Abstract: A magnetic element for strengthening a magnetic field formed in an object and an eddy current sensor using the magnetic field are provided. The eddy current sensor includes a bottom face portion which is a magnetic body, a magnetic core portion provided at the middle of the bottom face portion and a peripheral wall portion provided on the periphery of the bottom face portion. The eddy current sensor further includes an excitation coil disposed on an outer periphery of the magnetic core portion and capable of generating a magnetic field and an excitation coil disposed on an outer periphery of the peripheral wall portion and capable of generating a magnetic field.

Abstract: A polishing pad is held using a polishing table. The polishing table is driven to rotate using a first electric motor. The top ring for holding a semiconductor wafer and pressing the top ring against a polishing pad is driven to rotate by a top ring motor. The top ring is held by the swing arm. The swing arm is made to swing around a swing center on the swing arm by a swing shaft motor. A first output is generated by detecting a current value of the swing shaft motor. While polishing the semiconductor wafer by causing the semiconductor wafer to swing around the swing center on the swing arm, a change of a frictional force between the polishing pad and the semiconductor wafer is detected by increasing a change amount of the first output.

Abstract: A current detection section detects a current value of a swing shaft motor 14 and generates a first output. A first processing section obtains a contact pressure corresponding to the first output from the first output using first data indicating a correspondence relationship between a contact pressure applied to a semiconductor wafer by a top ring and the first output. A second processing section obtains a second output corresponding to a contact pressure obtained by the first processing section using second data indicating a correspondence relationship between the contact pressure obtained by the first processing section and the second output.

Abstract: A polishing table holds a polishing pad. A top ring holds a semiconductor wafer. A swing arm holds the top ring. The swing arm swings around a swing center on the swing arm during polishing. An optical sensor is disposed on the polishing table and measures an optical characteristic changeable in accordance with a variation in film thickness of the semiconductor wafer. A fluid supply control apparatus determines a distance from an axis of rotation to the optical sensor when the semiconductor wafer is rotated by the top ring. An end point detection section detects a polishing end point indicating an end of polishing based on the optical characteristic measured by the optical sensor and the determined distance.

Abstract: The object of the present invention is to provide a small-sized metal detection sensor for detecting fine metal contaminants, using an electromagnetic induction detection technique. A metal detection sensor for 20 detecting metal 14 contained in an object under inspection moving through a passageway 18 comprises: magnets 24, 26 generating static magnetic field; and a coil 30 for detecting a magnetic field 28 generated by the metal 14. The magnets 24, 26 are located outside of the coil 30 along its axial direction, and the coil 30 is located outside of the magnets 24, 26 along the axial direction connecting the N poles and the S poles of the magnets 24, 26. The magnets 24, 26 are opposed to the coil 30.

Abstract: The travelling apparatus according to exemplary embodiments includes front wheels, which are driving wheels, an upper frame, first linear motion mechanisms configured to be extendable and retractable and couple the front wheels to the upper frame, middle wheels configured to be disposed at a back of the front wheels, second linear motion mechanisms configured to be extendable and retractable and couple a riding part to the middle wheels, rear wheels configured to be disposed at a back of the middle wheels, lower links configured to couple the middle wheels to the rear wheels, respectively, rear links configured to couple the lower links to the upper frame, and a third linear motion mechanism configured to change an angle between the upper frame and the rear links.

Abstract: A control apparatus of the motor according to one aspect includes: a first feedforward calculator configured to calculate a first motor output torque value so that a torque value indicated by a torque command signal can be generated in a joint part of a robot based on a model of a motor, a decelerator, or a link and the number of rotations of the motor, a second feedforward calculator configured to calculate a second motor output torque value based on the torque value indicated by the torque command signal without depending on the number of rotations of the motor; and a comparator configured to add the first motor output torque value, the second motor output torque value, and a third motor output torque value calculated based on the torque value detected by a sensor and the torque value indicated by the torque command signal.

Abstract: There is provided an antiviral vinyl-chloride-based resin composition including: 100 parts by weight of a poly(vinyl chloride)-based resin obtained by mixing 10-90 parts by weight of a vinyl-chloride-based resin for paste with 90-10 parts by weight of a suspension vinyl-chloride-based resin; and 0.5-10.0 parts by weight of a sulfonic-acid-based surfactant.

Abstract: A motor control system includes a motor, a rotational angle sensor that detects a rotational angle of a motor shaft of the motor, a torque sensor that detects shaft torsion torque between the motor shaft, and an output shaft fixed to a load member driven by the motor, and a motor controller that controls the motor. The motor controller estimates a rotational angle of the output shaft, based on the rotational angle of the motor shaft, the shaft torsion torque, and torsional rigidity obtained in advance with respect to a region between the motor shaft and the output shaft, and controls the motor, using the estimated rotational angle of the output shaft.

Abstract: A polishing apparatus of the present disclosure polishes a polishing target by pressing the polishing target against a polishing pad. An eddy current sensor measures an impedance that is changeable according to a change of a film thickness of the polishing target, at a plurality of positions of the polishing target, and outputs measurement signals. A difference calculator generates data corresponding to a film thickness based on a measurement signal. The difference calculator calculates a difference between data at different times based on measurement signals output by the eddy current sensor at different times at a center of the polishing target. An end point detector detects a polishing end point indicating the end of polishing based on the difference calculated by the difference calculator.

Abstract: A control apparatus of the motor according to one aspect includes: a first feedforward calculator configured to calculate a first motor output torque value so that a torque value indicated by a torque command signal can be generated in a joint part of a robot based on a model of a motor, a decelerator, or a link and the number of rotations of the motor, a second feedforward calculator configured to calculate a second motor output torque value based on the torque value indicated by the torque command signal without depending on the number of rotations of the motor; and a comparator configured to add the first motor output torque value, the second motor output torque value, and a third motor output torque value calculated based on the torque value detected by a sensor and the torque value indicated by the torque command signal.

Abstract: In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

Abstract: An end point detection method is provided for detecting an end point based on a drive current supplied to a drive unit that rotates and drives one of a polishing table and a holding unit. The end point detection method includes: a step (S102) of determining whether a polishing condition of a polishing process to be executed coincides with a preset specific polishing condition; a step (S103) of adjusting a current control parameter in a drive control unit that controls the drive current, the current control parameter related to a change in the drive current with respect to a change in a driving load of the drive unit, if it is determined that the polishing condition coincides with the specific polishing condition; and a step (S105) of detecting the drive current supplied to the drive unit based on the adjusted current control parameter.

Abstract: An end-point detection sensor 50 detects an end point of polishing, the end-point detection sensor 50 being arranged in a polishing table 100. The end-point detection sensor 50 has a pot core. The pot core 60 has a bottom portion 61a, a magnetic core base portion 61b and a peripheral wall base portion 61c. The end-point detection sensor 50 has an exciting coil 62, and a detection coil 63. The back surface 101b of the polishing pad 101 has a space 30 which is arranged at a portion facing the polishing table 100 and houses a magnetic core extension portion 8 and a peripheral wall extension portion 11. The magnetic core extension portion 8 and the peripheral wall extension portion 11 extending to the space 30 are located in the space 30.

Abstract: The travelling apparatus according to exemplary embodiments includes front wheels, which are driving wheels, an upper frame, first linear motion mechanisms configured to be extendable and retractable and couple the front wheels to the upper frame, middle wheels configured to be disposed at a back of the front wheels, second linear motion mechanisms configured to be extendable and retractable and couple a riding part to the middle wheels, rear wheels configured to be disposed at a back of the middle wheels, lower links configured to couple the middle wheels to the rear wheels, respectively, rear links configured to couple the lower links to the upper frame, and a third linear motion mechanism configured to change an angle between the upper frame and the rear links.

Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor is disposed near the metal film or the conductive film formed on the substrate to detect an eddy current generated in the metal film or the conductive film. The eddy current sensor includes a plurality of coils having different sizes formed by winding a wire or a conductive material. The plurality of coils includes an inner coil and an outer coil spaced from each other, and the outer coil is configured to surround the inner coil. The plurality of coils are configured to detect respective eddy currents generated in the metal film or the conductive film.

Abstract: A polishing apparatus 100 includes a first electric motor 14 that rotationally drives a polishing table 12, and a second electric motor 22 that rotationally drives a top ring 20 that holds a semiconductor wafer 18. The polishing apparatus 100 includes: a current detection portion 24; an accumulation portion 110 that accumulates, for a prescribed interval, current values of three phases that are detected by the current detection portion 24; a difference portion 112 that determines a difference between a detected current value in an interval that is different to the prescribed interval and the accumulated current value; and an endpoint detection portion 29 that detects a polishing endpoint that indicates the end of polishing of the surface of the semiconductor wafer 18, based on a change in the difference that the difference portion 112 outputs.

Abstract: A polishing method includes: rotating a polishing table that supports a polishing pad; polishing a conductive film by pressing a substrate having the conductive film against the polishing pad; obtaining a film thickness signal with use of an eddy current film-thickness sensor disposed in the polishing table; determining a thickness of the polishing pad based on the film thickness signal; determining a polishing rate of the conductive film corresponding to the determined thickness of the polishing pad; calculating an expected amount of polishing of the conductive film to be polished at the determined polishing rate for a predetermined polishing time; calculating a temporary end-point film thickness by adding the expected amount of polishing to a target thickness; and terminating polishing of the conductive film when the predetermined polishing time has elapsed from a point of time when the thickness of the conductive film has reached the temporary end-point film thickness.

Abstract: A control apparatus of the motor according to one aspect includes: a first feedforward calculator configured to calculate a first motor output torque value so that a torque value indicated by a torque command signal can be generated in a joint part of a robot based on a model of a motor, a decelerator, or a link and the number of rotations of the motor, a second feedforward calculator configured to calculate a second motor output torque value based on the torque value indicated by the torque command signal without depending on the number of rotations of the motor; and a comparator configured to add the first motor output torque value, the second motor output torque value, and a third motor output torque value calculated based on the torque value detected by a sensor and the torque value indicated by the torque command signal.

Abstract: The present invention improves the accuracy of film thickness detection. A film thickness signal processing apparatus 230 is provided with a receiving unit 232 for receiving film thickness data output from an eddy-current sensor 210 for detecting the film thickness of a polishing object 102 along a surface to be polished thereof; an identifying unit 236 for identifying the effective range of the film thickness data on the basis of the film thickness data received by the receiving unit 232; and a correcting unit 238 for correcting the film thickness data within the effective range identified by the identifying unit 236.