Patents by Inventor Takayuki Iwasaki

Takayuki Iwasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120153890
    Abstract: A control device of a vehicle which device makes a generated voltage of an alternator variable so that a state of charge SOC of a battery installed in the vehicle reaches a control target includes an idle stop permitting SOC setting unit for setting a battery state of charge SOC in which idle stop is permissible, and a battery SOC adjusting unit for reducing and resetting a control target of the battery state of charge SOC in a range beyond the idle stop permitting SOC when a predetermined operation condition holds.
    Type: Application
    Filed: January 6, 2010
    Publication date: June 21, 2012
    Inventors: Kazuma Takahashi, Takayuki Iwasaki
  • Publication number: 20120003429
    Abstract: A cover film comprising a substrate layer, an intermediate layer comprising a resin composition containing 50% by mass or more of a metallocene linear low-density polyethylene resin having a density of 0.900 to 0.940×103 kg/m3, and a sealant layer comprising an ethylene-type copolymerized resin containing 50 to 85% by mass of an olefin component.
    Type: Application
    Filed: March 5, 2010
    Publication date: January 5, 2012
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Takayuki Iwasaki, Tetsuo Fujimura, Akira Sasaki
  • Publication number: 20110274551
    Abstract: A production method enables use of ultrasonic forming but does not leave a bonding face in a final product. One cuts into a plate member having a first side face and a second side face from the first side face toward the second side face to form a slit that does not reach the second side face; seals lips of the slit to leave an opening; causes superplastic forming of the plate member by pressurizing the plate member in a mold with gas through the opening; and cuts out a portion including the sealed lips.
    Type: Application
    Filed: January 22, 2010
    Publication date: November 10, 2011
    Applicant: IHI Corporation
    Inventor: Takayuki Iwasaki
  • Publication number: 20110274555
    Abstract: A production method uses ultrasonic forming but does not leave a bonding face exposed to the exterior in a final product. The production method of a leading edge member of a fan blade comprises the steps of causing superplastic forming by using a combination of a first mold having a flow path for gas and a second mold having a female mold to pressurize a plate member with the gas through the flow path to fit the plate member onto the female mold; bonding a backing with the plate member processed with the superplastic forming; and cutting out a periphery of the plate member to obtain a product shape.
    Type: Application
    Filed: January 22, 2010
    Publication date: November 10, 2011
    Applicant: IHI Corporation
    Inventor: Takayuki Iwasaki
  • Patent number: 7704591
    Abstract: A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 ?m, and has an antistatic agent applied thereon to form an antistatic layer.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: April 27, 2010
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takeshi Ono, Masanori Higano, Masanori Ishii, Takayuki Iwasaki
  • Publication number: 20090246518
    Abstract: To provide a cover film with which the temperature range of a sealing iron to obtain peel strength is wide and stability of peel strength is good at the time of peeling, and which is excellent in heat sealing properties to a carrier tape. A cover film comprising a substrate layer and a sealant layer, wherein the substrate layer is made of a biaxially oriented polyester and/or a biaxially oriented polypropylene, the sealant layer contains a hydrogenated resin (a) of a block copolymer of an aromatic vinyl compound and a conjugated diene type hydrocarbon compound, the amount of the aromatic vinyl compound in the resin (a) is at least 20 mass % and at most 45 mass %, and the flowability of the resin (a) is from 1 to 20 g/10 min at a temperature of 230° C. under a load of 2.16 kgf by a measurement method stipulated in JIS K 7210.
    Type: Application
    Filed: April 24, 2007
    Publication date: October 1, 2009
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Tetsuo Fujimura, Takayuki Iwasaki, Masanori Higano, Masatoshi Kawata
  • Publication number: 20090179235
    Abstract: A semiconductor device in which the self-turn-on phenomenon is prevented that can significantly improve power conversion efficiency. The semiconductor device is a system-in-package for power supply applications in which a high-side switch, a low-side switch, and two drivers are included in a single package. The device includes an auxiliary switch disposed between the gate and source of said low-side switch, and a low-side MOSFET 3 for the low-side switch and an auxiliary MOSFET 4 for the auxiliary switch are disposed on the same chip. In this way, the self-turn-on phenomenon can be prevented, allowing the mounting of a low-side MOSFET 3 with a low threshold voltage and thereby significantly improving power conversion efficiency. The gate of the auxiliary MOSFET 4 is driven by the driver for the high-side MOSFET 2, thereby eliminating the need for a new drive circuit and realizing the same pin configuration as existing products, which facilitates easy replacement.
    Type: Application
    Filed: March 17, 2009
    Publication date: July 16, 2009
    Inventors: Masaki Shiraishi, Takayuki Iwasaki, Nobuyoshi Matsuura
  • Patent number: 7522692
    Abstract: A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: April 21, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Seigoh Yukutake, Yasuyuki Kojima, Minehiro Nemoto, Masatsugu Amishiro, Takayuki Iwasaki, Shinichiro Mitani, Katsuhiro Furukawa, Chiyoshi Kamada, Atsuo Watanabe, Takayuki Oouchi, Nobuyasu Kanekawa
  • Patent number: 7514731
    Abstract: A semiconductor device in which the self-turn-on phenomenon is prevented that can significantly improve power conversion efficiency. The semiconductor device is a system-in-package for power supply applications in which a high-side switch, a low-side switch, and two drivers are included in a single package. The device includes an auxiliary switch disposed between the gate and source of said low-side switch, and a low-side MOSFET 3 for the low-side switch and an auxiliary MOSFET 4 for the auxiliary switch are disposed on the same chip. In this way, the self-turn-on phenomenon can be prevented, allowing the mounting of a low-side MOSFET 3 with a low threshold voltage and thereby significantly improving power conversion efficiency. The gate of the auxiliary MOSFET 4 is driven by the driver for the high-side MOSFET 2, thereby eliminating the need for a new drive circuit and realizing the same pin configuration as existing products, which facilitates easy replacement.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: April 7, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Masaki Shiraishi, Takayuki Iwasaki, Nobuyoshi Matsuura
  • Patent number: 7401478
    Abstract: The manufacturing method comprises: a softening step of softening a straight glass tube in a heating furnace; a moving and placing step of moving the softened glass tube so that the glass tube is placed on the top of the mandrel; and a winding step of winding the glass tube placed on the top of the mandrel around the periphery of the mandrel. The mandrel is disposed beneath the glass tube starting to get soft, and the glass tube being soft is perpendicularly lowered in order to be placed on the top of the mandrel. In the winding step, the winding speed Vr at which the glass tube is wound around the mandrel is higher than the moving speed Vs at which chuck units holding the ends of the glass tube move toward the mandrel.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: July 22, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tatsuhiro Yabuki, Noriyuki Uchida, Takayuki Iwasaki, Shiro Iida
  • Patent number: 7387230
    Abstract: In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form the brazing filler metal composition. By powder roll compaction of the powder, the powder is formed into a sheet shape.
    Type: Grant
    Filed: December 26, 2003
    Date of Patent: June 17, 2008
    Assignee: Ishikawajima-Harima Heavy Industries Co., Ltd.
    Inventors: Chitoshi Mochizuki, Takayuki Iwasaki, Hiroki Yoshizawa
  • Patent number: 7289553
    Abstract: A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: October 30, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Seigoh Yukutake, Yasuyuki Kojima, Minehiro Nemoto, Masatsugu Amishiro, Takayuki Iwasaki, Shinichiro Mitani, Katsuhiro Furukawa, Chiyoshi Kamada, Atsuo Watanabe, Takayuki Oouchi, Nobuyasu Kanekawa
  • Publication number: 20070184243
    Abstract: A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 ?m, and has an antistatic agent applied thereon to form an antistatic layer.
    Type: Application
    Filed: April 25, 2005
    Publication date: August 9, 2007
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takeshi Ono, Masanori Higano, Masanori Ishii, Takayuki Iwasaki
  • Publication number: 20070153886
    Abstract: A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.
    Type: Application
    Filed: March 7, 2007
    Publication date: July 5, 2007
    Inventors: Seigoh Yukutake, Yasuyuki Kojima, Minehiro Nemoto, Masatsugu Amishiro, Takayuki Iwasaki, Shinichiro Mitani, Katsuhiro Furukawa, Chiyoshi Kamada, Atsuo Watanabe, Takayuki Oouchi, Nobuyasu Kanekawa
  • Publication number: 20070045727
    Abstract: A technology capable of realizing a MOSFET with low ON-resistance and low feedback capacitance, in which the punch through of a channel layer can be prevented even when the shallow junction of the channel layer is formed in a planar type MOSFET is provided. A P type polysilicon is used for a gate electrode in a planar type MOSFET, in particular, in an N channel DMOSFET.
    Type: Application
    Filed: August 24, 2006
    Publication date: March 1, 2007
    Inventors: Masaki Shiraishi, Takayuki Iwasaki, Nobuyoshi Matsuura, Yoshito Nakazawa, Tsuyoshi Kachi
  • Patent number: 7134307
    Abstract: A plate rolling mill includes a pair of work rolls that hold and press down a plate material therebetween, a plurality of backup rolls that prevent the work rolls from being deformed, and intermediate rolls each of which is disposed between the work roll and the backup roll so as to be shiftable. Each of the intermediate rolls has a contact roll portion that contacts with the backup roll, and an extension barrel portion that is connected to an end of the contact roll portion and does not contact the backup roll at any shifted position. The contact roll is formed to have a convex shape such that a convex center of the contact roll is positioned at a side of the extension barrel portion.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: November 14, 2006
    Assignee: Ishikawajima-Harima Heavy Industries Co., Ltd.
    Inventors: Hisashi Honjo, Takayuki Iwasaki
  • Patent number: 7109577
    Abstract: A power MOS-FET is used as a high side switch transistor for a non-insulated DC/DC converter. An electrode section that serves as a source terminal of the power MOS-FET is connected to one outer lead and two outer leads via bonding wires respectively. The outer lead is an external terminal connected to a path for driving the gate. Each of the outer leads is an external terminal connected to a main current path. Owing to the connection of the main current path and the gate driving path in discrete form, the influence of parasitic inductance can be reduced and voltage conversion efficiency can be improved.
    Type: Grant
    Filed: May 3, 2004
    Date of Patent: September 19, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Masaki Shiraishi, Takayuki Iwasaki, Nobuyoshi Matsuura, Tomoaki Uno
  • Patent number: 7093473
    Abstract: An apparatus for manufacturing a band plate has a rolling mill that includes a pair of upper and lower work rolls that roll a slab material having edge drop portions at both ends thereof, and a pair of backup rolls that contact non-rolling side surfaces of the pair of upper and lower work rolls, respectively to prevent the work rolls from being deformed. The work roll includes a reverse taper portion where a roll diameter gradually increases towards a barrel end portion thereof corresponding to the edge drop portion. The upper and lower work rolls are configured to be shiftable individually in the axial direction thereof. The backup roll includes an escape portion whose diameter gradually decreases towards an axial end thereof so as not to contact the reverse taper portion of the work roll, within a shifting range of the work roll.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: August 22, 2006
    Assignee: Ishikawajima-Harima Heavy Industries Co., Ltd.
    Inventors: Hisashi Honjo, Takayuki Iwasaki
  • Patent number: 7089525
    Abstract: The number of design processes for fabricating semiconductor devices can be reduced by parallel connection of a plurality of unit bipolar transistors Qu that are completely electrically isolated from each other in a semiconductor layer of an SOI substrate 1 to form a bipolar transistor having a large current capacity.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: August 8, 2006
    Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.
    Inventors: Yoichi Tamaki, Takayuki Iwasaki, Kousuke Tsuji, Chiyoshi Kamada
  • Publication number: 20060163322
    Abstract: In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form the brazing filler metal composition. By powder roll compaction of the powder, the powder is formed into a sheet shape.
    Type: Application
    Filed: December 26, 2003
    Publication date: July 27, 2006
    Inventors: Chitoshi Mochizuki, Takayuki Iwasaki