Patents by Inventor Takeshi Kawabata

Takeshi Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8191155
    Abstract: A microprocessor having a processor core includes an information acquisition unit that acquires information encrypted to be used by the processor core, from outside; a decryption unit that decrypts the information with a symmetric key to obtain plain text; and a controller that controls processing on the information acquired by the information acquisition unit based on the symmetric key.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: May 29, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroyoshi Haruki, Mikio Hashimoto, Takeshi Kawabata
  • Publication number: 20120100481
    Abstract: An actinic ray-sensitive or radiation-sensitive composition, including: (1) a low molecular compound having a molecular weight of 500 to 5,000 and containing (G) an acid-decomposable group; and (2) a compound capable of generating an acid of 305 ?3 or more in volume upon irradiation with an actinic ray or radiation, an actinic ray-sensitive or radiation-sensitive composition, including: a solvent; and (1A) a compound which is a low molecular compound having a molecular weight of 500 to 5,000 and containing (Z) one or more groups capable of decomposing upon irradiation with an actinic ray or radiation to produce an acid, (G) one or more acid-decomposable groups and (S) one or more dissolution auxiliary groups, wherein assuming that the number of the functional groups in one molecule of (Z), (G) and (S) is z, q and s, respectively, q/z?2 and s/z?2, and a pattern forming method using the composition are provided.
    Type: Application
    Filed: July 28, 2010
    Publication date: April 26, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Takayuki Ito, Tomotaka Tsuchimura, Takeshi Kawabata
  • Patent number: 8159061
    Abstract: A stacked semiconductor module is made by stacking a second semiconductor device having a second semiconductor chip mounted to the top surface of a second semiconductor substrate above the top surface of a first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate. The top surface of the first semiconductor substrate is provided with a first connection terminal and the bottom surface of the first semiconductor substrate is provided with an external connection terminal. A region of the bottom surface of the second semiconductor substrate lying opposite to the second semiconductor chip is provided with a second connection terminal. A conductive connecting member connects the first connection terminal to the second connection terminal.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: April 17, 2012
    Assignee: Panasonic Corporation
    Inventors: Takeshi Kawabata, Toshiyuki Fukuda
  • Publication number: 20120082939
    Abstract: An active light ray sensitive or radioactive ray sensitive resin composition which satisfies high sensitivity, high resolution, good pattern configuration, and good line edge roughness at the same time to a great extent, while having sufficiently good outgassing performance during exposure, and an active light ray sensitive or radioactive ray sensitive film formed by using the composition, and a pattern-forming method, are provided. The active light ray sensitive or radioactive ray sensitive resin composition according to the present invention includes a resin (P) containing a repeating unit (A) which decomposes by irradiation with active light ray or radioactive ray to generate an acid, and a repeating unit (C) containing a primary or secondary hydroxyl group.
    Type: Application
    Filed: October 4, 2011
    Publication date: April 5, 2012
    Applicant: FUJIFILM Corporation
    Inventors: Takeshi KAWABATA, Hidenori Takahashi, Tomotaka Tsuchimura, Shuji Hirano, Hideaki Tsubaki
  • Patent number: 8148810
    Abstract: In a substrate for a stacking-type semiconductor device including a connection terminal provided for a connection with a semiconductor chip to be stacked and an external terminal connected to the connection terminal through a conductor provided in a substrate, connection terminals of a power supply, a ground and the like, which terminals have an identical node, are electrically continuous with each other. Thus, it is possible to facilitate an inspection of electrical continuity between each connection terminal and an external terminal corresponding to each connection terminal by minimum addition of inspecting terminals. Further, it is possible to improve reliability of a stacking-type semiconductor module.
    Type: Grant
    Filed: October 25, 2006
    Date of Patent: April 3, 2012
    Assignee: Panasonic Corporation
    Inventors: Masatoshi Shinagawa, Takeshi Kawabata
  • Publication number: 20120079283
    Abstract: According to an embodiment, a memory management device increments a lower value of a first counter, updates the counter by incrementing an upper value and resetting the lower value when the lower value overflows, increments to update the lower counter value when the upper value is incremented as a result of writing a second data piece having the upper value in common to a memory, recalculates a first secret value calculated using the first counter values and a root secret value in response to the first counter update, writes a first data piece and the first secret value to the memory, and at reading of the first data piece and the first secret value, calculates a second secret value using the updated first counter values and the root secret value, and compares the first secret value with the second secret value to verify the first data piece.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 29, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Mikio HASHIMOTO, Hiroyoshi HARUKI, Takeshi KAWABATA, Tomohide JOKAN, Yurie FUJIMATSU, Ryotaro HAYASHI, Fukutomo NAKANISHI
  • Publication number: 20120070917
    Abstract: When bump electrodes 26 of a semiconductor light emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light emitting element 2 to emit light, the optical properties of the semiconductor light emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light emitting element.
    Type: Application
    Filed: April 26, 2011
    Publication date: March 22, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Tomonori Itoh, Kaori Toyoda, Hiroki Ikeuchi, Takeshi Kawabata
  • Publication number: 20120069997
    Abstract: According to one embodiment, an encryption device includes a storage unit, an input unit, first to fourth partial encryption units, a generation unit, and an output unit. The first partial encryption unit calculates first intermediate data from input plain data to store in the storage unit. The generation unit generates a round key, which is used in calculations for the first intermediate data and N-th intermediate data, from the secret key. The second partial encryption unit calculates (i+1)th intermediate data from i-th intermediate data (i is smaller than N) and the round key to store in the storage unit. The third partial encryption unit performs an arithmetic operation including predetermined conversion for mixing the N-th intermediate data, and calculates (N+1)th intermediate data to store in the storage unit. The fourth partial encryption unit obtains encrypted data by performing an arithmetic operation including inverse conversion of the conversion on the (N+1)th intermediate data.
    Type: Application
    Filed: March 17, 2011
    Publication date: March 22, 2012
    Inventors: Takeshi KAWABATA, Hideo Shimizu
  • Patent number: 8125792
    Abstract: In a stacked semiconductor module, a test covering connecting terminals is easily conducted and high reliability is achieved.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: February 28, 2012
    Assignee: Panasonic Corporation
    Inventor: Takeshi Kawabata
  • Publication number: 20120003590
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition containing a resin having (A) a repeating unit represented by a specific formula (I) and (B) a repeating unit capable of generating an acid upon irradiation with an actinic ray or radiation.
    Type: Application
    Filed: February 23, 2011
    Publication date: January 5, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuji HIRANO, Hidenori TAKAHASHI, Tomotaka TSUCHIMURA, Takeshi KAWABATA, Hideaki TSUBAKI
  • Publication number: 20110318691
    Abstract: An embodiment of the composition contains any of compounds of general formula (I) below:
    Type: Application
    Filed: June 28, 2011
    Publication date: December 29, 2011
    Applicant: FUJIFILM CORPORATION
    Inventors: Tomotaka TSUCHIMURA, Hideaki TSUBAKI, Takeshi KAWABATA
  • Publication number: 20110318693
    Abstract: An embodiment of the composition contains a resin (P) containing a repeating unit (A) that is configured to decompose when exposed to actinic rays or radiation to thereby generate an acid. The repeating unit (A) contains a cation structure with a monocyclic or polycyclic heterocycle containing a nitrogen atom.
    Type: Application
    Filed: June 28, 2011
    Publication date: December 29, 2011
    Applicant: FUJIFILM CORPORATION
    Inventors: Hidenori TAKAHASHI, Tomotaka TSUCHIMURA, Shuji HIRANO, Takeshi KAWABATA, Hideaki TSUBAKI
  • Patent number: 8008766
    Abstract: A stacked semiconductor module is made by stacking a second semiconductor device having a second semiconductor chip mounted to the top surface of a second semiconductor substrate above the top surface of a first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate. The top surface of the first semiconductor substrate is provided with a first connection terminal and the bottom surface of the first semiconductor substrate is provided with an external connection terminal. A region of the bottom surface of the second semiconductor substrate lying opposite to the second semiconductor chip is provided with a second connection terminal. A conductive connecting member connects the first connection terminal to the second connection terminal.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: August 30, 2011
    Assignee: Panasonic Corporation
    Inventors: Takeshi Kawabata, Toshiyuki Fukuda
  • Publication number: 20110189609
    Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes an arylsulfonium salt that when exposed to actinic rays or radiation, generates an acid, the arylsulfonium salt containing at least one aryl ring on which there are a total of one or more electron donating groups, the acid generated upon exposure to actinic rays or radiation having a volume of 240 ?3 or greater.
    Type: Application
    Filed: January 28, 2011
    Publication date: August 4, 2011
    Applicant: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Tomotaka Tsuchimura, Takayuki Ito
  • Publication number: 20110156271
    Abstract: A semiconductor module having a second semiconductor package 200 mounted on a first semiconductor package 100, wherein the first semiconductor package 100 includes: pads 15 formed on the top surface of the first semiconductor package 100; external connection terminals 2 formed on the underside of the first semiconductor package 100, and vias 18 electrically connecting the pads 15 and the connection terminals 2. In a radiographic plane viewed in a vertical direction relative to one surface of a second substrate 25 of the second semiconductor package 200, the via 18 overlaps one of the pad 15 and the connection terminal 2, the pad 15 and the connection terminal 2 overlap each other, and the pad 15 has the center position outside the connection terminal 2.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 30, 2011
    Applicant: PANASONIC CORPORATION
    Inventor: Takeshi Kawabata
  • Publication number: 20110110519
    Abstract: A data transmission device (100) performs encryption processing on transmission data, performs encryption processing of a Feistel structure on the obtained first converted data, and performs processing in the relationship of an inverse function with the first encryption processing on the obtained second converted data. A first converting unit (105) divides transmission data into N sets (N being three or greater) of divided transmission data, performs operation processing on the divided transmission data to generate at least N sets of operation processing data, and combines the generated N sets of operation processing data to generate the first converted data.
    Type: Application
    Filed: January 9, 2009
    Publication date: May 12, 2011
    Inventors: Tomoyasu Suzaki, Yukiyasu Tsunoo, Hiroyasu Kubo, Maki Shigeri, Teruo Saito, Takeshi Kawabata, Hiroki Nakashima
  • Publication number: 20110102528
    Abstract: An embodiment of the composition contains any of compounds of the formula A-LG in which A represents any of residues of general formula (A-1) below and LG represents any of groups that are cleaved to generate acids of the formula A-H when acted on by an acid. The composition further contains at least one of a compound that generates an acid when exposed to actinic rays or radiation and a compound that generates an acid when heated.
    Type: Application
    Filed: October 28, 2010
    Publication date: May 5, 2011
    Applicant: FUJIFILM Corporation
    Inventors: Tomotaka TSUCHIMURA, Takeshi Kawabata, Takayuki Ito
  • Publication number: 20110107336
    Abstract: A microprocessor executes programs in a pipeline architecture that includes a task register management unit that switches a value of a task register to second register information that is used when a second task is executed after the execution of a first task is completed, if a switch instruction to the second task is issued when a plurality of units executes the first task, and a task manager that switches a value of a task identification information register to a second task identifier after the value is switched to the second register information, and grants each of the plurality of units permission to execute the second task.
    Type: Application
    Filed: November 4, 2010
    Publication date: May 5, 2011
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Hiroyoshi Haruki, Mikio Hashimoto, Takeshi Kawabata
  • Publication number: 20110076615
    Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound that when exposed to actinic rays or radiation, generates any of acids of general formula (I) below, in which W1 represents an optionally substituted alkylene group, W2 represents a bivalent connecting group, W3 represents an optionally substituted organic group having 15 or more carbon atoms, and Z represents a hydroxyl group or a fluoroalkylsulfonamido group having at least one fluorine atom introduced therein as a substituent.
    Type: Application
    Filed: September 30, 2010
    Publication date: March 31, 2011
    Applicant: FUJIFILM Corporation
    Inventors: Takeshi KAWABATA, Tomotaka Tsuchimura, Takayuki Ito
  • Patent number: 7882644
    Abstract: An alignment mechanism includes: an adjusting plate having first and second adjustment ends parallel to an X axis direction; a probe fixing portion provided to the adjusting plate; a probe fixed to the probe fixing portion; a reinforcing plate having first and second base ends parallel to the X axis direction, displacement of the reinforcing portion in a Y axis direction being restricted; Y-direction adjusting screws for pressing the adjusting plate in the Y axis direction; and adjustment connectors for respectively connecting the first adjustment end with the first base end and the second adjustment end with the second base end. A stylus of the probe is disposed on a line of intersection of a first inclined surface including the first adjustment end and the first base end and a second inclined surface including the second adjustment end and the second base end.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: February 8, 2011
    Assignee: Mitutoyo Corporation
    Inventors: Takeshi Kawabata, Takeshi Yamamoto