Abstract: A solid state imaging device is composed of an image sensor chip and a hollow package that contains the image sensor chip. The hollow package has a recessed first chip chamber on a top surface of its package body. Formed on a bottom surface of the first chip chamber is a recessed second chip chamber. A small image sensor chip is contained in the second chip chamber, whereas a large image sensor chip is contained in the first chip chamber.

Abstract: Formed on a semiconductor substrate is a CCD image sensor. The CCD image sensor has photodiodes arranged in a matrix form, a transfer path for transferring signal charges generated by the photodiodes, and an output amplifier for amplifying and outputting the signal charges. The transfer path and the output amplifier are covered with a light shielding film, This light shielding film has integral radiation fins.

Abstract: On the external packing film 124 of the memory card insertion section vicinity of the bottom surface of the digital camera 100, the ROM chip and the print wiring 131 are surface-mounted, and one end of the print wiring 131 is connected to the ROM chip 130, and the other end is connected to the external connecting terminal 132 provided on the bottom surface of the digital camera 100. The identifying information in the ROM chip 130 is read out at the time of the operation of the digital camera 100, and is collated with the identifying information inside the camera, and when it can not be collated or it is not coincident, the power source of the camera is compulsively turned off.

Abstract: A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Abstract: In a digital camera in which a photographic field is photographed and which has an image pick-up device 102 for outputting an image signal corresponding to a photographic field, an analog signal processing circuit 106 for processing the image signal, a digital signal processing circuit 108 and an image data processing section 110, a detachable memory card 112 for storing so that the image information processed by the processing means can be read out, and a CPU 111 for controlling an operation of each section, the digital camera has a program by which the ID information previously stored in the memory card 112 is read out, and stored in a digital camera main body side.

Abstract: On the external packing film 124 of the memory card insertion section vicinity of the bottom surface of the digital camera 100, the ROM chip and the print wiring 131 are surface-mounted, and one end of the print wiring 131 is connected to the ROM chip 130, and the other end is connected to the external connecting terminal 132 provided on the bottom surface of the digital camera 100. The identifying information in the ROM chip 130 is read out at the time of the operation of the digital camera 100, and is collated with the identifying information inside the camera, and when it can not be collated or it is not coincident, the power source of the camera is compulsively turned off.

Abstract: According to the present invention, an image capturing apparatus for capturing a subject includes: a vertical body including a front face and a back opposed to the front face; a grip to be grasped by an operator's hand, the grip including at least a region of the front face and a region of the back; a release switch provided on the front face of the body in a region other than the part included in the grip; a capturing lens provided on the back of the body in a region other than the part included in the grip; an image monitor operable to display the subject, the image monitor being provided above the release switch.

Abstract: An image-capturing apparatus is capable of capturing a three-dimensional image and a high quality panoramic image as the need arises, and is portable if it is used as a single lens camera that captures a normal two-dimensional image. A second image-capturing unit having an image-capturing optical system is detachably connected to a first image-capturing unit, which is capable of functioning as an image-capturing apparatus by itself, through joints and a connector. The second image-capturing unit can extensively connect to other units, which have the similar connecting structure. Information is transmitted between the units through a slot for an external storage device. The positions of images captured by the second and subsequent image-capturing units can be adjusted with respect to an image captured by the first image-capturing unit. In synchronism with release signals from the first image-capturing unit, the other units are driven to capture the images at the same time or continuously.

Abstract: A photoelectric converting layer lamination type solid-state image pick-up device comprises: a semiconductor substrate; at least three layers of photoelectric converting layers each of which is interposed between a common electrode layer and pixel electrode layers, the pixel electrode layers corresponding to pixels respectively, wherein said at least three layers of photoelectric converting layers are laminated through insulating layers, said at least three layers of photoelectric converting layers being above the semiconductor substrate, and wherein each of said at least three layers of photoelectric converting layers is separated into layers corresponding the pixels respectively.

Abstract: A solid-state imaging device is provided and has a plurality of pixel parts including three photoelectric conversion layers stacked above a semiconductor substrate, the plurality of pixel parts being arranged above the semiconductor substrate. The three photoelectric conversion layers, respectively, included in one pixel part are interposed between pixel electrode layers and opposing electrode layers. A region thus interposed is made a pixel region that generates a signal charge for formation of one pixel data. The pixel region includes a convex portion and a concave portion as viewed in plane view, and a part of the convex portion is arranged in a manner to put in a concave portion in a pixel region of an adjacent pixel part.

Abstract: A photoelectric conversion layer-stacked solid-state imaging element comprises: a semiconductor substrate having a signal reading circuit formed thereon; at least one layer of photoelectric conversion layer each of which is provided interposed between a common electrode layer and a plurality of pixel electrode layers corresponding to pixels, said at least one layer of photoelectric conversion layer being stacked above the semiconductor substrate via a light shielding layer; and inhibiting structures each of which inhibits a reflected light produced by reflection of incident light on the light shielding layer, the incident light having passed through said at least one layer of photoelectric conversion layer and entered into a pixel, from entering in direction toward adjacent pixels.

Abstract: A CCD of a digital camera has high sensitive main pixels for depicting gradations in low and middle brightness portions of a subject, and low sensitive sub pixels for depicting gradations in high brightness portions of the subject. Main pixel image signals from the main pixels have a larger signal level than sub pixel image signals from the sub pixels. The main pixel image signals are attenuated by an attenuator to have the same signal level as the sub pixel image signals. The attenuated main pixel image signals and the sub pixel image signals are amplified by an amplifier with the same gain. The amplified main and sub pixel image signals are digitalized and composed to generate composite image data.

Abstract: The semiconductor device according to this invention is chacterized by a package structure of a semiconductor substrate 100 equipped with a photoelectric converting portion, wherein a light-shading means 104 is arranged in an area corresponding to at least the photoelectric converting portion on the side of the rear surface of the semiconductor substrate.

Abstract: An information recording apparatus for recording external information of the present invention including an input unit for transmitting a user's instruction to the information recording apparatus. The input unit includes a cross key and a dot matrix display arranged to be wedged in the crossing of the cross key.

Abstract: A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Abstract: A digital camera in which a personal telephone or a card type communication medium can be mounted, and which disables communication access to a recording medium in the camera, when the recording medium is being replaced with the communication medium. A lid a having a notch is provided in a receptacle or a slot and the notch is formed so as to prevent interference with a connector portion of a connection cable when a communication PC card is inserted in the receptacle or slot.

Abstract: A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Abstract: A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Abstract: A method for recycling a digital camera which includes: a communication section which outputs image data to an external device; and a protecting cover which covers the communication section and which is removed at times when the image data is output, wherein after the protecting cover is removed and the image data is taken out from the communication section, the communication section is once again covered by the protecting cover.

Abstract: According to the present invention, a reduced image is generated only from one of high-sensitivity image information or low-sensitivity image information when RAW data is recorded, and the reduced image is recorded on a recording medium together with the RAW data (first and second RAW data). Thereby, it is possible to create the reduced image in a relatively short time. In this case, if a reduced image is generated from the high-sensitivity image information, a high-contrast image with a desirable S/N ratio can be acquired. If a reduced image is generated from the low-sensitivity image information, an image appropriately representing the content of a reproduction area of the RAW data can be acquired.