Patents by Inventor Taro Takahashi

Taro Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230158632
    Abstract: In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.
    Type: Application
    Filed: January 13, 2023
    Publication date: May 25, 2023
    Inventors: Hiroyuki Shinozaki, Yuta Suzuki, Taro Takahashi, Seiji Katsuoka, Masahiro Hatakeyama
  • Patent number: 11633852
    Abstract: A computing device performs computation for controlling operations of a mobile manipulator configured to hold a plurality of target objects with a manipulator and move the target objects to predetermined positions. The computing device includes a storage and a calculator. The storage stores a trained machine learning model trained by inputting a plurality of training data sets, which are combinations of state variables and pieces of determination data associated with the state variables. The training data sets are acquired in advance. The calculator outputs a movement-target object to be moved to a predetermined position at current time by inputting the state variable to the trained machine learning model read from the storage. The state variable contains relative positions of the target objects to a specific portion of the mobile manipulator. The determination data associated with the state variable represents the movement-target object.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: April 25, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Taro Takahashi
  • Patent number: 11633828
    Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: April 25, 2023
    Assignee: EBARA CORPORATION
    Inventors: Yuta Suzuki, Taro Takahashi, Akihiko Ogawa, Shigeyuki Furuya, Yuji Yagi, Nobuyuki Takada, Shinpei Tokunaga
  • Patent number: 11583973
    Abstract: In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: February 21, 2023
    Assignee: EBARA CORPORATION
    Inventors: Hiroyuki Shinozaki, Yuta Suzuki, Taro Takahashi, Seiji Katsuoka, Masahiro Hatakeyama
  • Patent number: 11571810
    Abstract: The arithmetic device configured to perform a calculation for controlling a motion of a grasping apparatus that performs work involving a motion of sliding a grasped object includes: an acquisition unit configured to acquire a state variable indicating a state of the grasping apparatus during the work; a storage unit storing a learned neural network that has been learned by receiving a plurality of training data sets composed of a combination of the state variable acquired in advance and correct answer data corresponding to the state variable; an arithmetic unit configured to calculate a target value of each of various actuators related to the work of the grasping apparatus by inputting the state variable to the learned neural network read from the storage unit; and an output unit configured to output the target value of each of the various actuators to the grasping apparatus.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: February 7, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Taro Takahashi
  • Publication number: 20230010384
    Abstract: A torque estimation method according to the present disclosure estimates a value of shaft torque of a rotary motion transmitting mechanism. The torque estimation method includes: a step of specifying a maximum value of a torsion angle between an input shaft and an output shaft from the time when a measurement value of the torsion angle is zero to the time when the value of the shaft torque is estimated; and a step of specifying the maximum value of the torsion angle. In the step of specifying the maximum value of the torsion angle, the maximum value of the torsion angle is specified based on a difference between the measurement value of the torsion angle subjected to low-pass filter processing at a first cutoff frequency and the measurement value of the torsion angle subjected to low-pass filter processing at a second cutoff frequency.
    Type: Application
    Filed: June 22, 2022
    Publication date: January 12, 2023
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akira HATANO, Taro TAKAHASHI, Naoki MIMA
  • Publication number: 20220412715
    Abstract: There is provided a detection signal processing circuit and a detection signal processing method for an eddy current sensor that are less easily influenced by a change in ambient environment than conventional technologies. A detection signal processing apparatus includes a converter configured to convert a first analog signal output by a detection coil into a first digital signal, a converter configured to convert a second analog signal output by a dummy coil into a second digital signal, and a detector which is a digital signal processing circuit configured to detect the first digital signal and the second digital signal.
    Type: Application
    Filed: June 13, 2022
    Publication date: December 29, 2022
    Inventors: Hiroto Yamada, Taro Takahashi, Hiroaki Shibue
  • Publication number: 20220416701
    Abstract: An external force estimation device is configured to estimate an external force acting on a motor. The external force estimation device includes a processor. The processor is configured to: calculate an output torque of the motor by using a value of a current supplied to the motor; estimate an inertia torque of the motor by using rotational position information of the motor; estimate a first friction torque of the motor by using the rotational position information of the motor; perform temperature-based correction for the first friction torque by using temperature information of the motor; and estimate the external force by subtracting the inertia torque and the first friction torque after the temperature-based correction from the output torque.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 29, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Taro TAKAHASHI, Akira HATANO, Naoki MIMA
  • Patent number: 11491666
    Abstract: A control system according to an embodiment includes a motor configured to drive a link, a first sensor configured to detect information about the driving by the motor or information about a relation between the driving means and the load member as first sensor information, a second sensor configured to detect information about a displacement of the link as second sensor information, and a control unit configured to perform feedback control of the driving means so as to follow a command value in a two-inertial system model including an inertial system on a load side and an inertial system on a driving side. The control unit includes a disturbance observer configured to estimate a disturbance, and a filter configured to convert an estimated value of the disturbance into a driving force of the motor.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: November 8, 2022
    Assignees: THE UNIVERSITY OF TOKYO, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroshi Fujimoto, Akiyuki Hasegawa, Taro Takahashi
  • Publication number: 20220288250
    Abstract: A control device that controls an ultraviolet emission device such that the inside of a vehicle is sterilized is provided. The control device includes a vehicle state acquiring unit configured to acquire a state of the vehicle, a determination unit configured to determine whether a person is present inside of the vehicle based on the state of the vehicle, and a control unit configured to control the ultraviolet emission device with reference to a result of determination of whether a person is present inside of the vehicle.
    Type: Application
    Filed: February 4, 2022
    Publication date: September 15, 2022
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Taro TAKAHASHI
  • Publication number: 20220266418
    Abstract: A substrate processing apparatus of accurately detecting an end point of substrate polishing using an acoustic sensor is disclosed. The substrate processing apparatus for polishing a substrate by pressing the substrate against a polishing pad, includes: an acoustic sensor configured to detect an acoustic event occurring with polishing of a substrate and output the acoustic event as acoustic signals; a power-spectrum generator configured to generate power spectra from the acoustic signals, each of the power spectra indicating a spectrum of a sound-pressure level; a map updating device configured to generate a power spectrum map indicating a temporal change in power spectrum by arranging the power spectra in a time-series order; and an end-point determiner configured to detect a polishing end point of the substrate based on a change in the sound-pressure level in the power spectrum map.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 25, 2022
    Inventors: Yuta Suzuki, Taro Takahashi, Katsuhide Watanabe, Tsutomu Miki
  • Publication number: 20220266414
    Abstract: A method of accurately detecting an end point of substrate polishing using an acoustic sensor is disclosed. The method includes: detecting an acoustic event occurring with polishing of a substrate and outputting the acoustic event as acoustic signals; generating power spectra from the acoustic signals, each of the power spectra indicating a spectrum of a sound-pressure level; generating a power spectrum map indicating a temporal change in power spectrum by arranging the power spectra in a time-series order; and detecting a polishing end point of the substrate based on a change in the sound-pressure level in the power spectrum map.
    Type: Application
    Filed: February 16, 2022
    Publication date: August 25, 2022
    Applicant: Kioxia Corporation
    Inventors: Tsutomu MIKI, Yuta SUZUKI, Taro TAKAHASHI, Katsuhide WATANABE
  • Publication number: 20220219283
    Abstract: A polishing apparatus capable of acquiring accurate film thickness distribution information is disclosed. The polishing apparatus includes a polishing table, a plurality of film thickness sensors, and a controller. The controller analyzes film thickness distribution information of a substrate while identifying a notch position of the substrate based on the measured film thickness information, and outputs visualization information of the film thickness distribution with the notch position as a reference position.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 14, 2022
    Inventors: Hiroaki Shibue, Taro Takahashi, Toshiki Miyakawa
  • Publication number: 20220203498
    Abstract: A polishing apparatus for performing polishing between a polishing pad and a semiconductor wafer disposed to face the polishing pad includes a polishing table for holding the polishing pad, a top ring for holding the semiconductor wafer, a swing arm for holding the top ring, and a swing shaft motor for causing the swing arm to swing. The polishing apparatus further includes an arm torque detection section that detects an arm torque imparted to the swing arm when the swing arm is swinging in a predetermined angle range, and an endpoint detection section that detects a polishing endpoint indicating the end of polishing on the basis of the arm torque detected by the arm torque detection section.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 30, 2022
    Inventors: Yuta Suzuki, Taro Takahashi
  • Publication number: 20220163484
    Abstract: An eddy current sensor for detecting an eddy current that can be generated in a wafer includes a magnetic core. The core has a base, a central wall provided on the base in the center of the base in a first direction, and end walls provided on the base at either end portion of the base in the first direction. The eddy current sensor includes exciting coils which are disposed on the end walls and which generates an eddy current in the wafer, and a detecting coil which is disposed on the central wall and which detects the eddy current.
    Type: Application
    Filed: November 23, 2021
    Publication date: May 26, 2022
    Inventors: Hiroto Yamada, Taro Takahashi, Hiroaki Shibue
  • Patent number: 11332313
    Abstract: A conveyor belt monitoring system includes an imaging device which sequentially images a longitudinal predetermined range of a conveyor belt in running from above the conveyor belt. Image data captured by the imaging device is displayed in a monitor, and then is sequentially input into a control unit as detection data. The control unit causes a meander suppressing device to reduce a meander width of the conveyor belt on the basis of the image data.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: May 17, 2022
    Assignee: The Yokohama Rubber Co., LTD.
    Inventors: Gang Hou, Masahiko Miyamoto, Taro Takahashi, Masaharu Manishi, Eiji Kobayashi, Hitoshi Indo
  • Publication number: 20220091021
    Abstract: A test sample of a vulcanized rubber material is placed under a preset placement condition in a fixing frame in a test tank having a predetermined ozone concentration, and digital image data is acquired by capturing at a fixed point, over time, with at least one camera device, images of a surface of the test sample that has been placed in the test tank; and determining a change in a surface state of the test sample between a plurality of points in time by analyzing, with a computation device, the image data that has been acquired. Such evaluation method for evaluating ozone deterioration of a vulcanized rubber material can accurately determine a change over time in ozone deterioration while reducing working man-hours.
    Type: Application
    Filed: November 29, 2019
    Publication date: March 24, 2022
    Inventors: Gang HOU, Taro TAKAHASHI, Masahiko MIYAMOTO, Naoto ISHII
  • Publication number: 20220063056
    Abstract: An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.
    Type: Application
    Filed: August 24, 2021
    Publication date: March 3, 2022
    Inventors: Atsushi ABE, Taro TAKAHASHI, Hiroaki SHIBUE, Shinpei TOKUNAGA, Katsuhide WATANABE
  • Patent number: 11260499
    Abstract: A polishing apparatus 100 includes a first electric motor 14 that rotationally drives a polishing table 12, and a second electric motor 22 that rotationally drives a top ring 20 that holds a semiconductor wafer 18. The polishing apparatus 100 includes: a current detection portion 24; an accumulation portion 110 that accumulates, for a prescribed interval, current values of three phases that are detected by the current detection portion 24; a difference portion 112 that determines a difference between a detected current value in an interval that is different to the prescribed interval and the accumulated current value; and an endpoint detection portion 29 that detects a polishing endpoint that indicates the end of polishing of the surface of the semiconductor wafer 18, based on a change in the difference that the difference portion 112 outputs.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: March 1, 2022
    Assignee: EBARA CORPORATION
    Inventors: Taro Takahashi, Yuta Suzuki
  • Publication number: 20210279518
    Abstract: To reduce a learning time while improving learning accuracy. A learning method includes generating first time-series data by performing sampling from a predetermined sensor value at a first sampling cycle, generating second time-series data by performing sampling from the predetermined sensor value at a second sampling cycle different from the first sampling cycle, and generating learning data by combining the generated first and second time-series data with each other, and performing learning by using the generated learning data.
    Type: Application
    Filed: February 25, 2021
    Publication date: September 9, 2021
    Applicant: Toyota Jidosha Kabushiki Kaisha
    Inventor: Taro Takahashi