Abstract: It is possible to effectively prevent lowering of work efficiency while stabilizing an operation of a robot or the like. A torque estimation system estimates friction torque of a rotation mechanism. The torque estimation system inclues angular velocity detecting means for detecting an angular velocity of the rotation mechanism, and limit value setting means for setting an upper limit value and a lower limit value according to the angular velocity of the rotation mechanism detected by the angular velocity detection means, the upper limit value and the lower limit value limiting an upper limit and a lower limit, respectively, of the friction torque of the estimated friction torque.

Abstract: A test sample of a vulcanized rubber material is placed under a preset placement condition in a fixing frame in a test tank having a predetermined ozone concentration, and digital image data is acquired by capturing at a fixed point, over time, with at least one camera device, images of a surface of the test sample that has been placed in the test tank; and determining a change in a surface state of the test sample between a plurality of points in time by analyzing, with a computation device, the image data that has been acquired. Such evaluation method for evaluating ozone deterioration of a vulcanized rubber material can accurately determine a change over time in ozone deterioration while reducing working man-hours.

Abstract: A compound includes: at least one group represented by a formula (11) below; and a single benz[de]anthracene derivative skeleton represented by a formula (1000) below in a molecule, in which Ar1 is a substituted or unsubstituted aryl group including at least four rings, at least one of R10 to R19 is a group represented by the formula (11), L1 is a substituted or unsubstituted arylene group having 6 to 15 ring carbon atoms or a substituted or unsubstituted divalent heterocyclic group having 5 to 15 ring atoms, and mx is 1, 2, or 3.

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

Abstract: The present invention relates to a technique of determining a time to replace a polishing pad used in a polishing apparatus for polishing a workpiece, such as wafer, substrate, or panel. A polishing apparatus (1) includes: a polishing table (5) configured to support a polishing pad (2); a polishing head (7) configured to press a workpiece (W) against a polishing surface (2a) of the polishing pad (2); a dresser (40) configured to dress the polishing surface (2a) of the polishing pad (2); a detection sensor (60) configured to detect friction between the dresser (40) and the polishing pad (2), the detection sensor (60) being fixed to the dresser (40); and a wear monitoring device (63) configured to determine a wear index value from a plurality of output values of the detection sensor (60) and generate an alarm signal when the wear index value is smaller than a predetermined lower limit.

Abstract: An information processing device is provided that includes an acquisition unit that acquires information indicating a force generated between a first tool and an object in a trial motion using the first tool by a robot, and an estimation unit that estimates information of executing a specific task using the first tool based on the information acquired by the acquisition unit and information indicating a force generated between a specific tool and the object in the specific task using the specific tool.

Abstract: The information processing device includes an acquisition unit, a recognition unit, and a specification unit. The acquisition unit is configured to acquire information indicating an action trajectory of an expert for a specific task. The recognition unit is configured to recognize each operation on the target object in time series based on the action trajectory. The specification unit is configured to specify each operation for causing the robot to execute the task based on each operation recognized by the recognition unit and a configuration of the robot.

Abstract: A magnetic element for strengthening a magnetic field formed in an object and an eddy current sensor using the magnetic field are provided. The eddy current sensor includes a bottom face portion which is a magnetic body, a magnetic core portion provided at the middle of the bottom face portion and a peripheral wall portion provided on the periphery of the bottom face portion. The eddy current sensor further includes an excitation coil disposed on an outer periphery of the magnetic core portion and capable of generating a magnetic field and an excitation coil disposed on an outer periphery of the peripheral wall portion and capable of generating a magnetic field.

Abstract: An external force estimation device is configured to estimate an external force acting on a motor. The external force estimation device includes a processor. The processor is configured to: calculate an output torque of the motor by using a value of a current supplied to the motor; estimate an inertia torque of the motor by using rotational position information of the motor; estimate a first friction torque of the motor by using the rotational position information of the motor; perform temperature-based correction for the first friction torque by using temperature information of the motor; and estimate the external force by subtracting the inertia torque and the first friction torque after the temperature-based correction from the output torque.

Abstract: An eddy current detection device configured to form a stronger magnetic field in a polishing target and a polishing apparatus employing the same eddy current detection device are provided. An eddy current detection device that can be disposed near a semiconductor wafer on which a conductive film is formed includes a plurality of eddy current sensors. The plurality of eddy current sensors are disposed near to one another. Each of the plurality of eddy current sensors includes a pot core, an exciting coil disposed in the pot core and configured to form an eddy current in the conductive film, and a detection coil disposed in the pot core and configured to detect the eddy current formed in the conductive film.

Abstract: A machine learning method includes: a first learning step which is performed in a phase before a neural network is installed in a mobile robot and in which a stationary first obstacle is placed in a set space and the first obstacle is placed at different positions using simulation so that the neural network repeatedly learns a path from a starting point to the destination which avoids the first obstacle; and a second learning step which is performed in a phase after the neural network is installed in the mobile robot and in which, when the mobile robot recognizes a second obstacle that operates around the mobile robot in a space where the mobile robot moves, the neural network repeatedly learns a path to the destination which avoids the second obstacle every time the mobile robot recognizes the second obstacle.

Abstract: A method in which an acoustic sensor disposed in a polishing apparatus can be accurately calibrated is disclosed. In this method, polishing sounds of a substrate are acquired using an acoustic sensor; and then at least two distinctive sounds, having distinctive frequencies respectively, are selected from the acquired polishing sounds. Further, the at least two distinctive sounds are output from a sound source coupled to any of a polishing table, the acoustic sensor, and a substrate holder to cause the at least two distinctive sounds to be input to the acoustic sensor. Next, output values of the acoustic sensor are calibrated, such that the output values of the acoustic sensor relative to the at least two distinctive sounds come within an allowable range.

Abstract: A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

Abstract: In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

Abstract: A computing device performs computation for controlling operations of a mobile manipulator configured to hold a plurality of target objects with a manipulator and move the target objects to predetermined positions. The computing device includes a storage and a calculator. The storage stores a trained machine learning model trained by inputting a plurality of training data sets, which are combinations of state variables and pieces of determination data associated with the state variables. The training data sets are acquired in advance. The calculator outputs a movement-target object to be moved to a predetermined position at current time by inputting the state variable to the trained machine learning model read from the storage. The state variable contains relative positions of the target objects to a specific portion of the mobile manipulator. The determination data associated with the state variable represents the movement-target object.

Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

Abstract: In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

Abstract: The arithmetic device configured to perform a calculation for controlling a motion of a grasping apparatus that performs work involving a motion of sliding a grasped object includes: an acquisition unit configured to acquire a state variable indicating a state of the grasping apparatus during the work; a storage unit storing a learned neural network that has been learned by receiving a plurality of training data sets composed of a combination of the state variable acquired in advance and correct answer data corresponding to the state variable; an arithmetic unit configured to calculate a target value of each of various actuators related to the work of the grasping apparatus by inputting the state variable to the learned neural network read from the storage unit; and an output unit configured to output the target value of each of the various actuators to the grasping apparatus.

Abstract: A torque estimation method according to the present disclosure estimates a value of shaft torque of a rotary motion transmitting mechanism. The torque estimation method includes: a step of specifying a maximum value of a torsion angle between an input shaft and an output shaft from the time when a measurement value of the torsion angle is zero to the time when the value of the shaft torque is estimated; and a step of specifying the maximum value of the torsion angle. In the step of specifying the maximum value of the torsion angle, the maximum value of the torsion angle is specified based on a difference between the measurement value of the torsion angle subjected to low-pass filter processing at a first cutoff frequency and the measurement value of the torsion angle subjected to low-pass filter processing at a second cutoff frequency.