Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: A switched capacitor converter and a method for configuring the switched capacitor converter are disclosed. The switched capacitor converter includes a capacitance resource with a cathode and an anode and a switching matrix with a first terminal, a second terminal, a third terminal, and at least one switch configured to switch among two or more connections selected from the group consisting of a connection of the first terminal to the anode and the second terminal to the cathode and a connection of the second terminal to the anode and the third terminal to the cathode.

Abstract: An LED assembly includes two strings of surface mounted LED devices mounted to a central ceramic plug portion of a PCB substrate. One string has a CCT of 4000 degrees Kelvin. The other has a CCT of 1800 degrees Kelvin. For each LED device in one string there is a corresponding LED device in the other string. The LED devices of each pair are closely spaced with 0.2-0.6 mm between them. A Highly Reflective (HR) layer is disposed on the substrate between the LED devices. The HR layer has a thickness in a range of from 20 to 50 percent H, where H is the height of an LED die. A transparent silicone layer covers the LED devices. A resistor of a warm-dimming circuit is mounted over the ceramic portion of the substrate whereas an integrated circuit portion of the circuit is mounted over the PCB portion of the substrate.

Abstract: A device and method for hybrid feedback control of a switch-capacitor multi-unit voltage regulator are presented. A multi-unit switched-capacitor (SC) core includes a plurality of SC converter units, each unit with a capacitor and a plurality of switches controllable by a plurality of switching signals. Power switch drivers provide a switching signal to each SC converter unit. A secondary proactive loop circuit includes a feedback control circuit configured to control one or more of the plurality of switches. A comparator is configured to compare the regulator output voltage with a reference voltage and provide a comparator trigger signal. Ripple reduction logic is configured to receive the comparator trigger signal and provide an SC unit allocation signal. A multiplexer is configured to receive a first clock signal, a second clock signal, and the SC unit allocation signal and provide a signal to the power switch drivers.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Abstract: A packaged UV-LED device comprises a die carrier member having a cup-shaped recess, a fused silica lens member that is anodic bonded to the die carrier member, and a UV-LED die that is flip-chip mounted within a sealed cavity formed by the carrier member and the lens member. The carrier member involves a unitary cup member fashioned in an economical way from monocrystalline silicon wafer material. A dielectric/aluminum reflector that is effective for UV radiation and that does not degrade and overheat is disposed on the sidewalls of the recess. The lens member is anodic bonded to a silicon surface of the rim of this unitary cup member at a time when the UV-LED die is disposed in the recess. The anodic bonding is done in such way that the die is not damaged and such that the entire packaged UV-LED device includes no UV-degradable adhesive.

Abstract: An example printed circuit board assembly (PCBA) includes a controller and a plurality of conductive contacts. The conductive contacts are coupled to the controller. The controller is to determine a type of chassis to which the PCBA is mounted.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: Aspects of the present invention include a method, which includes updating, by a processor, one or more distributed memory datasets having data stored therein in response to a write data operation, the one or more distributed data memory datasets being located in a database. The method further includes splitting, by the processor, any one of the one or more distributed memory datasets into two distributed memory datasets when a size of the any one of the one or more distributed memory datasets exceeds a threshold value. The method further includes moving, by the processor, the stored data in any one of the one or more distributed memory datasets to regions within the database upon an occurrence of one or more conditions with respect to the one or more distributed memory datasets. Other aspects of the present invention include a system and a computer program product.

Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: An example printed circuit board assembly (PCBA) includes a controller and a plurality of conductive contacts. The conductive contacts are coupled to the controller. The controller is to determine a type of chassis to which the PCBA is mounted.

Abstract: Methods and apparatus are provided to improve long-term reliability of LED packages using reflective opaque die attach (DA) material. In one novel aspect, a protected area surrounding edges of the LED is determined. The DA is applied to the determined protected area by a dispense process, a stamping process, or a screen printing process, such that the effect of temperature degradation is reduced. A heat distribution model is used to determine the protected area, which is between edges of the LED and a predefined isothermal line where the temperature is 1/e that of the temperature at edges of the LED. In another embodiment, the protected area is further based on a spreading ratio of the substrate size to the LED size. In another novel aspect, with multiple LEDs in the LED package, the spreading ratio is further based on pitch distances to the immediate adjacent LEDs and the substrate boundary.

Abstract: An LED assembly includes two strings of surface mounted LED devices mounted to a central ceramic plug portion of a PCB substrate. One string has a CCT of 4000 degrees Kelvin. The other has a CCT of 1800 degrees Kelvin. For each LED device in one string there is a corresponding LED device in the other string. The LED devices of each pair are closely spaced with 0.2-0.6 mm between them. A Highly Reflective (HR) layer is disposed on the substrate between the LED devices. The HR layer has a thickness in a range of from 20 to 50 percent H, where H is the height of an LED die. A transparent silicone layer covers the LED devices. A resistor of a warm-dimming circuit is mounted over the ceramic portion of the substrate whereas an integrated circuit portion of the circuit is mounted over the PCB portion of the substrate.

Abstract: A switched capacitor converter and a method for configuring the switched capacitor converter are disclosed. The switched capacitor converter includes a capacitance resource with a cathode and an anode and a switching matrix with a first terminal, a second terminal, a third terminal, and at least one switch configured to switch among two or more connections selected from the group consisting of a connection of the first terminal to the anode and the second terminal to the cathode and a connection of the second terminal to the anode and the third terminal to the cathode.

Abstract: A lighting device comprising a solid-state light source, and a diffuser configured for color mixing of the light from the solid-state light source and spatially separated therefrom, the diffuser comprising at least one phosphor material. Methods of fabricating a lighting device having a reduced total amount of phosphor comprising combining an amount of phosphor with a diffuser structure.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract: A device and method for hybrid feedback control of a switch-capacitor multi-unit voltage regulator are presented. A multi-unit switched-capacitor (SC) core includes a plurality of SC converter units, each unit with a capacitor and a plurality of switches controllable by a plurality of switching signals. Power switch drivers provide a switching signal to each SC converter unit. A secondary proactive loop circuit includes a feedback control circuit configured to control one or more of the plurality of switches. A comparator is configured to compare the regulator output voltage with a reference voltage and provide a comparator trigger signal. Ripple reduction logic is configured to receive the comparator trigger signal and provide an SC unit allocation signal. A multiplexer is configured to receive a first clock signal, a second clock signal, and the SC unit allocation signal and provide a signal to the power switch drivers.

Abstract: A light-emitting diode (LED) assembly includes an aluminum substrate, a silver layer, a distributed Bragg reflector (DBR) and an LED device. The aluminum substrate has a top surface whose length and width are each more than once centimeter. The silver layer is disposed over the entire top surface of the aluminum substrate. The DBR is disposed over the entire upper surface of the silver layer. The DBR includes an upper reflector layer and a lower reflector layer. The lower reflector layer contacts the upper surface of the silver layer. The Led device is attached to the upper reflector layer of the DBR, but the LED device is not disposed over the entire upper reflector layer. In one embodiment, the silver layer is deposited on the substrate using physical vapor deposition. In another embodiment, multiple pairs of lower reflector and higher reflector layers are included.

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.