Abstract: A handover control device that conducts switching-over base station(s), in which a mobile station 111, . . . , 1NQ communicates, from one base station to another neighboring base station wherein a gateway server 30 monitors communication quality of the mobile station 111, . . . , 1NQ at a frequency according to a service level assigned to said mobile station 111, . . . , 1NQ and, if the communication quality falls below a predetermined quality, sends information on the another base station to the mobile station 111, . . . , 1NQ.

Abstract: An exhaust apparatus includes an exhaust pipe passing under the front floor and rear floor and extending toward the rear of the vehicle. A noise eliminator is arranged under the rear floor and a fuel tank is arranged in a side portion in the vehicle width direction of the noise eliminator. A portion of the exhaust pipe on the front side of the front floor and a portion on the rear side of the noise eliminator are elastically mounted to the vehicle body. The exhaust pipe and a portion on the side opposite to the side of the fuel tank at a lower surface portion of the front floor are coupled by a metal wire having slack in an intermediate portion therebetween. In a side impact to the vehicle body, the fuel tank and noise eliminator do not interfere with each other.

Abstract: In a stacking semiconductor device in which a first-layer and a second-layer semiconductor devices are stacked and bonded with a solder, warpage occurs due to a difference in thermal expansion coefficient of constituent members or a difference in elastic modulus of individual members. Therefore, between the first-layer and the second-layer semiconductor devices are provided an external connection terminal of solder and a thermosetting resin, and the stacking semiconductor device is heated at 150 to 180° C., which are the temperatures of preheating for reflow of the solder, for 30 to 90 seconds. Thereby the warpage of the first-layer semiconductor device is reduced and the thermosetting resin is cured completely in this state. Then, the temperature is raised to a reflow temperature of the solder and solder bonding using the external connection terminal is performed. Thereby, the bonding reliability of a solder-bonded portion of the stacking semiconductor device is considerably improved.

Abstract: It is an object of the present invention to provide a ceramic member with excellent balance between oxygen ion conductivity and endurance (resistance to cracking and the like), an oxygen ion permeation module and a chemical reactor such as an oxygen separator, using such a ceramic member. The ceramic member with oxygen ion conductivity in accordance with the present invention has a perovskite-type crystal structure and a composition represented by the general formula: (Ln1?xMx)(Ti1?yFey)O3 (where Ln represents at least one element selected from lanthanoids, and M represents at least one element selected from the group containing Sr, Ca, and Ba, 0<x<1, 0.4?y<1, x+y?1). The oxygen ion permeation module composed by employing such a ceramic member can be used as a structural component of an oxygen separator, an oxidation reactor (for example, a reactor for partial oxidation of hydrocarbons), and the like.

Abstract: Disclosed is an information processing apparatus for controlling a printing apparatus that is capable of executing insert print processing for inserting a second printing medium as an insert sheet into a first printing medium and printing a plurality of sheets, wherein the information processing apparatus is connected to the printing apparatus and transmits print data in a predetermined format in accordance with an input received via a user interface. If a designation has been made so as to execute the insert print processing for applying print processing to the second printing medium, the second printing medium is assigned a second print setting that differs from a first print setting for the first printing medium, and print data is generated for printing on the second printing medium according to the second print setting and on the first printing medium according to the first print setting.

Abstract: Disclosed are an information processing apparatus and a server for communicating with this information processing apparatus.

Abstract: Disclosed are an information processing apparatus and a server for communicating with this information processing apparatus.

Abstract: It is an object of the present invention to provide a semiconductor device that offers a desirable adhesiveness among the bonding pad, the second insulating layer and the insulating film, and that permits an insulating film formed between a bonding pad and the second wiring layer from being cracked even when stress is applied to the bonding pad from above. In a semiconductor integrated circuit 11a, other wirings 12 are formed so as to avoid the regions right under opposed edges 7a and 7b of the bonding pad 1 and opposed edges 9a and 9b of an inner lead 8. For example, the region in which the other wirings 12 can be formed is selected to be a region 13a between right under the edge 7a of the bonding pad 1 and right under the edge 9a of the inner lead 8, and the region 13b between right under the edge 7b and right under the edge 9b of the inner lead 8. A insulating film 5 formed above these other wirings 12 is made up of an inorganic insulating film only.

Abstract: Provided is a semiconductor device which prevents displacement of a semiconductor element and a wiring pattern of a wiring substrate so as to ensure the connection of the semiconductor element and the wiring pattern. The semiconductor device of the present invention includes a semiconductor element and a wiring substrate which is provided with a film substrate and a wiring pattern which is formed on the film substrate, the semiconductor element is connected to the wiring pattern, and the semiconductor element and the wiring substrate are sealed with a resin. A metallic film, made of material having a smaller coefficient of linear thermal expansion than the film substrate, is formed in a region where the wiring pattern is not formed on at least one surface of the film substrate.

Abstract: In a stacking semiconductor device in which a first-layer and a second-layer semiconductor devices are stacked and bonded with a solder, warpage occurs due to a difference in thermal expansion coefficient of constituent members or a difference in elastic modulus of individual members. Therefore, between the first-layer and the second-layer semiconductor devices are provided an external connection terminal of solder and a thermosetting resin, and the stacking semiconductor device is heated at 150 to 180° C., which are the temperatures of preheating for reflow of the solder, for 30 to 90 seconds. Thereby the warpage of the first-layer semiconductor device is reduced and the thermosetting resin is cured completely in this state. Then, the temperature is raised to a reflow temperature of the solder and solder bonding using the external connection terminal is performed. Thereby, the bonding reliability of a solder-bonded portion of the stacking semiconductor device is considerably improved.

Abstract: By having substantially narrow pitches between wires in a first wiring layer located in an interlayer insulating layer of a semiconductor integrated circuit device, a total amount of the first wiring layer in the interlayer insulating film may be increased, thereby reducing a total amount of the interlayer insulating film having low hardness, which causes warping. As a result, stresses that are typically applied on a protective film of the semiconductor integrated circuit device due to the warping may be prevented. This may prevent the occurrence of a crack, etc. in the protective film. Therefore, it may be possible to prevent failures such as electrical disconnection of a second wiring layer above the protective film due to the crack in the protective film.

Abstract: A printer for a cigarette-manufacturing machine has a density sensor (70) disposed between a wrapping section (4) and a cutting section (16) of the machine, and the density sensor (70) detects the print density of printed information (PI) of a tobacco rod (TR). The information (PI) is printed on a paper web W by a printing unit (20) located upstream from the wrapping section (4). Disposed between the printing unit (20) and the wrapping section (4) is an adjusting device (62) for varying the length of a feeding path of the paper web W. A density signal from the density sensor (70) is used to control the operation of the printing unit (20) and adjusting device (62). Thus, based on the density signal, the print density of the printed information (PI) and the arrival timing thereof at the density sensor (70) are each controlled.

Abstract: It is an object of the present invention to provide a ceramic member with excellent balance between oxygen ion conductivity and endurance (resistance to cracking and the like), an oxygen ion permeation module and a chemical reactor such as an oxygen separator, using such a ceramic member. The ceramic member with oxygen ion conductivity in accordance with the present invention has a perovskite-type crystal structure and a composition represented by the general formula (Ln1-xMx)(Ti1-yFey)O3 (where Ln represents at least one element selected from lanthanoids, and M represents at least one element selected from the group containing Sr, Ca, and Ba, 0<x<1, 0.4?y<1, x+y?1). The oxygen ion permeation module composed by employing such a ceramic member can be used as a structural component of an oxygen separator, an oxidation reactor (for example, a reactor for partial oxidation of hydrocarbons), and the like.

Abstract: It is an object of the present invention to provide a semiconductor device that offers a desirable adhesiveness among the bonding pad, the second insulating layer and the insulating film, and that permits an insulating film formed between a bonding pad and the second wiring layer from being cracked even when stress is applied to the bonding pad from above. In a semiconductor integrated circuit 11a, other wirings 12 are formed so as to avoid the regions right under opposed edges 7a and 7b of the bonding pad 1 and opposed edges 9a and 9b of an inner lead 8. For example, the region in which the other wirings 12 can be formed is selected to be a region 13a between right under the edge 7a of the bonding pad 1 and right under the edge 9a of the inner lead 8, and the region 13b between right under the edge 7b and right under the edge 9b of the inner lead 8. A insulating film 5 formed above these other wirings 12 is made up of an inorganic insulating film only.

Abstract: A device for detecting a shredded tobacco filling density in a tobacco rod includes four light sources (18, 20, 22 and 24) arranged separately from one another at an angle of 45° around a tobacco rod (T) and causing infrared rays to enter the tobacco rod (T), two light receivers (26 and 28) disposed around the tobacco rod (T) on a side opposite to the four light sources and arranged separately from each other at an angle of 90°, and a measuring device (44) for measuring the shredded tobacco filling density in the tobacco rod (T) based on outputs from the light receivers (26 and 28).

Abstract: The semiconductor device contains multiple semiconductor elements mounted on one carrier tape by COF. Here, the semiconductor elements are substantially rectangular and laid out so that the longitudinal directions thereof are aligned with, and lined up along, the longitudinal direction of the substantially rectangular carrier tape. The wires on the carrier tape interconnect adjacent semiconductor elements. This enables the size and cost of a display panel module to which the semiconductor device is mounted to be reduced, while avoiding characteristics abnormalities and a loss in signal transfer speed caused by added wiring distance of input signal wiring.

Abstract: By having narrow pitches between wires in a first wiring layer located in an interlayer insulating layer, a total amount of the first wiring layer in the interlayer insulating film is increased, thereby reducing a total amount of the interlayer insulating film having low hardness, which causes warping. As a result. for example, no stress (pressure application and the like) due to the warping of the interlayer insulating film will be applied on a protective film provided on the interlayer insulating film, thereby preventing occurrence of a crack and the like in the protective film. Therefore, it is possible to prevent failure such as electrical disconnection of the second wiring layer due to the crack and the like in the protective film, thereby attaining a semiconductor device with high reliability.

Abstract: Disclosed is an information processing apparatus for controlling a printing apparatus that is capable of executing insert print processing for inserting a second printing medium as an insert sheet into a first printing medium and printing a plurality of sheets, wherein the information processing apparatus is connected to the printing apparatus and transmits print data in a predetermined format in accordance with an input received via a user interface. If a designation has been made so as to execute the insert print processing for applying print processing to the second printing medium, the second printing medium is assigned a second print setting that differs from a first print setting for the first printing medium, and print data is generated for printing on the second printing medium according to the second print setting and on the first printing medium according to the first print setting.

Abstract: A device for detecting a shredded tobacco filling density in a tobacco rod includes four light sources (18, 20, 22 and 24) arranged separately from one another at an angle of 45° around a tobacco rod (T) and causing infrared rays to enter the tobacco rod (T), two light receivers (26 and 28) disposed around the tobacco rod (T) on a side opposite to the four light sources and arranged separately from each other at an angle of 90°, and a measuring device (44) for measuring the shredded tobacco filling density in the tobacco rod (T) based on outputs from the light receivers (26 and 28).

Abstract: Disclosed are an information processing apparatus and a server for communicating with this information processing apparatus.