Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract: [Object] An object of the present invention is to provide a sliding seal member having the characteristics of silicon carbide, such as hardness and low wear, and further having preferable sealing property and lubricating property. [Solving Means] There is provided a sliding seal member having a sliding surface which is slidable with other sliding member so as to seal a fluid by the sliding surface, comprising carbon fibers which are oriented substantially parallel to the sliding surface in a longitudinal direction of the carbon fibers and silicon carbide existing between the carbon fibers.

Abstract: A mechanical seal device for sealing a fluid inside of machine at a space formed between a stuffing box and a rotary shaft, comprises a seal cover attached to the stuffing box, a stationary seal ring attached to the seal cover and provided with a first seal surface, a rotary seal ring attached to the rotary shaft and provided with a second seal surface capable of sliding on the first seal surface, and a collar rotating together with the rotary shaft. The seal surface of either one of the stationary seal ring and the rotary seal ring is formed so that a face width of a radial direction is narrower than the other seal surface. A clearance is formed between a back surface opposing to the second seal surface of the rotary seal ring and the collar. The rotary seal ring is elastically held in an axial direction of the rotary shaft to rotate together with the collar.

Abstract: A mechanical seal having a seal cover that has a high versatility and is less prone to deformation even when secured to a housing by two bolts is provided. A mechanical seal 100 includes a rotating ring 40, a stationary ring 20, and a seal cover 10 to attach the stationary ring 20 to a housing 300. The seal cover 10 includes two U-shaped grooves 11 and two elongate holes 12 for bolting, which are disposed alternately and at regular intervals in a circumferential direction of the shaft hole, and elongate holes 12 are elongate in a radial direction of the shaft hole and innermost positions within the elongate holes 12 where bolt shanks can pass through are located further inward than innermost positions within the U-shaped grooves 11 where bolt shanks can pass through.

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

Abstract: A method for processing test results from testing operation of software. A test result of pass, fail status, or unperformed is received for each test case of a test performed for each release of the software. A group to which each test belongs is ascertained. A test result stability index is calculated for each test case as being proportional to a total number of consecutive releases that include and are prior to the last release of the software such that the test result for each of the consecutive releases denotes a pass. A module stability index is calculated for each test case as being a summation over a product of a weight at each release and a binary stability indicator of 0 at each release for which the test result is changed from that of the immediately prior release and 1 at every other release.

Abstract: A method and system for processing test results from testing operation of software. A test result of pass, fail status, or unperformed is received for each test case of a test performed for each release of the software. A group to which each test belongs is ascertained which determines a group identifier of the group to which each test belongs. A test result stability index is calculated for each test case as being proportional to a total number of consecutive releases that include and are prior to the last release of the software such that the test result for each of the consecutive releases denotes a pass. The group identifier and the test result stability index are stored in a hardware storage unit.

Abstract: A method and system for processing test results from testing operation of software. A test result of pass, fail status, or unperformed is received for each test case of a test performed for each release of the software. A group to which each test belongs is ascertained which determines a group identifier of the group to which each test belongs. A test result stability index is calculated for each test case as being proportional to a total number of consecutive releases that include and are prior to the last release of the software such that the test result for each of the consecutive releases denotes a pass. The group identifier and the test result stability index are stored in a hardware storage unit.

Abstract: A system for implementing a method for processing test results from testing operation of software. A test result of pass, fail status, or unperformed is received for each test case of a test performed for each release of the software. A group to which each test belongs is ascertained. A test result stability index is calculated for each test case as being proportional to a total number of consecutive releases that include and are prior to the last release of the software such that the test result for each of the consecutive releases denotes a pass. A module stability index is calculated for each test case as being a summation over a product of a weight at each release and a binary stability indicator of 0 at each release for which the test result is changed from that of the immediately prior release and 1 at every other release.

Abstract: A method for processing test results from testing operation of software. A test result of pass, fail status, or unperformed is received for each test case of a test performed for each release of the software. A group to which each test belongs is ascertained. A test result stability index is calculated for each test case as being proportional to a total number of consecutive releases that include and are prior to the last release of the software such that the test result for each of the consecutive releases denotes a pass. A module stability index is calculated for each test case as being a summation over a product of a weight at each release and a binary stability indicator of 0 at each release for which the test result is changed from that of the immediately prior release and 1 at every other release.

Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

Abstract: A mechanical seal device includes a rotational seal ring connected to a rotational shaft, having a rotational seal surface and arc-shaped grooves arranged on the rotational seal surface. The grooves are sectionalized by partition walls. A stationary seal ring has a stationary seal surface facing the rotational seal surface of the rotational seal ring. A spring biases the stationary seal ring against the rotational seal ring. Outlet portions are formed on the stationary seal surface of the stationary seal ring and connect with a fluid supply path for supplying a pressure fluid. A circumferential direction length (W3) of each outlet portion is made to be ½ of a circumferential direction length (W1) of each partition wall or longer (W3?W1/2); and a circumferential direction length (W3) of the outlet portions is made to be shorter than a circumferential direction length (W2) of the arc-shaped grooves (W3<W2).

Abstract: Carbon nanotubes, which carry surface functional groups on side walls thereof relative to lengths thereof, and a dispersant are added to a base liquid to provide a heat transport medium capable of achieving high heat conductivity while suppressing an increase in kinetic viscosity.

Abstract: A method, computer program product, and device for identifying a target key for a touch input are provided. The method, computer program product, and device provide for detecting a first location at which a first touch input is made, determining a first identification area that includes the first location at which the first touch input is made, obtaining a relative location of the first touch input in the first identification area, detecting a second location at which a second touch input following the first touch input is made, and identifying a target key for the second touch input based on the relative location and a distance between the first and second locations.

Abstract: A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

Abstract: Carbon nanotubes, which carry surface functional groups on side walls thereof relative to lengths thereof, and a dispersant are added to a base liquid to provide a heat transport medium capable of achieving high heat conductivity while suppressing an increase in kinetic viscosity.