Patents by Inventor Takeru Watanabe

Takeru Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12013640
    Abstract: A resist underlayer film material used in multilayer resist method contains (A) compound shown by following general formula (1), and (B) organic solvent, where X independently represents monovalent organic group shown by following general formula (2); W contains an “m” number of partial structures each independently shown by following formula (3); “m” and “n” each represent an integer of 1 to 10; broken lines represent bonding arms; Z represents aromatic group; A represents single bond or —O—(CH2)p—; “k” represents integer of 1 to 5; “p” represents integer of 1 to 10; R01 represents hydrogen atom or monovalent organic group having 1 to 10 carbon atoms. Material is capable of forming resist underlayer film excellent in planarizing property in fine patterning process by multilayer resist method in semiconductor-device manufacturing process; and patterning processes and methods for forming resist underlayer film use material.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: June 18, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takayoshi Nakahara, Takeru Watanabe, Daisuke Kori, Yusuke Biyajima, Tsutomu Ogihara
  • Publication number: 20240182394
    Abstract: The present invention relates to a process for preparing (Z)-7-tetradecen-2-one of the following formula (5), the process comprising the steps of converting a (Z)-1-halo-4-undecene compound (1) of the following general formula (1), wherein X1 represents a halogen atom, into a nucleophilic reagent, (Z)-4-undecenyl compound, of the following general formula (2), wherein M1 represents Li or MgZ1, and Z1 represents a halogen atom or a (4Z)-4-undecenyl group, subjecting the nucleophilic reagent, (Z)-4-undecenyl compound (2), to an addition reaction with propylene oxide of the following formula (3) to obtain (Z)-7-tetradecen-2-ol of the following formula (4) and oxidizing (Z)-7-tetradecen-2-ol (4) thus obtained to form (Z)-7-tetradecen-2-one (5).
    Type: Application
    Filed: November 6, 2023
    Publication date: June 6, 2024
    Inventors: Yuki MIYAKE, Takeru WATANABE, Ryo KOMATSU
  • Patent number: 12001138
    Abstract: A composition for forming a silicon-containing resist underlayer film contains at least one or more kinds of a quaternary ammonium salt shown by the following general formula (A-1), and a thermally crosslinkable polysiloxane (Sx), where Ar1 represents an aromatic group having 6 to 20 carbon atoms, or a heteroaromatic group having 4 to 20 carbon atoms. R11 represents an alkyl group, alkenyl group, oxoalkyl group, or oxoalkenyl group having 1 to 12 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group or aryloxoalkyl group having 7 to 12 carbon atoms. Some or all of hydrogen atoms of these groups are optionally substituted. Z? represents an organic or inorganic anion as a counterion of the quaternary ammonium cation. An object is to provide a silicon-containing resist underlayer film having high effect of suppressing ultrafine pattern collapse and appropriate etching rate in multilayer resist methods.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: June 4, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yusuke Kai, Takeru Watanabe, Yusuke Biyajima, Tsutomu Ogihara
  • Publication number: 20240174701
    Abstract: The present invention relates to a process for preparing an organohalogen compound of the following general formula (5), wherein R2 represents a linear, branched, or aromatic monovalent hydrocarbon group having 1 to 10 carbon atoms, n is the number of methylene groups of 1 to 10, and X2 represents a halogen atom, the process comprising: obtaining a reaction product mixture by subjecting a (?-halo-2-alkenyl)triphenylphosphonium halide compound of the following general formula (1), wherein n is as defined for the general formula (5) above, X1 and X2 represent, independently of each other, a halogen atom, and Ph represents a phenyl group, to a phosphorus ylide preparation reaction with an alkali metal alkoxide of the following general formula (3), wherein R1 represents a linear or branched alkyl group having 1 to 6 carbon atoms, and M represents an alkali metal atom, in the presence of a lithium halide of the following general formula (2), wherein X3 represents a halogen atom, and then subjecting the aforesaid r
    Type: Application
    Filed: October 25, 2023
    Publication date: May 30, 2024
    Inventors: Miyoshi YAMASHITA, Takeru WATANABE
  • Patent number: 11970432
    Abstract: The present invention provides a process for preparing 2-methyl-N-(2?-methylbutyl)butanamide of the following formula (1): the process comprising: subjecting an ?-arylethyl-2-methylbutylamine compound of the following general formula (2): wherein Ar represents a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, to N-2-methylbutyrylation to form an N-?-arylethyl-2-methyl-N-(2?-methylbutyl)butanamide compound of the following general formula (3): wherein Ar is as defined above, and removing the ?-arylethyl group of the resulting compound (3) to form 2-methyl-N-(2?-methylbutyl)butanamide (1).
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: April 30, 2024
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takeshi Kinsho, Yusuke Nagae, Shogo Tsukaguchi, Yasuhiko Kutsuwada, Tatsuya Hojo, Takeru Watanabe
  • Publication number: 20240103365
    Abstract: The present invention provides a pattern forming method using an adhesion film forming composition comprising (A) a polymer compound, (B) a thermal acid generator, and (C) an organic solvent includes steps of: (I-1) applying the adhesion film forming composition onto a substrate to be processed and thereafter performing thermal treatment to form an adhesion film; (I-2) forming a resist upper layer film on the adhesion film using a resist upper layer film forming composition; (I-3) performing pattern exposure on the resist upper layer film and thereafter developing the resist upper layer film with a developer to form a circuit pattern on the resist upper layer film; and (I-4) transferring a pattern to the adhesion film and the substrate to be processed by dry etching with the resist upper layer film on which the circuit pattern is formed as a mask.
    Type: Application
    Filed: August 9, 2023
    Publication date: March 28, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Seiichiro TACHIBANA, Takeru WATANABE, Daisuke KORI, Takashi SAWAMURA
  • Publication number: 20240103370
    Abstract: The present invention provides a composition for forming an adhesive film that provides an adhesive film that yields good pattern profiles and has high adhesion to a resist upper layer film to prevent collapse of fine patterns in a fine patterning process during semiconductor apparatus manufacturing processes, as well as a patterning process using the composition and a method for forming an adhesive film using the composition. As such, provided is a composition for forming an adhesive film directly under a resist upper layer film. The composition includes: (A) a polymer containing a repeating unit shown by the following general formula (1) and a repeating unit shown by the following general formula (2); and (B) an organic solvent.
    Type: Application
    Filed: August 9, 2023
    Publication date: March 28, 2024
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Seiichiro TACHIBANA, Takeru WATANABE, Daisuke KORI, Takashi SAWAMURA
  • Publication number: 20230391710
    Abstract: The present invention provides a novel compound, (4Z,6E)-4,6-undecadienyl trimethylacetate (1). The present invention further provides a process for preparing (4Z,6E)-4,6-undecadienyl trimethylacetate (1), the process comprising subjecting a 4-halobutyl trimethylacetate compound (2) wherein X1 represents a halogen atom, to a phosphonium salt formation reaction with a phosphine compound of the following general formula (3) wherein Ar represents, independently of each other, an aryl group, to obtain a [4-(trimethylacetyloxy)butyl]triarylphosphonium halide compound (4) wherein Y represents a halogen atom, and Ar is as defined above, subjecting the [4-(trimethylacetyloxy)butyl]triarylphosphonium halide compound (4) to a deprotonation reaction in the presence of a base to obtain a reaction product mixture, and subjecting the reaction product mixture to a Wittig reaction with (2E)-2-heptenal (5) to obtain (4Z,6E)-4,6-undecadienyl trimethylacetate (1).
    Type: Application
    Filed: June 1, 2023
    Publication date: December 7, 2023
    Inventors: Yuki Miyake, Takeru Watanabe, Yusuke Nagae
  • Patent number: 11767282
    Abstract: There are provided a composition which has a larger attracted number than (9Z)-9,13-tetradecadien-11-ynal alone; and others. More specifically, there are provided a composition bioactive to Stenoma catenifer (STENCA), the composition including (9Z)-9,13-tetradecadien-11-ynal and (9E)-9,13-tetradecadien-11-ynal; a sustained release preparation for controlling STENCA, the preparation including the composition and a carrier or container for sustainedly releasing the (9Z)-9,13-tetradecadien-11-ynal and the (9E)-9,13-tetradecadien-11-ynal; and a method for controlling STENCA, the method including a step of installing the sustained release preparation in a field to release the (9Z)-9,13-tetradecadien-11-ynal and the (9E)-9,13-tetradecadien-11-ynal into the field.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: September 26, 2023
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yuki Miyake, Tatsuya Fujii, Yasuhiko Kutsuwada, Takeru Watanabe, Takeshi Kinsho
  • Patent number: 11746078
    Abstract: The present invention relates to a process for preparing a (1S,2R)-(2-hydroxy-3,5,5-trimethyl-3-cyclopentenyl)methyl carboxylate compound of the following general formula (S,R)-(2), wherein R1 represents a monovalent hydrocarbon group having 1 to 6 carbon atoms, and a bold wedged bond represents the absolute configuration, and a (1R,2S)-(2-acetoxy-3,5,5-trimethyl-3-cyclopentenyl)methyl carboxylate compound of the following general formula (R,S)-(3), wherein R1 is as defined above, a hashed wedged bond represents the absolute configuration, and Ac represents an acetyl group, the process comprising: subjecting a (1RS,2SR)-(2-hydroxy-3,5,5-trimethyl-3-cyclopentenyl)methyl carboxylate compound of the following general formula (RS,SR)-(2), wherein R1 is as defined above, and a hashed unwedged bond represents a relative configuration, to a kinetic resolution reaction with a lipase in the presence of vinyl acetate to obtain the (1S,2R)-(2-hydroxy-3,5,5-trimethyl-3-cyclopentenyl)methyl carboxylate compound ((S,R)-(2)
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: September 5, 2023
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomohiro Watanabe, Takeshi Kinsho, Takeru Watanabe, Miyoshi Yamashita, Yusuke Nagae
  • Patent number: 11731930
    Abstract: The present invention provides a process for preparing a (1,2-dimethyl-3-methylenecyclopentyl)acetate compound of the following general formula (3), wherein R represents a linear or branched alkyl group having 1 to 4 carbon atoms, the process comprising subjecting a haloacetaldehyde alkyl 2,3-dimethyl-2-cyclopentenyl acetal compound of the following general formula (1), wherein R is as defined above, and Y represents a halogen atom, to a dehydrohalogenation reaction in the presence of a base, followed by a rearrangement reaction to obtain a (1,2-dimethyl-2-cyclopentenyl)acetate compound of the following general formula (2), wherein R is as defined above, and subjecting the (1,2-dimethyl-2-cyclopentenyl)acetate compound (2) to an epoxidation reaction, followed by an isomerization reaction and then a methylenation reaction to obtain the (1,2-dimethyl-3-methylenecyclopentyl)acetate compound of the following general formula (3).
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: August 22, 2023
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Miyoshi Yamashita, Takeru Watanabe, Takeshi Kinsho
  • Patent number: 11692066
    Abstract: An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: July 4, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Daisuke Kori, Keisuke Niida, Takashi Sawamura, Takeru Watanabe, Seiichiro Tachibana, Tsutomu Ogihara
  • Publication number: 20230202968
    Abstract: The present invention provides a process for preparing 2-methyl-N-(2?-methylbutyl)butanamide of the following formula (1): the process comprising: subjecting an ?-arylethyl-2-methylbutylamine compound of the following general formula (2): wherein Ar represents a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, to N-2-methylbutyrylation to form an N-?-arylethyl-2-methyl-N-(2?-methylbutyl)butanamide compound of the following general formula (3): wherein Ar is as defined above, and removing the ?-arylethyl group of the resulting compound (3) to form 2-methyl-N-(2?-methylbutyl)butanamide (1).
    Type: Application
    Filed: February 28, 2023
    Publication date: June 29, 2023
    Inventors: Takeshi Kinsho, Yusuke Nagae, Shogo Tsukaguchi, Yasuhiko Kutsuwada, Tatsuya Hojo, Takeru Watanabe
  • Patent number: 11685703
    Abstract: The present invention relates to a process for preparing a 3,7-dimethylalkane compound (3): wherein n is 5 or 6, the process comprising: subjecting a nucleophilic reagent, 2,6-dimethyloctyl compound (1): wherein M1 represents Li, Mg Z1, CuZ1, or CuLiZ1, wherein Z1 represents a halogen atom or a 2,6-dimethyloctyl group, to a coupling reaction with an electrophilic alkyl reagent (2): wherein X1 represents a halogen atom or a p-toluenesulfonate group, and “n” is as defined above, to form the 3,7-dimethylalkane compound (3).
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: June 27, 2023
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yuki Miyake, Takeru Watanabe, Takeshi Kinsho
  • Patent number: 11676814
    Abstract: A material for forming an organic film using a polymer including an imide group for forming an organic underlayer film that cures under film-forming conditions in the air and in an inert gas, generates no by-product in heat resistance and embedding and flattening characteristics of a pattern formed on a substrate, also adhesiveness to a substrate for manufacturing a semiconductor apparatus, a method for forming an organic film, and a patterning process. The material includes (A) a polymer having a repeating unit represented by the following general formula (1A) whose terminal group is a group represented by either of the following general formulae (1B) or (1C), and (B) an organic solvent: wherein, W1 represents a tetravalent organic group, and W2 represents a divalent organic group: wherein, R1 represents any of the groups represented by the following formula (1D), and two or more of R1s may be used in combination.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: June 13, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Daisuke Kori, Takashi Sawamura, Keisuke Niida, Seiichiro Tachibana, Takeru Watanabe, Tsutomu Ogihara
  • Patent number: 11661390
    Abstract: The present invention relates to an acetal compound of the following general formula (1) and an acetal compound of the following general formula (2). The present invention relates to processes for preparing the acetal compound (2), comprising subjecting the acetal compound (1) to a hydrogenation reaction to form the acetal compound (2). The present invention provides a process for preparing 2,3,4,4-tetramethylcyclopentanecarbaldehyde of the following formula (3), comprising subjecting the acetal compound (2) to a hydrolysis reaction to form 2,3,4,4-tetramethylcyclopentanecarbaldehyde (3).
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: May 30, 2023
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takeru Watanabe, Takeshi Kinsho
  • Publication number: 20230159412
    Abstract: The present invention relates to a process for preparing a 3,7-dimethylalkane compound (3): wherein n is 5 or 6, the process comprising: subjecting a nucleophilic reagent, 2,6-dimethyloctyl compound (1): wherein M1 represents Li, Mg Z1, CuZ1, or CuLiZ1, wherein Z1 represents a halogen atom or a 2,6-dimethyloctyl group, to a coupling reaction with an electrophilic alkyl reagent (2): wherein X1 represents a halogen atom or a p-toluenesulfonate group, and “n” is as defined above, to form the 3,7-dimethylalkane compound (3).
    Type: Application
    Filed: November 23, 2022
    Publication date: May 25, 2023
    Inventors: Yuki Miyake, Takeru Watanabe, Takeshi Kinsho
  • Patent number: 11635691
    Abstract: A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1) as a repeating unit, and an organic solvent. Each of AR1 and AR2 represents a benzene ring or naphthalene ring which optionally have a substituent; W1 represents a particular partial structure having a triple bond, and the polymer optionally contains two or more kinds of W1; and W2 represents a divalent organic group having 6 to 80 carbon atoms and at least one aromatic ring. This invention provides: a polymer curable even under film formation conditions in an inert gas and capable of forming an organic film which has not only excellent heat resistance and properties of filling and planarizing a pattern formed in a substrate, but also favorable film formability onto a substrate with less sublimation product; and a composition for forming an organic film, containing the polymer.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: April 25, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Daisuke Kori, Takashi Sawamura, Keisuke Niida, Seiichiro Tachibana, Takeru Watanabe, Tsutomu Ogihara
  • Patent number: 11629119
    Abstract: The present invention provides a process for preparing 2-methyl-N-(2?-methylbutyl) butanamide of the following formula (1):the process comprising: subjecting an ?-arylethyl-2-methylbutylamine compound of the following general formula (2): wherein Ar represents a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, to N-2-methylbutyrylation to form an N-?-arylethyl-2-methyl-N-(2?-methylbutyl)butanamide compound of the following general formula (3): wherein Ar is as defined above, and removing the ?-arylethyl group of the resulting compound (3) to form 2-methyl-N-(2? -methylbutyl)butanamide (1).
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: April 18, 2023
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takeshi Kinsho, Yusuke Nagae, Shogo Tsukaguchi, Yasuhiko Kutsuwada, Tatsuya Hojo, Takeru Watanabe
  • Publication number: 20230062627
    Abstract: The present invention relates to an acetal compound of the following general formula (1) and an acetal compound of the following general formula (2). The present invention relates to processes for preparing the acetal compound (2), comprising subjecting the acetal compound (1) to a hydrogenation reaction to form the acetal compound (2). The present invention provides a process for preparing 2,3,4,4-tetramethylcyclopentanecarbaldehyde of the following formula (3), comprising subjecting the acetal compound (2) to a hydrolysis reaction to form 2,3,4,4-tetramethylcyclopentanecarbaldehyde (3).
    Type: Application
    Filed: July 11, 2022
    Publication date: March 2, 2023
    Inventors: Takeru Watanabe, Takeshi Kinsho