Abstract: The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

Abstract: The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

Abstract: The ultrasonic crimping apparatus of the invention includes: a supporting section that supports a crimped object having a crimped section with a through hole formed therein; a crimping member in a bar shape that is smaller toward a front end thereof and larger toward a rear end thereof; a driving section that causes the crimping member to be inserted in the through hole, first from the front end thereof; an ultrasonic application section that applies ultrasonic wave to the crimping member, thereby causing radial displacement of the crimping member; and a crimping control section that causes the crimping member to be inserted into the through hole of the crimped object, while causing application of ultrasonic wave to the crimping member, thereby causing the crimped section of the crimped object to be crimped.

Abstract: The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

Abstract: The wire bonding method includes: a first connecting step of supplying an end of wire for electric wiring to a first electrode on an IC chip and applying vibration to the wire, thereby connecting the end of the wire to the first electrode; a wire stretching step of stretching the wire whose end is connected to the first electrode up to a second electrode on a different member from the IC chip; and a second connecting step of connecting the wire to the second electrode by applying vibration, in an extension direction of the wire stretched from the first electrode to the second electrode, to a portion of the wire overlapping the second electrode.

Abstract: A method includes a step of preparing a strap having a connecting metal pattern formed on a base, and mounted with the circuit chip, the pattern connecting a circuit chip to a metal antenna pattern. A substrate has a concave section which houses the circuit chip and is formed on a first face. The metal antenna pattern extends over a first face and a second face of the base so as to circle them except for the concave section and to have the both ends positioned across the concave section. The method includes a connection step of positioning and directing the strap and the substrate to house the circuit chip in the concave section and covering the strap and the substrate with a covering material so as to fix the strap and the substrate in a state where the connection metal pattern is connected to the metal antenna pattern.

Abstract: An RFID tag manufacturing method manufactures an RFID tag which has flattened surfaces and serves as a metal tag. The method includes a surface-layer-forming step of forming a surface layer having a predetermined thickness on a base plate on which a metal antenna pattern is formed and a mounting step for mounting a circuit chip on the base plate such that the circuit chip is connected to the both ends of the metal antenna pattern.

Abstract: In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess.

Abstract: When crimping suspensions to carriage arms using a metal ball by applying ultrasonic vibration to a crimping tool, the suspensions can be crimped to the carriage arms without causing deformation to the suspensions and the like. A method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to the crimping tool to crimp the suspensions to the carriage arms. When doing so, a ball, such as a ball whose surface has been subjected to a dimpling process, for which a load that acts on the ball when the ball passes through the crimping holes is low compared to a spherical ball is used to crimp the suspensions to the carriage arms.

Abstract: There is provided a method of assembling a carriage assembly that can crimp suspensions to carriage arms by applying ultrasonic vibration to a crimping tool without causing deformation of the suspensions and the like. The method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a metal ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to a crimping tool to crimp the suspensions to the carriage arms. The suspensions are crimped to the carriage arms by detecting stress that acts on the crimping tool when the metal ball is pressed in by the crimping tool and controlling the amplitude of the ultrasonic vibration applied to the crimping tool so as to increase and decrease in accordance with the magnitude of the stress.

Abstract: A method of assembling a carriage assembly and an assembling apparatus that uses the same are capable of suppressing fluctuation in the crimped (deformed) states of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes 10a provided in carriage arms 10 with spacer holes 12b of suspensions 12 and then passes a ball 20 with a diameter equal to or greater than an inner diameter of the spacer holes 12b through the spacer holes 12b to crimp edge portions of the spacer holes 12b in spacer portions 12a and thereby attach the suspensions 12 to the carriage arms 10. While the ball 20 is being pressed and sandwiched from both sides of the spacer holes 12b by two pressure-applying members 40a, 40b and ultrasonic vibration is applied to the two pressure-applying members 40a, 40b, the two pressure applying members 40a, 40b are moved so as to pass the ball 20 through the spacer holes 12b.

Abstract: A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure applying member, the pressure applying member is caused to vibrate on a two dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.

Abstract: The ultrasonic mounting method is capable of uniformly bonding bumps of an electronic component to a circuit board and improving reliability of ultrasonic-mounting the electronic component. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. The ultrasonic vibrations are applied in a direction parallel to a surface of the electronic component, and loads are vertically applied to the surface of the electronic component in conjunction with vibration cycles of the ultrasonic vibrations.

Abstract: When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on the semiconductor chip to mount the semiconductor chip on a circuit board by flip-chip bonding. As the circuit board, a circuit board is used where protrusion patterns are provided at positions on bonding patterns to which the semiconductor chip is bonded corresponding to antinodes of vibration for a case where the bonding patterns resonate due to ultrasonic vibration applied by the semiconductor chip.

Abstract: A method of bonding and a bonding apparatus for a semiconductor chip that apply ultrasonic vibration to the semiconductor chip to bond the semiconductor chip to a substrate carry out leveling effectively at low cost and in a short time and can improve the bonding between the semiconductor chip and the substrate. In a positioning step, bumps of the semiconductor chip and pads of the substrate are positioned and placed in contact. In a leveling step, ultrasonic vibration of a first predetermined frequency is applied to the semiconductor chip to make the bumps of the semiconductor chip and the pads of a substrate rub against each other to level the bumps. In a bonding step, ultrasonic vibration of a second predetermined frequency that differs to the first predetermined frequency is applied to the semiconductor chip to bond the bumps and pads of the semiconductor chip and the substrate.

Abstract: The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

Abstract: A method of bonding and a bonding apparatus for a semiconductor chip uses ultrasonic vibration but can improve the bonds between electrode terminals of a semiconductor chip and a substrate. In a method of bonding a semiconductor chip that places electrode terminals of the semiconductor chip and electrode terminals of a substrate in contact and applies ultrasonic vibration to the semiconductor chip to bond the electrode terminals of the semiconductor chip and the substrate together, the ultrasonic vibration is compressional waves that are transmitted to the semiconductor chip and is set so that a half-wavelength of the ultrasonic vibration is a length given by multiplying a gap between adjacent electrode terminals in a direction of the compressional waves by a reciprocal of a natural number, and maximum amplitude points are located at positions of the respective electrode terminals of the semiconductor chip and the substrate.

Abstract: A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

Abstract: A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

Abstract: A method of flip-chip bonding can favorably activate the bonding surfaces and remove oxide films when bonding pads and bumps of a semiconductor chip and a substrate and avoids problems such as the bumps being excessively flattened and the bonds between connection terminals being destroyed by subsequent ultrasonic vibration.