Abstract: In an example, a movable lock may include a lock bar and a pivot disposed at a first end of the lock bar. The movable lock may also include a card retainer disposed on the lock bar at a second end of the lock bar, opposite the first end. The card retainer may include a card notch sized to receive an edge of a system card.

Abstract: A lighting device capable of generating warm or neutral white light using blue light-emitting diodes (“LEDs”), red LEDs, and/or luminescent material that responds to blue LED emission is disclosed. The lighting device includes multiple first solid-state light-emitting structures (“SLSs”), second SLSs, and balancing resistor element. The first SLS such as a string of blue LED dies connected in series is able to convert electrical energy to blue optical light, which is partially turned into longer wavelength emission by the luminescent material. The second SLS such as a red LED die is configured to convert electrical energy to red optical light, wherein the second SLSs are connected in series. While the first SLSs and second SLSs are coupled in parallel, the balancing resistor element provides load balance for current redistribution between the first and second SLSs in response to fluctuation of operating temperature.

Abstract: Various embodiments are provided for automatically generating a container image by a processor. Service runtime information associated with an operating system (OS) may be detect and collected. The collected service runtime information may be validated. A container having the collected service runtime information may be created. A container image may be generated according to the container. The container image may be updated upon detecting a change to the service runtime information.

Abstract: A lighting device capable of generating warm or neutral white light using blue light-emitting diodes (“LEDs”), red LEDs, and/or luminescent material that responds to blue LED emission is disclosed. The lighting device includes multiple first solid-state light-emitting structures (“SLSs”), second SLSs, and balancing resistor element. The first SLS such as a string of blue LED dies connected in series is able to convert electrical energy to blue optical light, which is partially turned into longer wavelength emission by the luminescent material. The second SLS such as a red LED die is configured to convert electrical energy to red optical light, wherein the second SLSs are connected in series. While the first SLSs and second SLSs are coupled in parallel, the balancing resistor element provides load balance for current redistribution between the first and second SLSs in response to fluctuation of operating temperature.

Abstract: Various embodiments are provided for automatically generating a container image by a processor. Service runtime information associated with an operating system (OS) may be detect and collected. The collected service runtime information may be validated. A container having the collected service runtime information may be created. A container image may be generated according to the container. The container image may be updated upon detecting a change to the service runtime information.

Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

Abstract: LED lamps or bulbs are disclosed that comprise a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink. The phosphor carrier can have a three-dimensional shape and comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light passes through the phosphor carrier. The phosphor carrier converts at least some of the LED light, with some embodiments emitting a white light combination of LED and phosphor light. The phosphors in the phosphor carriers can operate at a lower temperature to have greater phosphor conversion efficiency and reduced heat related damage. The lamps or bulbs can also comprise a diffuser over the phosphor carrier to distribute light and conceal the phosphor carrier.

Abstract: Aspects of the present invention include a method, which includes updating, by a processor, one or more distributed memory datasets having data stored therein in response to a write data operation, the one or more distributed data memory datasets being located in a database. The method further includes splitting, by the processor, any one of the one or more distributed memory datasets into two distributed memory datasets when a size of the any one of the one or more distributed memory datasets exceeds a threshold value. The method further includes moving, by the processor, the stored data in any one of the one or more distributed memory datasets to regions within the database upon an occurrence of one or more conditions with respect to the one or more distributed memory datasets. Other aspects of the present invention include a system and a computer program product.

Abstract: Devices and methods including an LED and reflective die attach material are described herein. The devices can include a reflective substrate (e.g., a substrate that includes a silver layer) to which one or more LED die are attached using the die attach material. The die attach material extends beyond the periphery of the LED die to cover an area of the substrate surface.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Abstract: A lighting device capable of generating warm or neutral white light using blue light-emitting diodes (“LEDs”), red LEDs, and/or luminescent material that responds to blue LED emission is disclosed. The lighting device includes multiple first solid-state light-emitting structures (“SLSs”), second SLSs, and balancing resistor element. The first SLS such as a string of blue LED dies connected in series is able to convert electrical energy to blue optical light, which is partially turned into longer wavelength emission by the luminescent material. The second SLS such as a red LED die is configured to convert electrical energy to red optical light, wherein the second SLSs are connected in series. While the first SLSs and second SLSs are coupled in parallel, the balancing resistor element provides load balance for current redistribution between the first and second SLSs in response to fluctuation of operating temperature.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Abstract: An example disclosed herein is a non-volatile storage medium including instructions relating to control of power that, when executed by a processor, cause the processor to monitor a supply of power to a regulator, decouple supply of power to the regulator when the monitored supply of power is below a predetermined level, couple a power pack to the regulator to supply power to the regulator when the monitored supply of power is below the predetermined level, and generate an Advanced Configuration and Power Interface (ACPI) G1 Sleeping state signal when the monitored supply of power is below the predetermined level.

Abstract: Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional (e.g. Lambertian) pattern of the LEDs to a more omni-directional pattern.

Abstract: A packaged UV-LED device comprises a die carrier member having a cup-shaped recess, a fused silica lens member that is anodic bonded to the die carrier member, and a UV-LED die that is flip-chip mounted within a sealed cavity formed by the carrier member and the lens member. The carrier member involves a unitary cup member fashioned in an economical way from monocrystalline silicon wafer material. A dielectric/aluminum reflector that is effective for UV radiation and that does not degrade and overheat is disposed on the sidewalls of the recess. The lens member is anodic bonded to a silicon surface of the rim of this unitary cup member at a time when the UV-LED die is disposed in the recess. The anodic bonding is done in such way that the die is not damaged and such that the entire packaged UV-LED device includes no UV-degradable adhesive.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: A switched capacitor converter and a method for configuring the switched capacitor converter are disclosed. The switched capacitor converter includes a capacitance resource with a cathode and an anode and a switching matrix with a first terminal, a second terminal, a third terminal, and at least one switch configured to switch among two or more connections selected from the group consisting of a connection of the first terminal to the anode and the second terminal to the cathode and a connection of the second terminal to the anode and the third terminal to the cathode.

Abstract: An LED assembly includes two strings of surface mounted LED devices mounted to a central ceramic plug portion of a PCB substrate. One string has a CCT of 4000 degrees Kelvin. The other has a CCT of 1800 degrees Kelvin. For each LED device in one string there is a corresponding LED device in the other string. The LED devices of each pair are closely spaced with 0.2-0.6 mm between them. A Highly Reflective (HR) layer is disposed on the substrate between the LED devices. The HR layer has a thickness in a range of from 20 to 50 percent H, where H is the height of an LED die. A transparent silicone layer covers the LED devices. A resistor of a warm-dimming circuit is mounted over the ceramic portion of the substrate whereas an integrated circuit portion of the circuit is mounted over the PCB portion of the substrate.

Abstract: A device and method for hybrid feedback control of a switch-capacitor multi-unit voltage regulator are presented. A multi-unit switched-capacitor (SC) core includes a plurality of SC converter units, each unit with a capacitor and a plurality of switches controllable by a plurality of switching signals. Power switch drivers provide a switching signal to each SC converter unit. A secondary proactive loop circuit includes a feedback control circuit configured to control one or more of the plurality of switches. A comparator is configured to compare the regulator output voltage with a reference voltage and provide a comparator trigger signal. Ripple reduction logic is configured to receive the comparator trigger signal and provide an SC unit allocation signal. A multiplexer is configured to receive a first clock signal, a second clock signal, and the SC unit allocation signal and provide a signal to the power switch drivers.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.