Abstract: A control device includes a main actuator configured to drive a plant through a torque transfer device disposed on a driving side, a load side sub-actuator configured to drive the plant that is disposed on a plant side, and a processor configured to: generate a torque reference input value driving the main actuator and the load side sub-actuator, and cancel out resonance by multiplying the generated torque reference input value by: a first gain including an inertia coefficient, a viscosity coefficient, and a reduction ratio of the torque transfer device on the driving side and on the plant side, and a second gain including: the inertia coefficient, the viscosity coefficient, and the reduction ratio of the torque transfer device on the driving side and on the plant side, and thereby adjusting a ratio of the torque reference input value of the main actuator and the load side sub-actuator.

Abstract: The polishing process includes a first state where an eddy current sensor and a polishing target object do not face each other and a second state where the eddy current sensor and the polishing target object face each other. The method of correcting a film thickness measurement value includes obtaining a first measurement signal (Xout, Yout) output from the eddy current sensor in the first state (step S108), computing a correction value (?X, ?Y) on the basis of the obtained first measurement signal and a reference signal (Xsd, Ysd) set in advance, obtaining a second measurement signal (X, Y) output from the eddy current sensor in the second state (step S104), and correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process is being performed (step S105).

Abstract: There is provided an antiviral vinyl-chloride-based resin composition including: 100 parts by weight of a poly(vinyl chloride)-based resin obtained by mixing 10-90 parts by weight of a vinyl-chloride-based resin for paste with 90-10 parts by weight of a suspension vinyl-chloride-based resin; and 0.5-10.0 parts by weight of a sulfonic-acid-based surfactant.

Abstract: A polishing apparatus capable of polishing a substrate while accurately measuring a temperature at a desired measuring point near a surface of the substrate is disclosed. The polishing apparatus includes: a polishing pad having a polishing surface for polishing a substrate; a polishing table supporting the polishing pad; a table motor configured to rotate the polishing table; a polishing head configured to press a surface of the substrate against the polishing surface of the polishing pad; a polishing liquid supply nozzle configured to supply a polishing liquid onto the polishing surface of the polishing pad; and a temperature sensor mounted to the polishing table. The temperature sensor is located so as to move across the surface of the substrate each time the polishing table makes one revolution.

Abstract: The present invention improves the accuracy of film thickness detection. A film thickness signal processing apparatus 230 is provided with a receiving unit 232 for receiving film thickness data output from an eddy-current sensor 210 for detecting the film thickness of a polishing object 102 along a surface to be polished thereof; an identifying unit 236 for identifying the effective range of the film thickness data on the basis of the film thickness data received by the receiving unit 232; and a correcting unit 238 for correcting the film thickness data within the effective range identified by the identifying unit 236.

Abstract: A polishing apparatus capable of monitoring an accurate progress of polishing is disclosed. The polishing apparatus includes: a polishing table for supporting a polishing pad; a table motor configured to rotate the polishing table; a top ring configured to press a substrate against the polishing pad to polish the substrate; a dresser configured to dress the polishing pad while oscillating on the polishing pad during polishing of the substrate; a filtering device configured to remove a vibration component, having a frequency corresponding to an oscillation period of the dresser, from an output current signal of the table motor; and a polishing monitoring device configured to monitor a progress of polishing of the substrate based on the output current signal from which the vibration component has been removed.

Abstract: According to an aspect, a network system comprises a ring-type network, and a master transmission apparatus. The master transmission apparatus includes blocking unit, conversion unit and transmission unit. The blocking unit prohibits relay of the transmission frame received through a first virtual transmission line and a second virtual transmission line. The conversion unit changes transmission path information included in the transmission frame from the first virtual transmission line to the second virtual transmission line. The transmission unit transmits the transmission frame including the transmission path information changed by the conversion unit.

Abstract: The polishing process includes a first state where an eddy current sensor and a polishing target object do not face each other and a second state where the eddy current sensor and the polishing target object face each other. The method of correcting a film thickness measurement value includes obtaining a first measurement signal (Xout, Yout) output from the eddy current sensor in the first state (step S108), computing a correction value (?X, ?Y) on the basis of the obtained first measurement signal and a reference signal (Xsd, Ysd) set in advance, obtaining a second measurement signal (X, Y) output from the eddy current sensor in the second state (step S104), and correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process is being performed (step S105).

Abstract: A control device includes first driving means for driving a plant through torque transfer means, placed on a driving side, second driving means for driving the plant, placed on a plant side, reference input generation means for generating a torque reference input value for driving the first and second driving means, and resonance cancellation means for canceling out resonance by multiplying the torque reference input value by a first gain including an inertia coefficient, a viscosity coefficient and a reduction ratio of the torque transfer means on the driving side and on the plant side and multiplying the torque reference input value by a second gain including the inertia coefficient, the viscosity coefficient and the reduction ratio of the torque transfer means on the driving side and on the plant side, and thereby adjusting a ratio of the torque reference input value for the first and second driving means.

Abstract: A method monitors a change in thickness of a conductive film brought into sliding contact with a polishing surface of a polishing pad using an eddy current sensor. The output signal of the eddy current sensor includes two signals corresponding to a resistance component and an inductive reactance component of an impedance of an electric circuit including a coil of the eddy current sensor.

Abstract: A polishing apparatus capable of monitoring an accurate progress of polishing is disclosed. The polishing apparatus includes: a polishing table for supporting a polishing pad; a table motor configured to rotate the polishing table; a top ring configured to press a substrate against the polishing pad to polish the substrate; a dresser configured to dress the polishing pad while oscillating on the polishing pad during polishing of the substrate; a filtering device configured to remove a vibration component, having a frequency corresponding to an oscillation period of the dresser, from an output current signal of the table motor; and a polishing monitoring device configured to monitor a progress of polishing of the substrate based on the output current signal from which the vibration component has been removed.

Abstract: A polishing method includes: rotating a polishing table that supports a polishing pad; polishing a conductive film by pressing a substrate having the conductive film against the polishing pad; obtaining a film thickness signal with use of an eddy current film-thickness sensor disposed in the polishing table; determining a thickness of the polishing pad based on the film thickness signal; determining a polishing rate of the conductive film corresponding to the determined thickness of the polishing pad; calculating an expected amount of polishing of the conductive film to be polished at the determined polishing rate for a predetermined polishing time; calculating a temporary end-point film thickness by adding the expected amount of polishing to a target thickness; and terminating polishing of the conductive film when the predetermined polishing time has elapsed from a point of time when the thickness of the conductive film has reached the temporary end-point film thickness.

Abstract: A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.

Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil disposed near a metal film or a conductive film formed on a substrate, and the sensor coil includes a detection coil operable to detect an eddy current produced in the metal film or the conductive film. The detection coil includes a coil formed by winding a wire by a single row and plural layers, the row being defined as a direction perpendicular to the substrate and the layer being defined as a direction parallel to the substrate.

Abstract: According to an aspect, a network system comprises a ring-type network, and a master transmission apparatus. The master transmission apparatus includes blocking unit, conversion unit and transmission unit. The blocking unit prohibits relay of the transmission frame received through a first virtual transmission line and a second virtual transmission line. The conversion unit changes transmission path information included in the transmission frame from the first virtual transmission line to the second virtual transmission line. The transmission unit transmits the transmission frame including the transmission path information changed by the conversion unit.

Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor is disposed near the metal film or the conductive film formed on the substrate to detect an eddy current generated in the metal film or the conductive film. The eddy current sensor includes a plurality of coils having different sizes formed by winding a wire or a conductive material. The plurality of coils includes an inner coil and an outer coil spaced from each other, and the outer coil is configured to surround the inner coil. The plurality of coils are configured to detect respective eddy currents generated in the metal film or the conductive film.

Abstract: A polishing method polishes and planarizes a substrate. The substrate is pressed against a polishing surface on a rotating polishing table. During polishing, the polishing table is rotated, and the surface, being polished, of the substrate is scanned by an eddy current sensor provided in the polishing table. An output of the eddy current sensor is monitored, and substrate damage is detected from a change in the output of the eddy current sensor. Further, an output of an end point detecting sensor obtained by scanning the surface of the substrate is monitored, and the polishing end point is detected from a change in the output of the end point detecting sensor. After detecting the polishing end point, an output of the end point detecting sensor or another sensor is monitored, and detecting a film left on a part of the substrate is performed.

Abstract: In a storage system provided with a plurality of storage modules, the rated power consumption can be reduced. The storage system is provided with a charge control unit. The charge control unit stops, when detecting that a predetermined number of a plurality of battery modules are during battery charging, the battery charging in the remaining battery modules.

Abstract: A method of monitoring a thickness of a conductive film on a substrate during polishing of the substrate with use of an eddy current sensor is provided. This method includes: polishing the conductive film by pressing the substrate against a polishing surface on the rotating polishing table; obtaining output signal of the eddy current sensor during polishing; calculating an amount of output adjustment of the eddy current sensor using the output signal obtained when the substrate is not present above the eddy current sensor; with use of the amount of output adjustment, correcting the output signal obtained when the substrate is present above the eddy current sensor; and monitoring the thickness of the conductive film based on the corrected output signal.

Abstract: The object is to improve the bubble retention in a sparkling beverage such as a malt alcoholic beverage including a beer and a sparkling liquor, a sparkling alcoholic beverage produced without any malt and a carbonated refreshing beverage including a soda pop and a cream soda. Disclosed is a bubble stabilizer comprising, as an active ingredient, a water-soluble soybean polysaccharide which is produced by the heat-extraction from a soybean or a processed product of a soybean at a pH lower than the isoelectric point of a soybean protein and ranging from 2.4 to 4.0 at a temperature of 100° C. or higher. The bubble stabilizer can be added to a malt alcoholic beverage such as a beer and a sparkling liquor, a sparkling alcoholic beverage produced without any malt or a carbonated refreshing beverage such as a soda pop and a lemon soda to thereby improve the bubble retention in the beverage.