Patents by Inventor Takuya Fukuda

Takuya Fukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240182766
    Abstract: An adhesive composition containing an adhesive component, in which the adhesive component contains a polyorganosiloxane component that is cured by hydrosilylation reaction, and the polyorganosiloxane component contains a polymer represented by formula (V) below, wherein n represents the number of repeating units, and is a positive integer, and the polyorganosiloxane component has a weight average molecular weight of 60,000 or more.
    Type: Application
    Filed: March 1, 2022
    Publication date: June 6, 2024
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takuya FUKUDA, Shunsuke MORIYA, Hiroto OGATA
  • Publication number: 20240150880
    Abstract: Stainless steel foil with improved durability to repeated bending under the extreme bending conditions demanded of foldable displays and rollable displays. This stainless steel foil is flexible stainless steel foil comprising rolled stainless steel foil with a thickness of 0.1 mm or less, having a tensile strength of 1,800 MPa or more, and having a maximum height roughness of Rz of 0.35 ?m or less obtained from a roughness curve of the stainless steel foil surface as measured in the same direction as a tensile direction.
    Type: Application
    Filed: March 30, 2022
    Publication date: May 9, 2024
    Applicant: NIPPON STEEL Chemical & Material Co., Ltd.
    Inventors: Keiichi KIMURA, Yuuki YOSHIDA, Takuya HIRAGA, Masahiro FUKUDA, Yuji KUMA
  • Publication number: 20240116129
    Abstract: In a state where a shoulder member is in contact with a contact surface, a pin member is brought into contact with the contact surface to specify a pin movement amount, which is a distance from an initial position of the pin member to the contact surface, and specify a shoulder displacement amount, which is a displacement amount when the shoulder member is retreated as a result of the contact of the pin member. When both a first condition that the pin movement amount is included in a first range and a second condition that the shoulder displacement amount is included in a second range are satisfied, the pin member is retreated from the contact surface by a predetermined return amount, and furthermore, origin point alignment of the pin member and the shoulder member is performed on the basis of positions of the pin member and the shoulder member.
    Type: Application
    Filed: February 7, 2022
    Publication date: April 11, 2024
    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Masahiro MIYAKE, Takuya FUKUDA, Tadahiro EDAGAWA, Norichika KITA, Makoto TSUJINAKA
  • Publication number: 20240043655
    Abstract: According to an additive composition which contains: (A) an aromatic phosphate sodium salt represented by the following Formula (1), where R1 to R5 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; (B) a fatty acid sodium salt; and (C) talc, and in which a mass ratio (B)/(A) of the content of the component (B) with respect to the content of the component (A) is 0.1 to 3 and a mass ratio (C)/[(A)+(B)+(C)] of the content of the component (C) with respect to a total content of the components (A), (B), and (C) is 0.2 to 0.8, for example, an additive composition which has excellent powder flowability and can impart excellent mechanical properties and excellent color tone to a molded article can be provided.
    Type: Application
    Filed: July 29, 2021
    Publication date: February 8, 2024
    Applicant: ADEKA CORPORATION
    Inventors: Yuhei HATTORI, Takuya FUKUDA, Akitomo SATO
  • Publication number: 20240006221
    Abstract: There is provided a laminate including: a support substrate; a semiconductor substrate having a bump on a side of the support substrate; an inorganic material layer interposed between the support substrate and the semiconductor substrate and in contact with the semiconductor substrate; and an adhesive layer interposed between the support substrate and the inorganic material layer and in contact with the support substrate and the inorganic material layer, in which the laminate is used for an application in which the support substrate and the semiconductor substrate are separated from each other after processing of the semiconductor substrate in the laminate, and an adhesive force between the inorganic material layer and the adhesive layer when the support substrate and the semiconductor substrate are separated from each other is smaller than an adhesive force between the inorganic material layer and the semiconductor substrate.
    Type: Application
    Filed: November 26, 2021
    Publication date: January 4, 2024
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroto OGATA, Tetsuya SHINJO, Shunsuke MORIYA, Takuya FUKUDA, Takahisa OKUNO
  • Patent number: 11839929
    Abstract: A dissimilar metal welding method includes a preparing step and a working step. In the preparing step, a pin member is moved to a second metal material while being rotated, and a tool body is driven such that the tool body is moved in a direction away from the second metal material while being rotated. In the working step, a through-hole is formed in the second metal material by the pin member, and then a distal end of the pin member is dug into the first metal material to a predetermined depth position in the first metal material.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: December 12, 2023
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Takao Sekiguchi, Yoshitaka Muramatsu, Takuya Fukuda
  • Patent number: 11794274
    Abstract: A dissimilar metal welding method includes a preparing step and a working step. In the preparing step, a pin member is moved to a second metal material while being rotated, and a tool body is driven such that the tool body is moved in a direction away from the second metal material while being rotated. In the working step, a through-hole is formed in the second metal material by the pin member, and then a distal end of the pin member is dug into the first metal material to a predetermined depth position in the first metal material.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: October 24, 2023
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Takao Sekiguchi, Yoshitaka Muramatsu, Takuya Fukuda
  • Publication number: 20230151307
    Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition which contains a solvent but no salt, the solvent containing a C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound. As the C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound, a linear-chain hydrocarbon compound is used.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 18, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroshi OGINO, Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Tetsuya SHINJO, Kazuhiro SAWADA
  • Publication number: 20230151306
    Abstract: The invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, L represents a substituent to the benzene ring, and each of a plurality of Ls represents a C1 to C4 alkyl group; and k represents the number of Ls and is an integer of 0 to 5) in an amount of 80 mass % or more.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 18, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO
  • Publication number: 20230151308
    Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L1 and L2 represents a C2 to C4 alkyl group, and L3 represents O or S) in an amount of 80 mass % or more.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 18, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO
  • Publication number: 20230143936
    Abstract: Provided are: a composition that can impart a thermoplastic resin with excellent transparency and physical properties; a thermoplastic resin composition containing the same; and a molded article thereof. The composition contains: (A) a cyclic organophosphate aluminum salt represented by Formula (1) below, wherein R1 to R4 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 9 carbon atoms and R5 represents an alkylidene group having 1 to 4 carbon atoms; (B) a sodium carboxylate; and (C) a fatty acid metal salt represented by Formula (2) below, wherein R6 represents a group which is introduced to an aliphatic organic acid having 10 to 30 carbon atoms and M1 represents lithium or potassium, wherein the following ranges are satisfied in terms of molar ratio: (C)/(B)=0.30 to 5.00, and (A)/{(B)+(C)}=0.15 to 0.70.
    Type: Application
    Filed: January 4, 2023
    Publication date: May 11, 2023
    Applicant: ADEKA CORPORATION
    Inventors: Takuya FUKUDA, Yuri YOKOTA, Hiroaki MIZUSHIMA, Takahiro HORIKOSHI
  • Publication number: 20230131428
    Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, each of L1 and L2 represents a C1 to C6 alkyl group, and the sum of the number of carbon atoms of the alkyl group L1 and that of the alkyl group L2 is 6 or less) in an amount of 80 mass % or more.
    Type: Application
    Filed: March 22, 2021
    Publication date: April 27, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO
  • Publication number: 20230125907
    Abstract: A semiconductor substrate cleaning method including removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by any of formulae (L0) to (L4).
    Type: Application
    Filed: March 22, 2021
    Publication date: April 27, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO
  • Publication number: 20230131533
    Abstract: The invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, characterized in that the remover composition contains a solvent but no salt; the solvent includes one or more species selected from among an aliphatic hydrocarbon compound, an aromatic hydrocarbon compound, an ether compound, a thioether compound, an ester compound, and an amine compound, each having a molecular weight less than 160; and the remover composition exhibits a contact angle smaller than 31.5° with respect to the adhesive layer.
    Type: Application
    Filed: March 22, 2021
    Publication date: April 27, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Takahisa OKUNO, Masaki YANAI, Takuya FUKUDA, Hiroto OGATA, Shunsuke MORIYA, Hiroshi OGINO, Tetsuya SHINJO
  • Publication number: 20230129238
    Abstract: The invention provides a cleaning agent composition for use in removing an adhesive residue, characterized in that the composition contains a quaternary ammonium salt, a metal corrosion inhibitor, and an organic solvent, and the metal corrosion inhibitor is formed of a C7 to C40 saturated aliphatic hydrocarbon compound monocarboxylic acid, a C7 to C40 saturated aliphatic hydrocarbon compound dicarboxylic acid or anhydride, a C7 to C40 unsaturated aliphatic hydrocarbon compound monocarboxylic acid, or a C7 to C40 unsaturated aliphatic hydrocarbon compound dicarboxylic acid or anhydride.
    Type: Application
    Filed: March 30, 2021
    Publication date: April 27, 2023
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroshi OGINO, Takahisa OKUNO, Masaki YANAI, Shunsuke MORIYA, Hiroto OGATA, Takuya FUKUDA, Tetsuya SHINJO
  • Patent number: 11578188
    Abstract: Provided are: a composition that can impart a thermoplastic resin with excellent transparency and physical properties; a thermoplastic resin composition containing the same; and a molded article thereof. The composition contains: (A) a cyclic organophosphate aluminum salt represented by Formula (1) below, wherein R1 to R4 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 9 carbon atoms and R5 represents an alkylidene group having 1 to 4 carbon atoms; (B) a sodium carboxylate; and (C) a fatty acid metal salt represented by Formula (2) below, wherein R6 represents a group which is introduced to an aliphatic organic acid having 10 to 30 carbon atoms and M1 represents lithium or potassium, wherein the following ranges are satisfied in terms of molar ratio:(C)/(B)=0.30 to 5.00, and (A)/{(B)+(C)}=0.15 to 0.70.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: February 14, 2023
    Assignee: ADEKA CORPORATION
    Inventors: Takuya Fukuda, Yuri Yokota, Hiroaki Mizushima, Takahiro Horikoshi
  • Publication number: 20220411684
    Abstract: The invention provides an adhesive composition containing an adhesive component (S) and a release component (H) formed of a polyorganosiloxane having a complex viscosity of 3,400 (Pa·S) or higher.
    Type: Application
    Filed: December 15, 2020
    Publication date: December 29, 2022
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Hiroto OGATA, Tetsuya SHINJO, Hiroshi OGINO, Shunsuke MORIYA, Takahisa OKUNO, Takuya FUKUDA, Masaki YANAI
  • Publication number: 20220362889
    Abstract: A joining system (100) of the present invention is for joining a joining target (W) including first, second, and third members (W1), (W2), (W3), and includes a welder (101), a friction stir welding machine (102), and a controller (110) that: (A) causes the welder (101) to weld the second and third members (W2), (W3); (B), after (A), causes the joining target (W) to be placed at the friction stir welding machine (102) so that the first member (W1) is opposed to a distal end of a tool (10); and (C), after (B), controls a linear motion driver (7) and a rotation driver (8) so as to, while pressing the distal end of the tool (10) to the joining target (W), rotate the tool (10) around an axis, so that the softened second and third members (W2), (W3) intrude into the softened first member (W1), thus joining the joining target (W).
    Type: Application
    Filed: June 18, 2020
    Publication date: November 17, 2022
    Applicant: Kawasaki Jukogyo Kabushiki Kaisha
    Inventors: Ryoji OHASHI, Yoshitaka MURAMATSU, Naoki TAKEOKA, Takuya FUKUDA
  • Publication number: 20220204724
    Abstract: Provided are: a nucleating agent capable of simultaneously improving the thermal stability and the transparency of a polyolefin resin; a polyolefin-based resin composition containing the same; and a molded article of the composition. The nucleating agent contains a compound represented by Formula (1) below where R1 to R4 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 9 carbon atoms; R5 represents an alkanediyl group having 1 to 4 carbon atoms; and M represents a hydrogen atom or a sodium atom. In this nucleating agent, the mass ratio of phosphorus atoms and sodium atoms, P/Na, is in a range of 1.200 to 1.500.
    Type: Application
    Filed: March 15, 2022
    Publication date: June 30, 2022
    Applicant: ADEKA CORPORATION
    Inventors: Takuya FUKUDA, Hiroaki MIZUSHIMA, Yuri YOKOTA
  • Publication number: 20220119559
    Abstract: Provided are: a nucleating agent composition, which can impart excellent crystallinity to an olefin-based resin and with which a molded article having excellent mechanical properties and transparency can be obtained; an olefin-based resin composition; a molded article of the same; and a method of producing an olefin-based resin composition. The nucleating agent composition contains a nucleating agent and an auxiliary agent.
    Type: Application
    Filed: January 21, 2020
    Publication date: April 21, 2022
    Applicant: ADEKA CORPORATION
    Inventors: Hiroaki MIZUSHIMA, Takuya FUKUDA, Yuri YOKOTA