Abstract: A display panel, a method for manufacturing the same and a display device are provided. The display panel includes: a substrate; a plurality of display devices on a side of the substrate; and a plurality of thin film package layers on a side of the display devices distal to the substrate and cover the plurality of display devices. Orthographic projections of the plurality of thin film package layers on the substrate are discontinuous. At least one of the plurality of thin film package layers covers at least one of the plurality of display devices.

Abstract: The present disclosure relates to a soft magnetic composite with a two-dimensional magnetic moment and a high working frequency band, and a preparation method therefor. According to an embodiment, the soft magnetic composite with a two-dimensional magnetic moment may comprise: an insulating matrix; and two-dimensional magnetic moment micropowder dispersed in the insulating matrix, wherein inside the two-dimensional magnetic moment micropowder, a magnetic moment is distributed in a specific two-dimensional plane.

Abstract: A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.

Abstract: A power module is disclosed. The power module includes a carrier board, two switches, at least one metal block, a clamping component and a metal conductive component. The carrier board includes an upper surface and a lower surface. The two switches are disposed on the upper surface and connected in series to form a bridge arm electrically connected between a positive terminal and a negative terminal. The metal block is electrically connected to the two switches. The clamping component is disposed on the upper surface and electrically connected in parallel with the bridge arm through the carrier board. The metal conductive component is connected from a common node of the two switches to an output terminal. The metal conductive component is located at a side of the two switches facing away from the upper surface.

Abstract: A method for data communication includes determining that a downlink receiver is not receiving downlink data from a movable object based on a state of the downlink receiver, generating first synchronization information in response to determining that the downlink receiver is not receiving the downlink data from the movable object, transmitting uplink data to the movable object, and generating second synchronization information in response to completion of uplink data transmission. The first synchronization information is provided to the downlink receiver to prevent operation of the downlink receiver, and the second synchronization information is provided to the downlink receiver to allow operation of the downlink receiver.

Abstract: A notebook computer includes a display screen, a base, a rotating shaft coupling the display screen and the base, and a rotating shaft support disposed at an inside of a housing of the display screen and coupled to the rotating shaft in an assembly manner. The notebook computer further includes a drive circuit board disposed inside the housing of the display screen. The rotating shaft support includes a first rotating shaft support and a second rotating shaft support. A projection of the drive circuit board and a projection of the first rotating shaft support do not overlap on a place on which the display screen is located, and the projection of the drive circuit board and a projection of the second rotating shaft support at least partially overlap on the plane on which the display screen is located.

Abstract: A thin film transistor (TFT) substrate optimized for protection against the build up of static electricity defines a display area and a non-display area surrounding the display area. The TFT substrate includes a substrate and an electrostatic protection structure on the substrate and in the non-display area. The electrostatic protection structure includes a transparent conductive layer and a discharge metal layer on the transparent conductive layer. The discharge metal layer partially overlaps with the transparent conductive layer. The discharge metal layer is in direct contact with the transparent conductive layer. The transparent conductive layer has a width that is greater than a width of the discharge metal layer.

Abstract: The light-emitting device includes: a base substrate; a light-emitting unit, disposed on the base substrate; and a thin film packaging structure disposed on a side, distal from the base substrate, of the light-emitting unit, wherein the thin film packaging structure includes a target packaging film layer of at least one packaging film layer is provided with a first packaging portion and a second packaging portion which are arranged in the same layer and are in contact with each other, an orthographic projection of the first packaging portion on the base substrate at least partially overlaps an orthographic projection of the light-emitting unit on the base substrate, an orthographic projection of the second packaging portion on the base substrate at least partially overlaps the orthographic projection of the light-emitting unit, and a refractive index of the first packaging portion is less than a refractive index of the second packaging portion.

Abstract: A flexible display panel includes a flexible substrate with a display region and an electrode bonding region. The flexible substrate includes a display surface and a non-display surface opposite to the display surface. Wherein the flexible substrate at a position corresponding to the electrode bonding region is bent along a direction from the display surface to the non-display surface.

Abstract: The present application discloses a method of fabricating a display substrate. The method includes forming a mother substrate on a support substrate; cutting the mother substrate to separate a portion of the mother substrate from a remainder of the mother substrate, thereby forming a base substrate; and subsequent to cutting the mother substrate, forming an encapsulating layer on the base substrate for encapsulating the display substrate.

Abstract: A method for generating training models includes generating a preliminary training model based on a group of first images, the first images including different types of objects; processing a group of second images with the preliminary model to generate a probability array for each of the second images, the probability array indicating likelihoods that an object is a particular type of object; generating correlations between the different types of objects based on the probability arrays; generating a plurality of object groups based on the correlations, where each object group includes a plurality of different types of objects that have a relatively low correlation with the other types of objects in the same object group; and for each object group, generating a final training model based on a group of third images, the third images each including an object having an object type corresponding to one of the object types.

Abstract: An organic light-emitting diode array substrate and manufacturing method thereof, and display apparatus are provided. The organic light-emitting diode array substrate includes: a base substrate; a first metal layer disposed on the base substrate; a first insulating layer disposed on a side of the first metal layer far away from the base substrate; a second metal layer disposed on a side of the first insulating layer far away from the base substrate; the first metal layer includes a first power line, and the second metal layer includes a second power line; the second power line is connected in parallel with the first power line through a first via hole which penetrates the first insulating layer.

Abstract: A connector is provided. The connector includes a shell assembly, a circuit board, a terminal, and an insulated block. The terminal includes a contact piece and a connecting piece including a connecting portion and a connecting pin, and an angle is between the connecting portion and the connecting pin. The insulated block is disposed on one side of the shell assembly, and the connecting pin passes through the insulated block to be connected to the circuit board. The connecting portion and a bending portion of the connecting piece are both embedded in the insulated block. The periphery of the contact piece is devoid of material receiving areas. The contact area of the contact piece has a pleasing appearance. Moreover, as the bending portion is completely embedded in the insulated block, insufficient molding and burr phenomenon during molding can be avoided.

Abstract: The present invention relates to a battery electrode. The battery electrode comprises a plurality of carbon nanotubes and a plurality of transition metal oxide nanoparticles. The plurality of transition metal oxide nanoparticles are chemically bonded to the plurality of carbon nanotubes through carbon-oxygen-metal (C—O-M) linkages, wherein the metal being a transition metal element. The present invention also relates a method for making the battery electrode and a hybrid energy storage device using the battery electrode.

Abstract: A hole plug includes a cap and a securing frame. The securing frame extends from the cap. The securing frame includes first and second support legs, first and second connectors, and a lock body. The first connector is engaged with the first support leg. The second connector is engaged with the second support leg. The lock body is engaged with the first and second connectors.

Abstract: A device for detecting the flatness of a sheet material includes a conveyor, a gantry, a beam, an industrial camera unit, a speed measurement unit, a vibration measurement unit, a multi-line laser, a cable carrier, an industrial controller, and a control cabinet. The conveyor is disposed beneath the gantry and includes a plurality of pinch roll assemblies for feeding a sheet material. The beam is disposed on the gantry and includes a first side and a second side. The industrial camera unit is disposed on the first side of the beam and includes at least two industrial cameras. The speed measurement unit is disposed between the at least two industrial cameras. The vibration measurement unit is disposed on the second side of the beam and includes at least two distance measurement devices. The multi-line laser is disposed between the at least two distance measurement devices.

Abstract: Provided in embodiments of the present invention are a body mold, a magnetic resonance imaging system, and a main magnetic field evaluation method and a gradient field evaluation method therefor. The body mold comprises a plurality of substrates, wherein the plurality of substrates are sequentially arranged to form a multi-layer structure in a three-dimensional space. Each substrate is provided with a plurality of first accommodation bodies for accommodating first resonant volumes and a plurality of second accommodation bodies for accommodating second resonant volumes. The plurality of first accommodation bodies and the plurality of second accommodation bodies are arranged at intervals. The first resonant volumes and the second resonant volumes have different longitudinal relaxation times T1.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first and a second semiconductor structures. The first semiconductor structure includes a first interconnect layer including first interconnects. The first semiconductor structure further includes a first bonding layer including first bonding contacts. Each first interconnect is in contact with a respective first bonding contact. The second semiconductor structure includes a second interconnect layer including second interconnects. The second semiconductor structure further includes a second bonding layer including second bonding contacts. At least one second bonding contact is in contact with a respective second interconnect. At least another second bonding contact is separated from the second interconnects. The semiconductor device further includes a bonding interface between the first and second bonding layers.

Abstract: A command-line interface (CLI) displaying method includes receiving a typed character, determining whether a character is displayed in a prompt information displaying area, deleting the character displayed in the prompt information displaying area when the character is displayed in the prompt information displaying area, and displaying information obtained by processing a command string currently displayed in a command line displaying area in the prompt information displaying area.