a part of each of the underfloor frames attached to a lower portion of each of the side sills.

Abstract: Provided is a method of producing a film-coated cylindrical honeycomb structure formed with a coating liquid on an outer portion of a cylindrical honeycomb structure including partition walls and the outer portion, the partition walls forming a plurality of cells, the outer portion serving as a circumferential side. In the method, the cylindrical honeycomb structure is mounted between at least two rollers such that the circumferential side of the cylindrical honeycomb structure contacts with circumferential sides of the rollers, the coating liquid supplied from an application part is deposited on the cylindrical honeycomb structure while being rotated, and then the deposited coating liquid is dried or cured to form the film on the outer portion.

Abstract: A switching circuit may include first and second switching elements that are connected in parallel with each other. A controller may be configured to selectively perform either a first switching control to drive the first switching element or a second switching control to drive the second switching element. The first switching element may be constituted mainly of a first semiconductor material, and the second switching element may be constituted mainly of a second semiconductor material having a narrower band gap than the first semiconductor material. The second switching element may be larger in size than the first switching element. The controller may be configured to switch to the second switching control when an instruction value and/or an actual value of the current exceeds a predetermined threshold value while performing the first switching control.

Abstract: A noise suppression sheet includes a metal magnetic layer composed of a FeNi alloy containing 78 to 84 wt % of Ni, the metal magnetic layer having 2 to 8 wt % of Si added thereto. The noise suppression sheet achieves excellent magnetic shielding characteristics. In the noise suppression sheet, particularly, a high electrical resistivity of 70 to 115 ??·cm is achieved in the metal magnetic layer, high magnetic permeability is maintained in a high frequency band of about 1 MHz to 10 MHz, and the frequency dependence of the dielectric constant is reduced.

Abstract: A video display system (1) includes a display device (10) displaying a display video image containing a transmitted background and a video image indicated by a video signal, and a video processing device (30) converting, based on a characteristic related to the transmitted background, the video image indicated by the video signal to be transmitted to the display device (10).

Abstract: The present invention provides a bonding wire for a semiconductor device, where the bonding wire can inhibit wear of capillary. In a Cu alloy bonding wire for a semiconductor device, a total of abundance ratios of a crystal orientations <110> and <111> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis is to crystal orientations on a wire surface 40% or more and 90% or less, in average area percentage.

Abstract: It is an object to provide a Cu alloy bonding wire for a semiconductor device that can satisfy required performance in high-density LSI applications. In the Cu alloy bonding wire for a semiconductor device according to the present invention, each of abundance ratios of crystal orientations <100>, <110> and <111> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis out of crystal orientations on a wire surface is 3% or more and less than 27% in average area percentage.

Abstract: The rear frame includes an inclined part that is inclined inward in, a vehicle width direction in going rearward and a horizontal part that extends rearward from a rear end of the inclined part. A rear part of the side sill includes a first enlarged width portion that increases in width inwardly in the vehicle width direction via a bent portion. A front part of the rear frame inclined part includes a second enlarged width portion that increases in width outwardly in the vehicle width direction. A rear end of the first enlarged width portion and a front end of the second enlarged width portion are connected. An inner wall in the vehicle width direction of the first enlarged width portion and an inner wall in the vehicle width direction of the inclined part are linearly continuous in plan view.

Abstract: A semiconductor device has stored therein a plurality of bits of fixed data. The semiconductor device includes a plurality of memory elements that correspond, respectively, to the plurality of bits of the fixed data, and that acquire, store, and output the value of each bit received at an input terminal of each of the memory elements according to a timing signal. An initialization control unit feeds, to the plurality of memory elements, an initialization signal upon receipt of a fixed data setting signal, each of the plurality of memory elements being initialized to a state of storing a corresponding value represented by a bit of the fixed data according to the initialization signal.