Abstract: Provided is a shape measuring device for a hose connector fitting. Two-dimensional shape detection units detect radial position data of a surface of a socket in radial direction with respect to an axial center of a hose connector fitting along a direction parallel with the axial center of the hose connector fitting completely across a circumference of the socket. The measurement data relates to the surface of the socket, including outer diameters, crimping positions, crimping claw remaining widths, roundness, and cylindricity of the socket.

Abstract: A robot suction hand mountable on an industrial robot and configured to hold a workpiece by suction using a suction unit. The robot suction hand includes: a vacuum pump incorporated in the robot suction hand. The vacuum pump has a housing in which an intake port and an exhaust port are formed, and configured to intermittently take in air from the intake port and intermittently discharge air from the exhaust port. The robot suction hand includes a suction path that communicates with the suction unit and the intake port and a first member made of a porous material. The first member covers the exhaust port.

Abstract: In an adjustment device for a frictional force adjustment portion in a section, an inner circumferential portion of the section includes: a support hole formed from rolling bearings at both ends; a frictional force generation portion configured of a brake shoe, a coil spring, and a hexagon socket set screw and generates a frictional force against a rotary shaft inserted into the support hole; and a frictional force adjustment portion configured of the hexagon socket set screw and adjusts the frictional force in the frictional force generation portion. The adjustment member driving actuator adjusts the frictional force of the frictional force adjustment portion by rotating normally and reversely the adjustment member such that the frictional force in the frictional force generation portion of the section falls within a predetermined range.

Abstract: An offset calculation device includes a determination unit configured to determine a rotation state of an object having an angular velocity sensed by a gyro sensor based on a moving average value of sensed angular velocity during a plurality of time periods differing from each other, the moving average value being calculated from chronological data of numerical values corresponding to the sensor data output from the gyro sensor. The offset calculation device further includes a calculation unit configured to calculate an offset value of the sensor data based on the sensor data corresponding to a time period in which the target object was deemed to be in a non-rotation state by the determination unit.

Abstract: In a hose connector fitting, an outer circumferential surface of a socket is crimped toward a radially inner side thereof within a crimping range along an axis direction of the socket in the state where a hose is inserted into an annular space between an outer circumferential portion of a nipple and an inner circumferential portion of the socket. A shape measuring device includes: a sensor and a rotational moving unit that detect distance data from a reference position to the surface of the socket over a zone including at least the entire crimping range; a shape data generating unit that generates shape data representative the three-dimensional shape of the socket surface based on the detected distance data; and a measurement data calculating unit that calculates measurement data about the crimping state of the socket based on the shape data.

Abstract: Provided is a shape measuring device for a hose connector fitting. Two-dimensional shape detection units detect radial position data of a surface of a socket in radial direction with respect to an axial center of a hose connector fitting along a direction parallel with the axial center of the hose connector fitting completely across a circumference of the socket. The measurement data relates to the surface of the socket, including outer diameters, crimping positions, crimping claw remaining widths, roundness, and cylindricity of the socket.

Abstract: In order to provide a temperature and humidity sensor with improved reliability, the temperature and humidity sensor in which all or part of a case of the temperature and humidity sensor is inserted into a main duct for causing gas to pass through and which detects humidity of the gas, includes: a first sub-passage configured as a part of the case, a part of the gas passing through the main duct flowing in substantially the same direction as a flow in the main duct; a throttle section provided between an inlet and an outlet of the first sub-passage and on an inner surface of the first sub-passage, the throttle section having a throttle whose cross-sectional area is smaller than an average cross-sectional area of the entire first sub-passage; and a second sub-passage which connects an upstream side and a downstream side of the throttle section and is different from the first sub-passage.

Abstract: Provided are a metal wire rod drawing die that has a longer life than conventional dies and that can prevent damage to a metal wire rod surface and a method for manufacturing the die. In a metal wire rod drawing die (1), a die hole (2) for inserting a metal wire rod is formed. Where Ra1 represents a surface roughness of an inner surface of the die hole from a bearing section (2b) to an approach section (2a) corresponding to an area reduction rate of 30% in an axial direction of the die hole, Ra2 represents a surface roughness of the inner surface of the die hole from the bearing section to the approach section corresponding to the area reduction rate of 30% in a direction orthogonal to the axial direction of the die hole, and Ra3 represents a surface roughness of an inner surface of the bearing section of the die hole in the axial direction of the die hole, the Ra1, the Ra2, and the Ra3 satisfy a relationship represented by 0.14 ?m>Ra2>Ra1>Ra3.

Abstract: An image forming apparatus includes an image forming device that forms an image on a recording material. The apparatus further includes an adjuster that sequentially executes adjustment operations corresponding to plural adjustment items which are selected in advance. The apparatus further includes a display that displays information indicating that a setting in which an adjustment result is to be reflected is newly generated when the setting is newly generated during execution of the adjustment operations.

Abstract: A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/° C. from a temperature 10° C. higher than a minimum melt viscosity attainment temperature to a temperature 10° C. higher than the temperature.

Abstract: An image formation control apparatus includes a setting reception section that collectively receives settings of a plurality of adjustment factors with respect to image formation, an instruction section that instructs an image forming apparatus main body to perform adjustments with respect to the settings of the adjustment factors, which are received by the setting reception section, an adjustment result reception section that receives results of the adjustments of the respective adjustment factors, which are instructed by the instruction section, in the image forming apparatus main body, and a controller that performs control such that the results of the adjustments of the respective adjustment factors, which are received by the adjustment result reception section, are stored in company with a recording medium accommodation unit that accommodates a recording medium.

Abstract: An image formation control apparatus includes a setting reception section that collectively receives settings of a plurality of adjustment factors with respect to image formation, an instruction section that instructs an image forming apparatus main body to perform adjustments with respect to the settings of the adjustment factors, which are received by the setting reception section, an adjustment result reception section that receives results of the adjustments of the respective adjustment factors, which are instructed by the instruction section, in the image forming apparatus main body, and a controller that performs control such that the results of the adjustments of the respective adjustment factors, which are received by the adjustment result reception section, are stored in company with a recording medium accommodation unit that accommodates a recording medium.

Abstract: A resin composition comprising a binder resin (A), a phenoxy resin having a hydroxyl equivalent of 300 or more, and a cross-linking agent (C). The resin composition of the present invention preferably further comprises a photoacid generator (D). The photoacid generator (D) is more preferably a quinone diazide compound.

Abstract: An image forming apparatus includes: an image forming unit that forms an image on a recording material; an accepting unit that accepts plural adjustment items; and an adjusting unit that sequentially executes adjustment operations concerning the plural adjustment items, based on an adjustment result of the previously executed adjustment item.

Abstract: A resin composition comprising a binder resin (A), an aromatic compound (B) represented by the following general formula (1), and a cross-linking agent (C): where in the general formula (1), each of R1 to R8 respectively independently is hydrogen atom, hydroxyl group, carboxyl group, substituted or unsubstituted aliphatic hydrocarbon group having 1 to 12 carbon atoms, or substituted or unsubstituted aromatic hydrocarbon group having 6 to 12 carbon atoms, “m” is an integer of 0 to 2, when “m” is 0, at least two of R1 to R4, R6, and R7 are hydroxyl group, when “m” is 1 or 2, at least two of R1 to R8 are hydroxyl group, and, when “m” is 2 or more, regardless of the structure represented by general formula (1), three or more benzene rings present may be joined with each other at any positions.

Abstract: A resin composition comprising a binder resin (A), a phenoxy resin having a hydroxyl equivalent of 300 or more, and a cross-linking agent (C). The resin composition of the present invention preferably further comprises a photoacid generator (D). The photoacid generator (D) is more preferably a quinone diazide compound.

Abstract: An image forming apparatus includes: an image forming unit that forms an image on a recording material; an accepting unit that accepts plural adjustment items; and an adjusting unit that sequentially executes adjustment operations concerning the plural adjustment items, based on an adjustment result of the previously executed adjustment item.

Abstract: An image forming apparatus includes: an image forming unit that forms an image on a recording material; an adjusting unit that sequentially executes adjustment operations corresponding to plural adjustment items which are selected in advance; and a display that displays information indicating that a setting in which an adjustment result is to be reflected is newly generated when the setting is newly generated during execution of the adjustment operations.

Abstract: An underfill material achieving a wide margin for mounting and a method for manufacturing a semiconductor device using the same are provided. The underfill material contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, wherein a minimum melt viscosity attainment temperature and a minimum melt viscosity obtained when melt viscosity of the underfill material is measured under a temperature increase rate condition in a range of 5 to 50° C./min are in a range of 100° C. to 150° C. and in a range of 100 to 5000 Pa·s, respectively. Since variation in the minimum melt viscosity attainment temperature measured under different temperature increase conditions is small, voidless mounting and good solder bonding properties can be achieved without strict control on the temperature profile during thermocompression bonding, and a wide margin for mounting can be achieved.

Abstract: A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/° C. from a temperature 10° C. higher than a minimum melt viscosity attainment temperature to a temperature 10° C. higher than the temperature.