Abstract: An apparatus for heating a gas is described. The apparatus is a pre-heat ring and heater assembly positioned in a deposition chamber, such as an epitaxial deposition chamber. The pre-heat ring has a first portion configured to be heated using one or more heaters. The one or more heaters are disposed through a sidewall of the process volume beneath the pre-heat ring and are configured to heat the pre-heat ring so that gas flowed over the pre-heat ring is also heated before being flowed over a substrate. The one or more heaters may include two heaters disposed at distal ends of the first portion of the pre-heat ring. One or more temperature sensors are also configured to measure a temperature of the pre-heat ring.

Abstract: Embodiments described herein relate semiconductor manufacturing and processing. More particularly, a processing systems for auto correcting misalignments of substrates in process chambers is provided. The processing system includes a process chamber having a substrate support disposed within a chamber volume of the process chamber. The substrate support includes a pocket for receiving a substrate, and a plurality of flow conduits extending between a top surface of the pocket and a bottom surface of the substrate support. An imaging device is coupled to the process chamber and configured to monitor a position of a substrate when loaded in the pocket of the substrate support.

Abstract: An electronic device includes a first transistor, a second transistor, and a sensing circuit coupled to at least one of the first transistor and the second transistor. The sensing circuit includes a diode, a third transistor, and a fourth transistor. The diode has a first terminal. The third transistor has a first terminal and a second terminal. The first terminal of the third transistor is coupled to the first terminal of the diode. The fourth transistor has a first terminal coupled to the second terminal of the third transistor, and a second terminal coupled to a data driver.

Abstract: The present disclosure relates to flow guides, process kits, and related methods for processing chambers to facilitate deposition process adjustability. In one implementation, a process kit for disposition in a processing chamber applicable for use in semiconductor manufacturing includes a plate having a first face and a second face opposing the first face. The process kit includes a liner. The liner includes an annular section, and one or more ledges extending inwardly relative to the annular section. The one or more ledges are configured to support one or more outer regions of the second face of the plate. The liner includes one or more inlet openings extending to an inner surface of the annular section on a first side of the liner, and one or more outlet openings extending to the inner surface of the annular section on a second side of the liner.

Abstract: The present disclosure generally relates to process chambers for semiconductor processing. In one embodiment, a growth monitor for substrate processing is provided. The growth monitor includes a sensor holder and a crystal disposed in the sensor holder having a front side and a back side. An opening is formed in the sensor holder exposing a front side of the crystal. A gas inlet is disposed through the sensor holder to a plenum formed by the back side of the crystal and the sensor holder. A gas outlet is fluidly coupled to the plenum.

Abstract: The present disclosure relates to flow guides, process kits, and related methods for processing chambers to facilitate deposition process adjustability. In one implementation, a flow guide applicable for use in semiconductor manufacturing, includes a plate having a first face and a second face opposing the first face. The flow guide includes a first fin set extending from the second face, and a second fin set extending from the second face. The second fin set is spaced from the first fin set to define a flow path between the first fin set and the second fin set. The flow path has a serpentine pattern between the first fin set and the second fin set.

Abstract: The present disclosure relates to flow guides, process kits, and related methods for processing chambers to facilitate deposition process adjustability. In one implementation, a flow guide includes a middle plate having a first side and a second side opposing the first side along a first direction. The first side and the second side are arcuate. The flow guide includes a first flange extending outwardly relative to a third side of the middle plate and outwardly relative to an outer face of the middle plate, and a second flange extending outwardly relative to a fourth side of the middle plate and outwardly relative to the outer face of the middle plate. The fourth side opposes the third side along a second direction that intersects the first direction. The flow guide includes a rectangular flow opening defined between the first flange and the second flange.

Abstract: A method and apparatus for determining a growth rate on a semiconductor substrate is described herein. The apparatus is an optical sensor, such as an optical growth rate sensor. The optical sensor is positioned in an exhaust of a deposition chamber. The optical sensor is self-heated using one or more internal heating elements, such as a resistive heating element. The internal heating elements are configured to heat a sensor coupon. A film is formed on the sensor coupon by exhaust gases flowed through the exhaust and is correlated to film growth on a substrate within a process volume of the deposition chamber.

Abstract: Compounds, compositions and methods are provided for modulating the activity of EP2 and EP4 receptors, and for the treatment, prevention and amelioration of one or more symptoms of diseases or disorders related to the activity of EP2 and EP4 receptors. In certain embodiments, the compounds are antagonists of both the EP2 and EP4 receptors.

Abstract: A sensing device, including a plurality of sensing pixels arranged in Y rows and M columns, a plurality of readout lines coupled to the sensing pixels, and a plurality of control lines each coupled to a sensing pixel subset, is provided. The Y times N sensing pixels within the sensing pixel subset are arranged in adjacent N columns, where Y, M and N are integers and N is smaller than M. Each of the control lines is configured to control one row of the sensing pixel subset to output signals through corresponding readout lines.

Abstract: An electronic device includes a first transistor, a second transistor, and a sensing circuit coupled to at least one of the first transistor and the second transistor. The sensing circuit includes a diode, a third transistor, and a fourth transistor. The diode has a first terminal. The third transistor has a first terminal and a second terminal. The first terminal of the third transistor is coupled to the first terminal of the diode. The fourth transistor has a first terminal coupled to the second terminal of the third transistor, and a second terminal coupled to a data driver.

Abstract: A method and apparatus for calibrating a temperature within a processing chamber are described. The method includes determining an etch rate of a layer within the processing chamber. The processing chamber is a deposition chamber configured for use during semiconductor manufacturing. The etch rate is utilized to determine a temperature within the processing chamber. The temperature within the processing chamber is then subsequently compared to a calibrated temperature to determine a temperature offset. The etch rate is determined using any one of a pyrometer, a reflectometer, a camera, or a mass sensor.

Abstract: Provided herein are compounds, compositions and methods useful for inhibiting lactate dehydrogenase (LDH) activity and for the treatment, prevention and amelioration of one or more symptoms of diseases or disorders related to LDH activity, or the accumulation of oxalate, including hyperoxaluria.

Abstract: The present disclosure generally relates to process chambers for semiconductor processing. In one embodiment, a growth monitor for substrate processing is provided. The growth monitor includes a sensor holder and a crystal disposed in the sensor holder having a front side and a back side. An opening is formed in the sensor holder exposing a front side of the crystal. A gas inlet is disposed through the sensor holder to a plenum formed by the back side of the crystal and the sensor holder. A gas outlet is fluidly coupled to the plenum.

Abstract: An electronic device includes a reset circuit and a first image sensing circuit. The reset circuit is used to receive a reset signal and includes a plurality of transistors. The first image sensing circuit is coupled to the reset circuit and includes a photodiode, a first transistor and a second transistor. The photodiode has a first terminal. The first transistor has a first terminal coupled to the first terminal of the photodiode, and a second terminal. The second transistor has a first terminal coupled to the second terminal of the first transistor, and a second terminal configured to receive a row selection signal.

Abstract: A heater device with a memory unit includes a first transistor, a second transistor, a memory unit and a heater. The first terminal of the second transistor and the first terminal of the first transistor are electrically connected to each other. The memory unit is electrically connected to the second terminal of the first transistor. The heater is electrically connected to the second terminal of the second transistor.

Abstract: Compounds, compositions and methods are provided for modulating the activity of EP2 and EP4 receptors, and for the treatment, prevention and amelioration of one or more symptoms of diseases or disorders related to the activity of EP2 and EP4 receptors. In certain embodiments, the compounds are antagonists of both the EP2 and EP4 receptors.

Abstract: Examples of computing devices and methods for changing firmware settings of a computing device are described herein. In an example, a request for change in a firmware setting is received. In response to the request, the firmware setting is changed in real-time.

Abstract: A computing device may include a display, an audio output device, a sensor to detect the position of the display relative to the audio output device, and a processor to receive the detected position of the display and adjust audio output from the audio output device based on the detected position of the display.

Abstract: Embodiments disclosed herein generally relate to in situ monitoring of film growth in processing chambers. In some examples, a sensor assembly for a processing chamber includes a sensor tube including silicon carbide and having an optical path therein and a sensor window including crystalline silicon carbide and having a proximal side coupled to a distal end of the sensor tube. The sensor window covers the optical path, and a distal side of the sensor window facing away from the proximal side is perpendicular to a center axis of the optical path.