Abstract: In order to reduce a load applied to a device control of a network manager, in a control method according to the present invention, a control device for controlling network devices receives first instruction information on the network devices, generates, from the first instruction information, second instruction information corresponding to each of the network devices, and transmits the corresponding second instruction information to each of the network devices, when the first instruction information satisfies a prescribed condition.

Abstract: A management device for managing a portal server includes a detection unit that detects subscriber identification information of a subscriber terminal from an access request received from the subscriber terminal, and a control unit that allocates an accommodation destination of the access request to one of a plurality of portal servers, based on the subscriber identification information.

Abstract: In order to resolve the problem of various MVNOs being unable to always fairly share wireless resources of a mobile line network (wireless resources of all base stations), this system has base stations connected to a server, and when wireless resource use amounts related to prescribed groups (MVNO) are input from at least one base station, the server outputs, as information indicating the priority order of the groups, information corresponding to a prescribed number having a monotonic increase relationship with the sum of the use amount related to the group, for each of the groups. When the information indicating the priority order of the groups is input, the base station communicates with terminals by using the wireless resources in order from a terminal of the group with the highest priority indicated by the information.

Abstract: A path calculation device includes: a first storage that stores first topology information for indicating a topology of a network; a second storage that stores second topology information generated from the first topology information stored in the first storage; and a processor that determines a path between a start point and an end point based on the second topology information stored in the second storage and provides path information for indicating the determined path to the network when the path calculation device receives a path calculation request that includes information for indicating the start point and the end point from the network. The processor updates the second topology information stored in the second storage based on the determined path.

Abstract: Provided is a communication system capable of handover processing, based on a processing priority according to handover classification. The communication system according to the embodiment of the present invention has a base station and a terminal; the terminal transmits handover requests to the base station; and the base station performs handover processing on the basis of the processing priority according to handover classification.

Abstract: A wireless communication system of the present invention includes: terminals; a base station that performs wireless communication with the terminals; a gateway apparatus that manages the terminals and the base station; and a server apparatus that authenticates the terminals. The gateway apparatus includes: at least one C-plane processor that processes C-plane; and N U-plane processors that process U plane. Each of the N U-plane processors notifies the C-plane processor of its own load status. The server apparatus notifies the C-plane processor of service levels of target terminals that try to perform entry to a network in which the base station and the gateway apparatus are located. The C-plane processor allocates, based on the load status of each of the N U-plane processors and the service levels of the target terminals, one of the N U-plane processors as an entry destination to the target terminals.

Abstract: Provided is a stacked semiconductor device (50) in which a semiconductor package (5) is stacked via connection terminals (8) on a semiconductor package (1), including a heat dissipating member (10) which is disposed between the semiconductor packages (1, 5), is brought into thermal contact with both of the packages (1, 5), and hangs over whole outer peripheral portions of the package (5). Such a structure causes heat generated from the package (5) to be released by heat dissipation into air above the package (5), heat dissipation into the air below the semiconductor package (5), heat transfer via the heat dissipating member (10) and a semiconductor element (3) to a first wiring substrate (2), heat transfer via the connection terminals (8) to the first wiring substrate (2), and heat dissipation via the heat dissipating member (10) into the air, thereby enhancing a temperature reduction effect of the semiconductor element.

Abstract: A handover control device that conducts switching-over base station(s), in which a mobile station 111, . . . , 1NQ communicates, from one base station to another neighboring base station wherein a gateway server 30 monitors communication quality of the mobile station 111, . . . , 1NQ at a frequency according to a service level assigned to the mobile station 111, . . . , 1NQ and, if the communication quality falls below a predetermined quality, sends information on the another base station to the mobile station 111, . . . , 1NQ.

Abstract: When a service providing device which provides a service to a mobile communication terminal enters a service stop mode, a signal indicating that the service stop mode is set in is transmitted to service providing devices other than that service providing device. Upon reception of the signal, the service providing device which has transmitted the signal releases the resource of the mobile communication terminal to which a service has been provided.

Abstract: A wireless communication system of the present invention includes: terminals; a base station that performs wireless communication with the terminals; a gateway apparatus that manages the terminals and the base station; and a server apparatus that authenticates the terminals. The gateway apparatus includes: at least one C-plane processor that processes C-plane; and N U-plane processors that process U plane. Each of the N U-plane processors notifies the C-plane processor of its own load status. The server apparatus notifies the C-plane processor of service levels of target terminals that try to perform entry to a network in which the base station and the gateway apparatus are located. The C-plane processor allocates, based on the load status of each of the N U-plane processors and the service levels of the target terminals, one of the N U-plane processors as an entry destination to the target terminals.

Abstract: A wireless communication system of the present invention includes: terminals; a base station that performs wireless communication with the terminals; a gateway apparatus that manages the terminals and the base station; and a server apparatus that authenticates the terminals. The gateway apparatus includes: at least one C-plane processor that processes C-plane; and N U-plane processors that process U plane. Each of the N U-plane processors notifies the C-plane processor of its own load status. The server apparatus notifies the C-plane processor of service levels of target terminals that try to perform entry to a network in which the base station and the gateway apparatus are located. The C-plane processor allocates, based on the load status of each of the N U-plane processors and the service levels of the target terminals, one of the N U-plane processors as an entry destination to the target terminals.

Abstract: Provided is a stacked semiconductor device (50) in which a semiconductor package (5) is stacked via connection terminals (8) on a semiconductor package (1), including a heat dissipating member (10) which is disposed between the semiconductor packages (1, 5), is brought into thermal contact with both of the packages (1, 5), and hangs over whole outer peripheral portions of the package (5). Such a structure causes heat generated from the package (5) to be released by heat dissipation into air above the package (5), heat dissipation into the air below the semiconductor package (5), heat transfer via the heat dissipating member (10) and a semiconductor element (3) to a first wiring substrate (2), heat transfer via the connection terminals (8) to the first wiring substrate (2), and heat dissipation via the heat dissipating member (10) into the air, thereby enhancing a temperature reduction effect of the semiconductor element.

Abstract: When a service providing device which provides a service to a mobile communication terminal has entered a service stop state, a managing device connected to the service providing device instructs service providing devices other than the service providing device which has entered the service stop state, to release a resource of a mobile communication terminal to which a service has been provided by the service providing device which has entered the service stop state.

Abstract: A stacked semiconductor device includes a plurality of first electrodes provided on a first printed wiring board and columnar electrodes provided on the first electrodes. The stacked semiconductor device also includes a plurality of second electrodes provided on a second printed wiring board and a plurality of solder electrodes. The columnar electrodes are formed of a material having a melting point higher than that of the solder electrodes, and the height of the columnar electrodes is set to increase as a distance between the first electrodes and the solder electrodes increases. This avoids connection failure without reducing joinability between two stacked semiconductor devices.

Abstract: An exhaust apparatus includes an exhaust pipe passing under the front floor and rear floor and extending toward the rear of the vehicle. A noise eliminator is arranged under the rear floor and a fuel tank is arranged in a side portion in the vehicle width direction of the noise eliminator. A portion of the exhaust pipe on the front side of the front floor and a portion on the rear side of the noise eliminator are elastically mounted to the vehicle body. The exhaust pipe and a portion on the side opposite to the side of the fuel tank at a lower surface portion of the front floor are coupled by a metal wire having slack in an intermediate portion therebetween. In a side impact to the vehicle body, the fuel tank and noise eliminator do not interfere with each other.

Abstract: A wireless communication system of the present invention includes: terminals; a base station that performs wireless communication with the terminals; a gateway apparatus that manages the terminals and the base station; and a server apparatus that authenticates the terminals. The gateway apparatus includes: at least one C-plane processor that processes C-plane; and N U-plane processors that process U plane. Each of the N U-plane processors notifies the C-plane processor of its own load status. The server apparatus notifies the C-plane processor of service levels of target terminals that try to perform entry to a network in which the base station and the gateway apparatus are located. The C-plane processor allocates, based on the load status of each of the N U-plane processors and the service levels of the target terminals, one of the N U-plane processors as an entry destination to the target terminals.

Abstract: In a stacking semiconductor device in which a first-layer and a second-layer semiconductor devices are stacked and bonded with a solder, warpage occurs due to a difference in thermal expansion coefficient of constituent members or a difference in elastic modulus of individual members. Therefore, between the first-layer and the second-layer semiconductor devices are provided an external connection terminal of solder and a thermosetting resin, and the stacking semiconductor device is heated at 150 to 180° C., which are the temperatures of preheating for reflow of the solder, for 30 to 90 seconds. Thereby the warpage of the first-layer semiconductor device is reduced and the thermosetting resin is cured completely in this state. Then, the temperature is raised to a reflow temperature of the solder and solder bonding using the external connection terminal is performed. Thereby, the bonding reliability of a solder-bonded portion of the stacking semiconductor device is considerably improved.

Abstract: When a service providing device which provides a service to a mobile communication terminal enters a service stop mode, a signal indicating that the service stop mode is set in is transmitted to service providing devices other than that service providing device. Upon reception of the signal, the service providing device which has transmitted the signal releases the resource of the mobile communication terminal to which a service has been provided.

Abstract: When a service providing device which provides a service to a mobile communication terminal has entered a service stop state, a managing device connected to the service providing device instructs service providing devices other than the service providing device which has entered the service stop state, to release a resource of a mobile communication terminal to which a service has been provided by the service providing device which has entered the service stop state.

Abstract: In a stacking semiconductor device in which a first-layer and a second-layer semiconductor devices are stacked and bonded with a solder, warpage occurs due to a difference in thermal expansion coefficient of constituent members or a difference in elastic modulus of individual members. Therefore, between the first-layer and the second-layer semiconductor devices are provided an external connection terminal of solder and a thermosetting resin, and the stacking semiconductor device is heated at 150 to 180° C., which are the temperatures of preheating for reflow of the solder, for 30 to 90 seconds. Thereby the warpage of the first-layer semiconductor device is reduced and the thermosetting resin is cured completely in this state. Then, the temperature is raised to a reflow temperature of the solder and solder bonding using the external connection terminal is performed. Thereby, the bonding reliability of a solder-bonded portion of the stacking semiconductor device is considerably improved.