Abstract: A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 ?m.

Abstract: A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 ?m.

Abstract: An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.

Abstract: An object to be achieved by the present invention is to provide a novel antiallergic agent using, as an active ingredient, a compound that has heretofore not been known to have an antiallergic action. The present invention provides an antiallergic agent, including a compound represented by the formula (I) or a salt thereof: where R1 and R2, which are identical to or different from each other, each represent an alkyl group having 1 to 3 carbon atoms, m represents an integer of from 0 to 3, and n represents an integer of from 1 to 3.

Abstract: An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.

Abstract: Agents or pharmaceutical compositions for promoting osteoblast differentiation include purified auraptene or coumarin analogs thereof represented by the following formula 1: wherein R1 represents a hydrogen, a hydroxy, a methoxy, a methyl, an ethyl, a propyl, a carboxyl, a carboxymethyl, or a carboxyethyl; R2 represents a hydrogen, a hydroxy, a methoxy, a methyl, an ethyl, a propyl, a carboxyl, a carboxymethyl, a carboxyethyl or a coumarinyl; R3 represents a hydrogen, a hydroxy, a methoxy, a methyl, an ethyl, a propyl, a carboxyl, a carboxymethyl or a carboxyethyl; and R4 represents a hydrogen, a C1-C15 liner or branched alkyl, an alkenyl, an alkadienyl or an alkatrienyl.

Abstract: The purpose of the present invention is to provide a highly safe composition that improves glucose tolerance and sugar metabolism at skeletal muscles, and a prevention/treatment drug for diabetes/metabolic syndrome containing the composition. Provided is a composition that is for improving sugar metabolism and glucose tolerance and that contains a compound represented by formula (I) derived from a plant selected from the group consisting of Rumex japonicus, R. crispus, and R. obtusifolius as the active ingredient.

Abstract: Provided is a composition that, even when used in a very small amount, has the effect of improving bone density and promoting bone growth, and has few side effects, and also provided are a pharmaceutical preparation for promoting bone growth, functional food product, and health food product containing the composition as an active ingredient. The composition can be obtained from any plant part selected from the group consisting of the bud, leaf, bark or wood of a plant belonging to the family Magnoliaceae. The composition comprises at least one selected from the group consisting of fargesin and physiologically acceptable salts, hydrates, and glycosides thereof. The pharmaceutical preparation, functional food product, and health food product comprising this composition as an active ingredient sufficiently improve bone density and promote bone growth, even when used in small amounts, and therefore realize preventive and/or therapeutic effects against bone disease etc. such as osteoporosis.

Abstract: The purpose of the present invention is to provide a highly safe composition that improves glucose tolerance and sugar metabolism at skeletal muscles, and a prevention/treatment drug for diabetes/metabolic syndrome containing the composition. Provided is a composition that is for improving sugar metabolism and glucose tolerance and that contains a compound represented by formula (I) derived from a plant selected from the group consisting of Rumex japonicus, R. crispus, and R. obtusifolius as the active ingredient.