Patents by Inventor Tao Han

Tao Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shock absorbing screw for connecting hard disk to hard disk frame
    Patent number: 10613597
    Abstract: A shock absorbing screw includes a locking member, a friction member sleeved on the locking member, and a connecting frame sleeved on the friction member. The shock absorbing screw is connected to a hard disk by a connecting portion of the shock absorbing screw. An abutting portion of the shock absorbing screw is connected to the friction member. The connecting portion is passed through a second through hole defined in the friction member. A first end of the connecting frame includes a first clamping portion, a second end of the connecting frame includes a second clamping portion, and a second groove is defined between the first clamping portion and the second clamping portion. The shock absorbing screw is connected to a hard disk frame in the second groove. The friction member is connected to the connecting frame through a first through hole defined in the connecting frame.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: April 7, 2020
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xiao-Ming Liu, He-Tao Han, Jun-Hua Tan, Zhi-Qiang Li, Yi-Sheng Lin
  • Method of manufacturing finfet devices using narrow and wide gate cut openings in conjunction with a replacement metal gate process
    Patent number: 10586860
    Abstract: In conjunction with a replacement metal gate (RMG) process for forming a fin field effect transistor (FinFET), gate isolation methods and associated structures leverage the formation of distinct narrow and wide gate cut regions in a sacrificial gate. The formation of a narrow gate cut between closely-spaced fins can decrease the extent of etch damage to interlayer dielectric layers located adjacent to the narrow gate cut by delaying the deposition of such dielectric layers until after formation of the narrow gate cut opening. The methods and resulting structures also decrease the propensity for short circuits between later-formed, adjacent gates.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: March 10, 2020
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Jiehui Shu, Laertis Economikos, Xusheng Wu, John Zhang, Haigou Huang, Hui Zhan, Tao Han, Haiting Wang, Jinping Liu, Hui Zang
  • Painted polyolefin articles
    Patent number: 10557005
    Abstract: A painted article includes a primer layer between a substrate and a paint layer, of which the substrate is the product of a substrate forming composition including an olefin block copolymer and a polypropylene polymer having a density from 0.89 g/cm3 and 0.92 g/cm3. The substrate is free of (1) phthalate-based plasticizer, (2) halogen-containing polymer, and (3) leachable, small polymeric units derived from styrene monomer.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: February 11, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Tao Han, Jeffrey C. Munro, Lisa S. Madenjian, Hong Yang
  • Light emitting diode chip with protective layer of metal catalyst and fluorinated graphene and preparation method thereof
    Patent number: 10553762
    Abstract: A method for preparing a light emitting diode chip, the method including: 1) providing a substrate; 2) growing an n-type semiconductor layer, an active layer and a p-type semiconductor layer on the substrate sequentially in that order; 3) forming a step including an upper horizontal end surface, a lower horizontal end surface and a step surface in the n-type semiconductor layer, the active layer and the p-type semiconductor layer; 4) growing a transparent conductive layer on the upper horizontal end surface, and forming an etching hole in the middle of the transparent conductive layer; 5) forming an N electrode on the lower horizontal end surface, and forming a P electrode in the etching hole; 6) growing a metal catalyst layer on the light emitting diode chip; and 7) forming a fluorinated graphene protective layer on the metal catalyst layer.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: February 4, 2020
    Assignee: HC SEMITEK CORPORATION
    Inventors: Peng Xie, Lingfeng Yin, Tao Han, Jiangbo Wang, Peng Li
  • Fixing bracket and chassis using the same
    Patent number: 10520993
    Abstract: A chassis includes a frame and a fixing bracket for fixing an expansion card to the frame. The frame defines at least one card hole and includes a side hook. The fixing bracket includes a bracket body, at least one rotating hook fixed to the bracket body and a movable hook fixed to the bracket body. The rotating hook and the movable hook are not in the same plane. When the at least rotating hook is inserted into the at least one card hole and the bracket body is rotated in a first direction to a predetermined position, the rotating hook is locked in the card hole, and the movable hook is hooked on the side hook to make the bracket body fix an expansion card to the frame.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: December 31, 2019
    Assignees: HONGFUJIN PRECISION INDUSTRY (WUHAN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: He-Tao Han, Jun-Hua Tan, Ling-Xin Zeng, Zhi-Qiang Li, Yi-Sheng Lin
  • IC PRODUCT COMPRISING AN INSULATING GATE SEPARATION STRUCTURE POSITIONED BETWEEN END SURFACES OF ADJACENT GATE STRUCTURES
    Publication number: 20190355832
    Abstract: One illustrative IC product disclosed herein includes first and second final gate structures and an insulating gate separation structure positioned between the first and second final gate structures. In one embodiment, the insulating gate separation structure has a stepped bottom surface with a substantially horizontally oriented bottom central surface that is surrounded by a substantially horizontally oriented recessed surface, wherein the substantially horizontally oriented bottom central surface is positioned a first level above the substrate and the substantially horizontally oriented recessed surface is positioned at a second level above the substrate, wherein the second level is greater than the first level.
    Type: Application
    Filed: July 26, 2019
    Publication date: November 21, 2019
    Inventors: Jiehui Shu, Chang Seo Park, Shimpei Yamaguchi, Tao Han, Yong Mo Yang, Jinping Liu, Hyuck Soo Yang
  • Ethylene/a-Olefin/Nonconjugated Polyene Interpolymer Compositions and Articles Prepared from the Same
    Publication number: 20190345318
    Abstract: A composition composed of at least a first ethylene/?-olefin/nonconjugated polyene interpolymer, which can be used to produce low compression set, foamed rubber materials, articles made from the composition, and methods of producing the composition and articles.
    Type: Application
    Filed: December 26, 2016
    Publication date: November 14, 2019
    Inventors: Colin LiPiShan, Juan C. Tuberquia, Teresita Kashyap, Isao Hattori, Tao Han, Cory M. Thomas West
  • Packet processing method, and device and system
    Patent number: 10476796
    Abstract: A packet processing method, and a device and a system includes receiving, by a provider edge (PE) device, a first virtual extensible local area network (VxLAN) encapsulated packet sent by a network virtualization edge (NVE) device, where the PE device and the NVE device are located in a same data center (DC), and the first VxLAN encapsulated packet includes a first VxLAN network identifier (VNI); parsing, by the PE device, the first VxLAN encapsulated packet to obtain the first VNI; obtaining, according to a correspondence between a VNI and a virtual routing and forwarding (VRF) table, a first VRF table that corresponds to the first VNI; searching, by the PE device, the first VRF table for a route according to a destination Internet Protocol (IP) address of the first VxLAN encapsulated packet; and forwarding the first VxLAN encapsulated packet.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: November 12, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yuan Gao, Tao Han, Weilian Jiang
  • A METHOD OF MANUFACTURING FINFET DEVICES USING NARROW AND WIDE GATE CUT OPENINGS IN CONJUCTION WITH A REPLACEMENT METAL GATE PROCESS
    Publication number: 20190341475
    Abstract: In conjunction with a replacement metal gate (RMG) process for forming a fin field effect transistor (FinFET), gate isolation methods and associated structures leverage the formation of distinct narrow and wide gate cut regions in a sacrificial gate. The formation of a narrow gate cut between closely-spaced fins can decrease the extent of etch damage to interlayer dielectric layers located adjacent to the narrow gate cut by delaying the deposition of such dielectric layers until after formation of the narrow gate cut opening. The methods and resulting structures also decrease the propensity for short circuits between later-formed, adjacent gates.
    Type: Application
    Filed: May 3, 2018
    Publication date: November 7, 2019
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Jiehui Shu, Laertis Economikos, Xusheng Wu, John Zhang, Haigou Huang, Hui Zhan, Tao Han, Haiting Wang, Jinping Liu, Hui Zang
  • SHOCK ABSORBING SCREW FOR CONNECTING HARD DISK TO HARD DISK FRAME
    Publication number: 20190333543
    Abstract: A shock absorbing screw includes a locking member, a friction member sleeved on the locking member, and a connecting frame sleeved on the friction member. The shock absorbing screw is connected to a hard disk by a connecting portion of the shock absorbing screw. An abutting portion of the shock absorbing screw is connected to the friction member. The connecting portion is passed through a second through hole defined in the friction member. A first end of the connecting frame includes a first clamping portion, a second end of the connecting frame includes a second clamping portion, and a second groove is defined between the first clamping portion and the second clamping portion. The shock absorbing screw is connected to a hard disk frame in the second groove. The friction member is connected to the connecting frame through a first through hole defined in the connecting frame.
    Type: Application
    Filed: October 31, 2018
    Publication date: October 31, 2019
    Inventors: XIAO-MING LIU, HE-TAO HAN, JUN-HUA TAN, ZHI-QIANG LI, YI-SHENG LIN
  • Methods of forming replacement gate structures on transistor devices
    Patent number: 10453936
    Abstract: One illustrative method disclosed herein includes, among other things, forming a sacrificial gate structure above a semiconductor substrate, the sacrificial gate structure comprising a sacrificial gate insulation layer and a sacrificial gate electrode material, performing a first gate-cut etching process to thereby form an opening in the sacrificial gate electrode material and forming an internal sidewall spacer in the opening. In this example, the method also includes, after forming the internal sidewall spacer, performing a second gate-cut etching process through the opening, the second gate-cut etching process being adapted to remove the sacrificial gate electrode material, performing an oxidizing anneal process and forming an insulating material in at least the opening.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: October 22, 2019
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Jiehui Shu, Chang Seo Park, Shimpei Yamaguchi, Tao Han, Yong Mo Yang, Jinping Liu, Hyuck Soo Yang
  • Multiple-layer spacers for field-effect transistors
    Patent number: 10431665
    Abstract: Structures for spacers in a device structure for a field-effect transistor and methods for forming spacers in a device structure for a field-effect transistor. A first spacer is located adjacent to a vertical sidewall of a gate electrode, a second spacer located between the first spacer and the vertical sidewall of the gate electrode, and a third spacer located between the second spacer and the vertical sidewall of the gate electrode. The first spacer has a higher dielectric constant than the second spacer. The first spacer has a higher dielectric constant than the third spacer. The third spacer has a lower dielectric constant than the second spacer.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: October 1, 2019
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Tao Han, Zhenyu Hu, Jinping Liu, Hsien-Ching Lo, Jianwei Peng
  • Compositions and methods of use of phorbol esters for the treatment of stroke
    Patent number: 10369222
    Abstract: Methods and compositions containing a phorbol ester or a derivative of a phorbol ester are provided for the treatment and prevention of stroke and the sequelae of stroke. Additional compositions and methods are provided which employ a phorbol ester or derivative compound in combination with at least one additional agent to yield more effective treatment tools to treat or prevent stroke and the long term effects of stroke in mammalian subjects.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: August 6, 2019
    Assignee: BIOSUCCESS BIOTECH CO., LTD.
    Inventors: Zheng Tao Han, Hung-Fong Chen
  • COMPOSITIONS AND METHODS OF USE OF PHORBOL ESTERS IN THE TREATMENT OF NEOPLASMS
    Publication number: 20190216763
    Abstract: Methods and compositions containing a phorbol ester or a derivative of a phorbol ester are provided for the treatment of chronic and acute conditions. Such conditions may be caused by disease, be symptoms, treatments, or sequelae of disease. The phorbol esters described are particularly useful in the treatment of neoplastic diseases and/or managing the side effects of chemotherapeutic and radiotherapeutic treatments of neoplastic diseases.
    Type: Application
    Filed: March 21, 2019
    Publication date: July 18, 2019
    Applicant: Biosuccess Biotech Co. Ltd.
    Inventors: Zheng Tao HAN, Hung-Fong Chen
  • Thermally conductive elastomeric composites
    Patent number: 10351749
    Abstract: A composition composed of a crosslinked interpolymer elastomer and thermally conductive filler dispersed within an elastomeric matrix, thermally conductive articles made from the composition, and methods of producing the composition and articles.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: July 16, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Yunfeng Yang, Hongyu Chen, Tao Han
  • Adhesive for Binding Polyolefin Membrane to Glass Fibers
    Publication number: 20190203084
    Abstract: A composition comprising, in weight percent (wt %) based on the weight of the composition: (A) greater than zero to 39 wt % of at least one of a polar olefin polymer and a styrenic block copolymer; (B) greater than zero to 20 wt % of an epoxy or amine-functionalized silane; (C) 60 to 99 wt % of an organic solvent for a mixture of (1) the polar olefin polymer and/or styrenic block copolymer, and (2) the epoxy or amine-functionalized silane; and (D) zero to 10 wt % of a polyisocyanate crosslinking agent.
    Type: Application
    Filed: August 23, 2016
    Publication date: July 4, 2019
    Inventors: Yongchun Chen, Hang Wu, Tao Han, Haiyang Yu
  • COMPOSITIONS AND METHODS OF USE OF PHORBOLESTERS
    Publication number: 20190183837
    Abstract: Methods and compositions containing a phorbol ester or a derivative of a phorbol ester are provided for the treatment of chronic and acute conditions. Such conditions may be caused by disease, be symptoms or sequelae of disease. Chronic and acute conditions may be due to viral infections such as HIV and AIDS, neoplastic diseases stroke, kidney disease, urinary incontinence, autoimmune disorders, Parkinson's disease, prostate hypertrophy, aging, or the treatment of such diseases. Additional compositions and methods are provided which employ a phorbol ester or derivative compound in combination with at least one additional agent to yield more effective treatment tools against acute and chronic conditions in mammalian subjects.
    Type: Application
    Filed: February 25, 2019
    Publication date: June 20, 2019
    Applicant: Biosuccess Biotech Co., Ltd.
    Inventors: Hung-Fong CHEN, Zheng Tao HAN
  • Radio over fiber antenna extender systems and methods for high speed trains
    Patent number: 10292058
    Abstract: Radio-over-fiber (ROF) antenna extender systems and methods are disclosed for high speed train communications which utilize cellular networks as backhauls to avoid the expensive capital expenditure involved in providing broadband Internet services in high speed trains. Employing ROF technology, on-roof antennas are deployed in strategic configurations to address the drawbacks of utilizing cellar networks as backhauls. The systems and methods provide broadband Internet service to a train and include a plurality of antennas mounted to an exterior of the train and operable to communicate with a cellular network, wireless access points mounted to the train, and a control system operably coupled to the plurality of antennas and to the wireless access points, wherein the control system is operable to receive and process data received from the plurality of antennas and the one wireless access points.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: May 14, 2019
    Assignee: New Jersey Institute of Technology
    Inventors: Nirwan Ansari, Tao Han
  • ETHYLENE/ALPHA-OLEFIN/DIENE INTERPOLYMERS COMPOSITIONS
    Publication number: 20190136030
    Abstract: The invention provides a composition comprising at least one oil, and a first composition comprising the following: A) a first composition A comprising an ethylene/?-olefin/non-conjugated diene interpolymer A, B) an ethylene/?-olefin/non-conjugated diene interpolymer B; and wherein the weight ratio of component A to component B is from 1/1 to 20/1; wherein the Mw of the ethylene/?-olefin/non-conjugated diene B is greater than the Mw of the first composition A; and wherein the composition has a Mooney Viscosity (ML1+4, 100 C) from 20 to 100.
    Type: Application
    Filed: May 30, 2017
    Publication date: May 9, 2019
    Inventors: Tao Han, Colin LiPiShan, Isao Hattori
  • ETHYLENE/ALPHA-OLEFIN/DIENE INTERPOLYMER
    Publication number: 20190136029
    Abstract: The invention provides a composition comprising a first composition, comprises a first ethylene/alpha-olefin/non-conjugated diene interpolymer, and wherein the first composition comprises the following properties: a) a molecular weight distribution MWD(conv)?3.50, and b) a [(Mz)/(tan delta (0.1 rad/sec, 190° C.))]?250,000 g/mole.
    Type: Application
    Filed: May 30, 2017
    Publication date: May 9, 2019
    Inventors: Tao Han, Colin LiPiShan, Timothy E. Clayfield