Abstract: A connection device includes a mounting section on which an electronic component stacked with a thermosetting adhesive agent layer is mounted, a heat press head for heating and pressing the electronic component, a first elastic body that is disposed between the electronic component and a pressing surface of the heat press head so as to press an upper surface of the electronic component, and a support member that is disposed on a periphery of the electronic component and supports the first elastic body.

Abstract: A highly sensitive humidity measurement device is provided. The humidity measurement device has: a housing component integrally including a connector for performing input/output to/from the outside and a connector terminal component; an electronic circuit board mounted on the housing component and electrically connected to the connector terminal; and a humidity sensing element provided on the electronic circuit board. When the humidity measurement device is installed in an installation hole that is provided in a part of a main air flow passage through which suction air flows, apart of the housing component is exposed to the suction air flowing through the main air flow passage. The housing component is provided with a bypass passage to suction a part of the suction air. The bypass passage includes a bypass inlet opening that serves as a suction port of the suction air and a bypass outlet opening that discharges the suction air. The bypass outlet opening is exposed to the suction air.

Abstract: To provide a humidity detection device by which good accuracy in measurement is achieved even under severe environmental conditions, in the humidity detection device which includes an electronic circuit board 1 and a humidity detection element 2 mounted on one surface of the electronic circuit board and detects humidity in air by exposing to air the whole of the humidity detection element and a portion of the electronic circuit board, a plurality of heating resistors 3 are mounted on the same surface as the surface on which the humidity detection element is mounted, and the heating resistors are provided around the humidity detection element.

Abstract: Provided is a highly reliable semiconductor device by giving stable electric characteristics to a transistor in which a semiconductor film whose threshold voltage is difficult to control is used as an active layer. By using a silicon oxide film having a negative fixed charge as a film in contact with the active layer of the transistor or a film in the vicinity of the active layer, a negative electric field is always applied to the active layer due to the negative fixed charge and the threshold voltage of the transistor can be shifted in the positive direction. Thus, the highly reliable semiconductor device can be manufactured by giving stable electric characteristics to the transistor.

Abstract: The present invention provides an electronic component manufacturing method including a step of embedding a metal film. An embodiment of the present invention includes a first step of depositing a barrier layer containing titanium nitride on an object to be processed on which a concave part is formed and a second step of filling a low-melting-point metal directly on the barrier layer under a temperature condition allowing the low-melting-point metal to flow, by a PCM sputtering method while forming a magnetic field by a magnet unit including plural magnets which are arranged at grid points of a polygonal grid so as to have different polarities between the neighboring magnets.

Abstract: In a miniaturized transistor, a gate insulating layer is required to reduce its thickness; however, in the case where the gate insulating layer is a single layer of a silicon oxide film, a physical limit on thinning of the gate insulating layer might occur due to an increase in tunneling current, i.e. gate leakage current. With the use of a high-k film whose relative permittivity is higher than or equal to 10 is used for the gate insulating layer, gate leakage current of the miniaturized transistor is reduced. With the use of the high-k film as a first insulating layer whose relative permittivity is higher than that of a second insulating layer in contact with an oxide semiconductor layer, the thickness of the gate insulating layer can be thinner than a thickness of a gate insulating layer considered in terms of a silicon oxide film.

Abstract: An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet.

Abstract: To prevent dew condensation on a sensor element, an air physical quantity sensing device which has a housing structural component integrally provided with a connector and a connector terminal member that perform input and output with the outside, an electronic circuit board mounted on the housing structural component, and an air physical quantity sensing element provided on the electronic circuit board and capable of detecting physical quantity of air. The housing structural component formed with a communication hole which allows the inside and outside of the main air flow passage to communicate with each other. The electronic circuit board has the communication hole separated into two and the surface on the side where the air physical quantity sensing element is provided faces the main air flow passage side.

Abstract: Technique capable of achieving reliability improvement of a semiconductor device even if temperature rising of an operation guarantee temperature of the semiconductor device is performed is provided. Gap portions are provided among a plurality of pads, and a glass coat composed of, for example, a silicon oxide film or a silicon nitride film is embedded in the gap portions. The glass coat is provided in order to secure electrical insulation among the pads, and coats outer edge portions of the pads. Trenches are formed so as to be adjacent to regions, which are coated with the glass coat, of the outer edge portions of the pads.

Abstract: There is provided an information processing apparatus. A receiver receives designations of: a first attribute from among attributes relating to a paper on which an image is to be printed, in a stored attribute file; a range within which a value of the first attribute could be; and an increase or decrease width of the value. A first attribute generator generates attribute values for the first attribute, obtained by increasing or decreasing the value at the increase or decrease width within the range. A file generator generates attribute files, each of which includes each of the generated attribute values of the first attribute. An attribute value of a second attribute, which has not been designated, in the generated attribute files is the same with an attribute value of the second attribute in the attribute file.

Abstract: Technique capable of achieving reliability improvement of a semiconductor device even if temperature rising of an operation guarantee temperature of the semiconductor device is performed is provided. Gap portions are provided among a plurality of pads, and a glass coat composed of, for example, a silicon oxide film or a silicon nitride film is embedded in the gap portions. The glass coat is provided in order to secure electrical insulation among the pads, and coats outer edge portions of the pads. Trenches are formed so as to be adjacent to regions, which are coated with the glass coat, of the outer edge portions of the pads.

Abstract: An arrangement of a mass intake air flow measurement device suitable for integrating a humidity sensing device as well as a temperature sensing device and a pressure sensing device is provided. A second bypass passage 501 bypassing a bypass passage 205 is formed and a humidity sensing device 500 is mounted in the second bypass passage 501. A second bypass passage inlet 502 and a second bypass passage outlet 503 formed in a wall surface of the bypass passage 205 are opened parallel to the direction of flow of air flowing in the bypass passage 205.

Abstract: A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.

Abstract: Provided is a sensor structure capable of improving the reliability of connecting parts of electronic components and achieving excellent productivity and reduction in size and weight, for example, when electronic components are externally mounted on input/output terminals of a sensor. A relationship between a linear expansion coefficient for a housing serving as a base of a structure and a linear expansion coefficient of a resin material for a sensor casing of a sensor to be mounted is set to satisfy “sensor casing<linear expansion coefficient ?<housing”. When electronic components are externally mounted, the electric components are mounted on input/output terminals which are integrally formed on the side of a component having a small linear expansion coefficient, i.e., on the side of the sensor casing.

Abstract: In relation to a humidity sensor sensitive to water and contamination, a sensor implementation structure that achieves both protection performance against water and contaminants and measurement performance such as humidity responsiveness is provided. A sensor structure has a mass airflow measurement element that measures a mass airflow flowing in an intake pipe, a humidity sensing element that senses humidity of air flowing in the intake pipe, a housing structural component having a connector that carries out input/output to/from outside and a terminal component of the connector, and a bypass passage that is composed by using part of the housing structural component and takes in part of the air that flows in the intake pipe, the mass airflow measurement element being mounted in the bypass passage; wherein space is provided in the housing structural component in the vicinity of the bypass passage, the humidity sensing element is mounted in the space.

Abstract: Technique capable of achieving reliability improvement of a semiconductor device even if temperature rising of an operation guarantee temperature of the semiconductor device is performed is provided. Gap portions are provided among a plurality of pads, and a glass coat composed of, for example, a silicon oxide film or a silicon nitride film is embedded in the gap portions. The glass coat is provided in order to secure electrical insulation among the pads, and coats outer edge portions of the pads. Trenches are formed so as to be adjacent to regions, which are coated with the glass coat, of the outer edge portions of the pads.

Abstract: A table includes a pair of leg portions that has a length in a vertical direction and is hollow in shape with an opening formed at the top end thereof; a top panel that is mounted rotatably; a pair of casters, at least one such casters being provided at each of the front and the rear of a base portion of the leg portion; a contact portion that is provided on the base portion of the leg portion; and a raising/lowering mechanism that couples a movable portion, which is either one or more of the pair of casters and the contact portion, and the top panel, and switches what comes into contact with a floor surface between the pair of casters and the contact portion by raising/lowering the movable portion in accordance with a rotation of the top panel. The raising/lowering mechanism couples the top panel and the movable portion through the opening.

Abstract: Low-cost interface property measuring device and method enabling high-precision and simple measurement of an interface property.