Abstract: A pet water bottle includes a shell, a triggering member, a transmission member and a first sealing member. A cavity for water storage is formed inside the shell, a first recessed region is formed on an outer surface of the shell, and a first through hole communicating with the cavity is arranged on an inner wall of the first recessed region; the first sealing member is arranged in the cavity, at least part of the transmission member is fixed inside the cavity, and the first sealing member is fixed onto the transmission member; the first through hole is in contact with and fully covered by the first sealing member; at least part of the triggering member is fixed outside the shell, and the triggering member and the transmission member are spaced apart from each other; the triggering member is capable of moving in a direction close to the transmission member.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Abstract: Methods and apparatus are provided for LED packages with surface textures. In one novel aspect, microstructures are formed on surfaces of the LED package such that light extract efficiency is improved. In one embodiment, the LED package has a silicone-encapsulating layer scattered with phosphors. In another embodiment, the LED package has a leadframe substrate. The microstructure can be micro lens, micro dents, micro pillars, micro cones, or other shapes. The microstructures can be periodically arranged or randomly arranged. In one novel aspect, the compression molding process is used to form rough surfaces. The molding block or the release film is modified with microstructures. In another novel aspect, sandblasting process is used. In one embodiment, microstructures are formed on sidewalls using the sandblasting process. The hardness, the angle, and/or the size of the blasting media are selected to improve the efficiency of the LED package.

Abstract: A detection device includes: a body; a first set of at least three contact areas on the body to contact a corresponding set of at least three contact areas of a central processing unit (CPU) cover; and a second set of at least three contact areas on the body to contact a set of at least three contact areas on heatsink componentry. An incorrect assembly position of a heatsink is indicated when one or more points of contact with the heatsink componentry and the CPU cover is incorrect.

Abstract: Systems and methods for unifying business records data from different database sources into a common format in the same repository are disclosed. In one embodiment, a process includes receiving, by an integration platform system, a first set of business records data from a customer records system, where the business records data includes records in a first format, identifying a first transformation rule corresponding to the first format using the integration platform system, where the first transformation rule includes information for converting data from the first format to a unified format, converting each record in the first set of business records from the first format to the unified format by the integration platform system using the first transformation rule, and storing the first set of converted records in the unified format in a business records database.

Abstract: In an example, a movable lock may include a lock bar and a pivot disposed at a first end of the lock bar. The movable lock may also include a card retainer disposed on the lock bar at a second end of the lock bar, opposite the first end. The card retainer may include a card notch sized to receive an edge of a system card.

Abstract: A lighting device capable of generating warm or neutral white light using blue light-emitting diodes (“LEDs”), red LEDs, and/or luminescent material that responds to blue LED emission is disclosed. The lighting device includes multiple first solid-state light-emitting structures (“SLSs”), second SLSs, and balancing resistor element. The first SLS such as a string of blue LED dies connected in series is able to convert electrical energy to blue optical light, which is partially turned into longer wavelength emission by the luminescent material. The second SLS such as a red LED die is configured to convert electrical energy to red optical light, wherein the second SLSs are connected in series. While the first SLSs and second SLSs are coupled in parallel, the balancing resistor element provides load balance for current redistribution between the first and second SLSs in response to fluctuation of operating temperature.

Abstract: Various embodiments are provided for automatically generating a container image by a processor. Service runtime information associated with an operating system (OS) may be detect and collected. The collected service runtime information may be validated. A container having the collected service runtime information may be created. A container image may be generated according to the container. The container image may be updated upon detecting a change to the service runtime information.

Abstract: A lighting device capable of generating warm or neutral white light using blue light-emitting diodes (“LEDs”), red LEDs, and/or luminescent material that responds to blue LED emission is disclosed. The lighting device includes multiple first solid-state light-emitting structures (“SLSs”), second SLSs, and balancing resistor element. The first SLS such as a string of blue LED dies connected in series is able to convert electrical energy to blue optical light, which is partially turned into longer wavelength emission by the luminescent material. The second SLS such as a red LED die is configured to convert electrical energy to red optical light, wherein the second SLSs are connected in series. While the first SLSs and second SLSs are coupled in parallel, the balancing resistor element provides load balance for current redistribution between the first and second SLSs in response to fluctuation of operating temperature.

Abstract: Various embodiments are provided for automatically generating a container image by a processor. Service runtime information associated with an operating system (OS) may be detect and collected. The collected service runtime information may be validated. A container having the collected service runtime information may be created. A container image may be generated according to the container. The container image may be updated upon detecting a change to the service runtime information.

Abstract: A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

Abstract: LED lamps or bulbs are disclosed that comprise a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink. The phosphor carrier can have a three-dimensional shape and comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light passes through the phosphor carrier. The phosphor carrier converts at least some of the LED light, with some embodiments emitting a white light combination of LED and phosphor light. The phosphors in the phosphor carriers can operate at a lower temperature to have greater phosphor conversion efficiency and reduced heat related damage. The lamps or bulbs can also comprise a diffuser over the phosphor carrier to distribute light and conceal the phosphor carrier.

Abstract: Aspects of the present invention include a method, which includes updating, by a processor, one or more distributed memory datasets having data stored therein in response to a write data operation, the one or more distributed data memory datasets being located in a database. The method further includes splitting, by the processor, any one of the one or more distributed memory datasets into two distributed memory datasets when a size of the any one of the one or more distributed memory datasets exceeds a threshold value. The method further includes moving, by the processor, the stored data in any one of the one or more distributed memory datasets to regions within the database upon an occurrence of one or more conditions with respect to the one or more distributed memory datasets. Other aspects of the present invention include a system and a computer program product.

Abstract: Devices and methods including an LED and reflective die attach material are described herein. The devices can include a reflective substrate (e.g., a substrate that includes a silver layer) to which one or more LED die are attached using the die attach material. The die attach material extends beyond the periphery of the LED die to cover an area of the substrate surface.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Abstract: A lighting device capable of generating warm or neutral white light using blue light-emitting diodes (“LEDs”), red LEDs, and/or luminescent material that responds to blue LED emission is disclosed. The lighting device includes multiple first solid-state light-emitting structures (“SLSs”), second SLSs, and balancing resistor element. The first SLS such as a string of blue LED dies connected in series is able to convert electrical energy to blue optical light, which is partially turned into longer wavelength emission by the luminescent material. The second SLS such as a red LED die is configured to convert electrical energy to red optical light, wherein the second SLSs are connected in series. While the first SLSs and second SLSs are coupled in parallel, the balancing resistor element provides load balance for current redistribution between the first and second SLSs in response to fluctuation of operating temperature.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Abstract: An example disclosed herein is a non-volatile storage medium including instructions relating to control of power that, when executed by a processor, cause the processor to monitor a supply of power to a regulator, decouple supply of power to the regulator when the monitored supply of power is below a predetermined level, couple a power pack to the regulator to supply power to the regulator when the monitored supply of power is below the predetermined level, and generate an Advanced Configuration and Power Interface (ACPI) G1 Sleeping state signal when the monitored supply of power is below the predetermined level.

Abstract: Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional (e.g. Lambertian) pattern of the LEDs to a more omni-directional pattern.

Abstract: A packaged UV-LED device comprises a die carrier member having a cup-shaped recess, a fused silica lens member that is anodic bonded to the die carrier member, and a UV-LED die that is flip-chip mounted within a sealed cavity formed by the carrier member and the lens member. The carrier member involves a unitary cup member fashioned in an economical way from monocrystalline silicon wafer material. A dielectric/aluminum reflector that is effective for UV radiation and that does not degrade and overheat is disposed on the sidewalls of the recess. The lens member is anodic bonded to a silicon surface of the rim of this unitary cup member at a time when the UV-LED die is disposed in the recess. The anodic bonding is done in such way that the die is not damaged and such that the entire packaged UV-LED device includes no UV-degradable adhesive.