Abstract: A management device, comprising a controller that controls communication between a movable first terminal device and a second terminal device in which a moving range is narrower than the first terminal device, and a detector that detects that the first terminal device arrives at a target point by movement, wherein in a case where the detector detects the arrival at the target point, the controller ends the communication between the first terminal device and the second terminal device.

Abstract: A fixing apparatus, an image forming apparatus, and a nip width controlling method, capable of preventing deterioration in fixing quality by controlling the nip width with high accuracy, are provided. The fixing apparatus includes a pair of fixing members that are in pressure-contact with each other and in which at least one of the members rotates to thereby form a fixing nip that sandwiches and conveys a recording medium; a moving section that moves the pair of fixing members relative to each other in a direction in which the pair of fixing members are brought into pressure-contact with each other or in a direction opposite thereto; a detector that detects rotational torque for rotating any one of the pair of fixing members; and a control section that controls the moving section such that the pair of fixing members are moved relative to each other corresponding to the detected rotational torque.

Abstract: A wavelength dispersive X-ray fluorescence spectrometer includes a single one-dimensional detector (10) having detection elements (7) arranged linearly, and includes a detector position change mechanism (11) for setting a position of the one-dimensional detector (10) to either a parallel position at which an arrangement direction of the detection elements (7) is parallel to a spectral angle direction of a spectroscopic device (6) or an intersection position at which the arrangement direction intersects the spectral angle direction. At the parallel position, a receiving surface of the one-dimensional detector (10) is located at a focal point of focused secondary X-rays (42). At the intersection position, a receiving slit (9) is disposed at the focal point of the focused secondary X-rays (42), and the receiving surface is located at a traveling direction side of the focused secondary X-rays (42) farther from the spectroscopic device (6) than the receiving slit (9).

Abstract: The present invention provides a bonding wire for a semiconductor device suitable for cutting-edge high-density LSIs and on-vehicle LSIs by improving the formation rate of Cu—Al IMC in ball bonds. A bonding wire for a semiconductor device contains Pt of 0.1 mass % to 1.3 mass %, at least one dopant selected from a first dopant group consisting of In, Ga, and Ge, for a total of 0.05 mass % to 1.25 mass %, and a balance being made up of Cu and incidental impurities.

Abstract: A fiber module (1B) according to the present disclosure includes an input-side optical fiber (11), an output-side optical fiber (12), a ferrule (20) in which the input-side optical fiber and the output-side optical fiber are insertable in both ends and a groove (32) is formed in a direction orthogonal to a longitudinal direction (D1) in the middle of the longitudinal direction, a dielectric multilayer film filter (30) inserted in the groove, and an input-side GI fiber (15) and an output-side GI fiber (16) joined by fusion to respective terminal portions of the input-side optical fiber and the output-side optical fiber. The dielectric multilayer film filter is interposed between an end surface (15f) of the input-side GI fiber and an end surface (16f) of the output-side GI fiber in the longitudinal direction.

Abstract: It is an object to provide a Cu alloy bonding wire for a semiconductor device that can satisfy required performance in high-density LSI applications. In the Cu alloy bonding wire for a semiconductor device according to the present invention, each of abundance ratios of crystal orientations <100>, <110> and <111> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis out of crystal orientations on a wire surface is 3% or more and less than 27% in average area percentage.

Abstract: Objective discrimination of a disease label of a depressive symptom with respect to an active state of a brain is achieved. One means for solving the problems of the present invention is to provide a discriminating device for assisting in determination of whether a subject has a depressive symptom. The discriminating device includes a storage device for storing information for identifying a classifier generated by classifier generation processing based on a signal obtained by using a brain activity detecting apparatus to measure, in advance and time-sequentially, a signal indicating a brain activity of a plurality of predetermined regions of each brain of a plurality of participants in a resting state, the plurality of participants including healthy individuals and patients with depression.

Abstract: A method for manufacturing a monolithically integrated semiconductor optical integrated element comprising a DFB laser, an EA modulator, and a SOA disposed in a light emitting direction, comprising the step of forming a semiconductor wafer on which the elements are two-dimensionally arrayed and aligned the optical axes; cleaving the semiconductor wafer along a plane orthogonal to the light emitting direction to form a semiconductor bar including a plurality of the elements arranged one-dimensionally along a direction orthogonal to the light emitting direction such that the elements adjacent to each other share an identical cleavage end face as a light emission surface; inspecting the semiconductor bar by driving the SOA and the DFB laser through a connection wiring part together; and separating out the semiconductor bar after the inspection to cut the connection wiring part connecting the electrode of the SOA and the DFB laser to isolate from each other.

Abstract: Neurofeedback training executed by a brain activity training apparatus for performing a training to change the correlation of connectivity between brain areas utilizing correlation of measured connectivity between brain areas involves repetition of a plurality of trials. Each trial includes a resting period Trest, a self-regulation period TNF and a presenting period TScore presenting feedback information. The brain activity training apparatus calculates, from signals detected from a trainee in the resting period by a brain activity detecting device, a baseline level of degrees of activity of prescribed regions corresponding to the functional connectivity as the object of training, calculates, from signals detected in the self-regulation period and from the baseline level, time correlation of degrees of activity of the prescribed regions corresponding to the functional connectivity as the object of training, and calculates information to be fedback.

Abstract: A mirror panel includes a semitransmissive diffusion part and a reflecting surface. The semitransmissive diffusion part is configured to diffuse first part of incident light via an incident surface and linearly transmit second part of the incident light. The reflecting surface is disposed in contact with or adjacent to the semitransmissive diffusion part, and reflects light transmitted through the semitransmissive diffusion part toward the semitransmissive diffusion part.

Abstract: A tire deformation calculator includes a processor. The processor (i) detects a contour of a side face of a tire attached to a wheel of a vehicle in a captured image; (ii) calculates load deformation of the contour of the side face, the load corresponding to a weight of the vehicle; (iii) identifies a circular or polygonal shape or pattern on a plane parallel to the contour of the side face; (iv) determines a conversion value for converting the identified shape or pattern in the captured image to a perfect circle or a regular polygon; (v) calculates a predetermined value indicating the load deformation of the tire in the captured image based on the conversion value; and (vi) calculates the load deformation based on the predetermined value.

Abstract: Provided is a Pd coated Cu bonding wire for a semiconductor device capable of sufficiently obtaining bonding reliability of a ball bonded portion in a high temperature environment of 175° C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases. The bonding wire for a semiconductor device comprises a Cu alloy core material; and a Pd coating layer formed on a surface of the Cu alloy core material; and contains 0.03 to 2% by mass in total of one or more elements selected from Ni, Rh, Ir and Pd in the bonding wire and further 0.002 to 3% by mass in total of one or more elements selected from Li, Sb, Fe, Cr, Co, Zn, Ca, Mg, Pt, Sc and Y. The bonding wire can be sufficiently obtained bonding reliability of a ball bonded portion in a high temperature environment of 175° C. or more, even when the content of sulfur in the mold resin used in the semiconductor device package increases by being used.

Abstract: The present invention provides a bonding wire capable of simultaneously satisfying ball bonding reliability and wedge bondability required of bonding wires for memories, the bonding wire including a core material containing one or more of Ga, In, and Sn for a total of 0.1 to 3.0 at % with a balance being made up of Ag and incidental impurities; and a coating layer formed over a surface of the core material, containing one or more of Pd and Pt, or Ag and one or more of Pd and Pt, with a balance being made up of incidental impurities, wherein the coating layer is 0.005 to 0.070 ?m in thickness.

Abstract: A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.

Abstract: An insulated wire has a conductor, and an insulating film including a first insulating layer covering the conductor and a second insulating layer covering the first insulating layer. The second insulating layer contains a polyimide or a polyamideimide as a main component. The first insulating layer contains a reaction product of a carboxylic acid dianhydride and a diamine as an adhesive component and a component that is the same as the main component in the second insulating layer. At least one of the carboxylic acid dianhydride and the diamine has a carbonyl group.

Abstract: A video display system (1) includes a display device (10) displaying a display video image containing a transmitted background and a video image indicated by a video signal, and a video processing device (30) converting, based on a characteristic related to the transmitted background, the video image indicated by the video signal to be transmitted to the display device (10).

Abstract: In a copper alloy bonding wire for semiconductor devices, the bonding longevity of a ball bonded part under high-temperature and high-humidity environments is improved. The copper alloy bonding wire for semiconductor devices includes in total 0.03% by mass or more to 3% by mass or less of at least one or more kinds of elements selected from Ni, Zn, Ga, Ge, Rh, In, Ir, and Pt (first element), with the balance Cu and inevitable impurities. The inclusion of a predetermined amount of the first element suppresses production of an intermetallic compound susceptible to corrosion under high-temperature and high-humidity environments at the wire bonding interface and improves the bonding longevity of a ball bonded part.

Abstract: An apparatus comprises an evaluation acquiring unit that acquires information indicating an evaluation of a person and information indicating an activity condition of the person during an evaluation target interval, in association with each other. The person may be a passenger of a moving body. The evaluation target interval may be an interval during which the person rode in the moving body. The information indicating the evaluation may include information indicating a result obtained by another person who rode in the moving body during the evaluation target interval evaluating the person. The activity condition may include at least one of information indicating whether the person rode alone in the moving body and information indicating whether the person rode with a related person in the moving body.

Abstract: In writing and reading data at a semiconductor storage device, control is carried out such that, at a time of a burst mode, in a case in which a value of a block address which is, from addresses assigned to a region of an internal address, an address for selecting a sense amplifier block from plural sense amplifier blocks, is a largest value, a first sense amplifier block and a second sense amplifier block are made to access different banks, and, in case in which the value of the block address is not the largest value, the first sense amplifier block and the second sense amplifier block are made to access a same bank of plural banks.

Abstract: The present invention provides a Cu alloy bonding wire for a semiconductor device, where the bonding wire can satisfy requirements of high-density LSI applications. In the Cu alloy bonding wire for a semiconductor device, the abundance ratio of a crystal orientation <110> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis to crystal orientations on a wire surface is 25% or more and 70% or less in average area percentage.