Abstract: An optical module includes a substrate in which a through hole or a recess is formed; a first component that is arranged in the through hole or the recess of the substrate, and is bonded to an inner wall surface of the through hole or the recess by a thermosetting adhesive in a portion of a gap between the first component and the inner wall surface of the through hole or the recess; and a second component that is connected to an electrode on one surface of the first component and an electrode on one surface of the substrate, across the gap between the first component and the inner wall surface of the through hole or the recess.

Abstract: A cooling plate includes: first comb tooth flow paths extending from a first common flow path; second comb tooth flow paths extending from a second common path; first vertical flow paths each of which extends from the first comb tooth flow path; second vertical flow paths each of which extends from the second comb tooth flow path; first outer flow paths each of which extends from the first vertical flow path; second outer flow paths that are alternately adjacent to the first outer flow path; first coupling flow paths each of which extends from the first comb tooth flow path or the first outer flow path; second coupling flow paths that are alternately adjacent to the first coupling flow path; and heat receiving flow paths each of which communicates with the first coupling flow path and the second coupling flow path to receive heat of the heat receiving surface.

Abstract: An optical fiber mounting method that mounts a plurality of optical fibers on a substrate includes: bundling the optical fibers together with a bundling member; adjusting a height of the bundling member from a surface of the substrate or an angle of inclination of the bundling member relative to the surface of the substrate; bringing end faces of the optical fibers bundled with the bundling member into contact with end faces of optical waveguides on the substrate, the optical waveguides respectively corresponding to the optical fibers; and bonding the optical fibers to the substrate, in a state where the end faces of the optical fibers are in contact with the end faces of the optical waveguides.

Abstract: An optical fiber mounting method that mounts a plurality of optical fibers on a substrate includes: bundling the optical fibers together with a bundling member; adjusting a height of the bundling member from a surface of the substrate or an angle of inclination of the bundling member relative to the surface of the substrate; bringing end faces of the optical fibers bundled with the bundling member into contact with end faces of optical waveguides on the substrate, the optical waveguides respectively corresponding to the optical fibers; and bonding the optical fibers to the substrate, in a state where the end faces of the optical fibers are in contact with the end faces of the optical waveguides.

Abstract: A cooling plate includes: first comb tooth flow paths extending from a first common flow path; second comb tooth flow paths extending from a second common path; first vertical flow paths each of which extends from the first comb tooth flow path; second vertical flow paths each of which extends from the second comb tooth flow path; first outer flow paths each of which extends from the first vertical flow path; second outer flow paths that are alternately adjacent to the first outer flow path; first coupling flow paths each of which extends from the first comb tooth flow path or the first outer flow path; second coupling flow paths that are alternately adjacent to the first coupling flow path; and heat receiving flow paths each of which communicates with the first coupling flow path and the second coupling flow path to receive heat of the heat receiving surface.

Abstract: A cooling plate includes a main body portion including a cooling surface; a first flow path formed inside the main body portion and configured to receive a refrigerant from a pump side; a second flow path formed inside the main body portion and configured to discharge the refrigerant to the pump side; a third flow path provided closer to a side of the cooling surface than the first flow path and the second flow path in the main body portion and configured to couple the first flow path and the second flow path; and a reduced diameter portion formed in the third flow path and configured to narrow a flow path diameter of the third flow path.

Abstract: A composite bump includes a plurality of first bumps that is metal-bonded to an electrode pad of a semiconductor chip, and a second bump that is metal-bonded to the plurality of first bumps. A method for forming a composite bump, includes forming a plurality of first bumps to be metal-bonded to an electrode pad of a semiconductor chip, and forming a second bump to be metal-bonded to the plurality of first bumps.

Abstract: An optical module includes a circuit board having, an electronic circuit formed therein and an optical circuit mounted thereon, and coupled to a first end of an inner optical fiber, a connector assembly to which a second end of the inner optical fiber is fixed, and a housing including a first housing including a slid surface on which a sliding surface included in the connector assembly slides so as to position the connector assembly, a second housing including an engaging protrusion engaged with the positioned connector assembly so as to fix the connector assembly, the second housing being bonded to the first housing and the housing being mounted with the circuit board.

Abstract: An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.

Abstract: A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.

Abstract: An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.

Abstract: A cooling plate includes a main body portion including a cooling surface; a first flow path formed inside the main body portion and configured to receive a refrigerant from a pump side; a second flow path formed inside the main body portion and configured to discharge the refrigerant to the pump side; a third flow path provided closer to a side of the cooling surface than the first flow path and the second flow path in the main body portion and configured to couple the first flow path and the second flow path; and a reduced diameter portion formed in the third flow path and configured to narrow a flow path diameter of the third flow path.

Abstract: A board module includes a first board having an inner wall that has a protrusion and defines a through hole. The board module includes a second board provided in the through hole and joined to the protrusion by using a resin. The board module includes a third board joined above and across the first board and the second board.

Abstract: An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.

Abstract: A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.

Abstract: Electronic equipment includes: a substrate configured to include a first component, a second component, and an interconnection part that couples the first component with the second component by electric interconnections; and an exterior part configured to cover the first component, the second component, and the interconnection parts, and include a first exterior section that covers at least a portion of the first component, and a second exterior section that covers at least a portion of the interconnection parts, a thickness of the first exterior section being different from a thickness of the second exterior section to form a level difference in a boundary part between the first exterior section and the second exterior section.

Abstract: An optical module includes a circuit board having, an electronic circuit formed therein and an optical circuit mounted thereon, and coupled to a first end of an inner optical fiber, a connector assembly to which a second end of the inner optical fiber is fixed, and a housing including a first housing including a slid surface on which a sliding surface included in the connector assembly slides so as to position the connector assembly, a second housing including an engaging protrusion engaged with the positioned connector assembly so as to fix the connector assembly, the second housing being bonded to the first housing and the housing being mounted with the circuit board.

Abstract: An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.

Abstract: A composite bump includes a plurality of first bumps that is metal-bonded to an electrode pad of a semiconductor chip, and a second bump that is metal-bonded to the plurality of first bumps. A method for forming a composite bump, includes forming a plurality of first bumps to be metal-bonded to an electrode pad of a semiconductor chip, and forming a second bump to be metal-bonded to the plurality of first bumps.

Abstract: An optical module includes a housing; a substrate configured to have a through hole; a first chip configured to have a first heating member and be disposed inside the through hole; a second chip configured to have a second heating member, the second chip being placed on the substrate and the first chip with a bump interposed; a first heat conduction member configured to be sandwiched between a lower wall of the housing and the first chip and transfer heat generated by the first heating member to the lower wall of the housing; and a second heat conduction member configured to be sandwiched between an upper wall of the housing and the second chip and transfer heat generated by the second heating member to the upper wall of the housing.