Patents by Inventor Tatsuya Oga

Tatsuya Oga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11349233
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of connection portions is larger than a second fillet width of another solder among the solder fillets located in an outside region of one of the pair of connection portions, which is on a side opposite to the inside region across the one of the pair of connection portions.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: May 31, 2022
    Assignee: Yazaki Corporation
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Patent number: 11166382
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: November 2, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Patent number: 11088422
    Abstract: A method for manufacturing a laminated bus bar includes a first base member forming process of forming a plurality of first through-holes in a conductive flat plate-shaped first base member, a second base member forming process of forming a conductive flat plate-shaped second base member, a laminating process of forming a laminated body configured by laminating and fixing flat surfaces of the first base member and the second base member on and to each other, and a punching process of forming, in the second base member of the laminated body, second through-holes forming pairs with the first through-holes, the second through-holes being smaller than the first through-holes in portions overlapping with the first through-holes in a lamination direction of the first base member and the second base member.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: August 10, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Tatsuya Oga, Yoshiaki Ichikawa, Mariko Nakagawa
  • Publication number: 20210151915
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body connected to a mounting surface of the circuit body using a solder. The conductive body has a pair of connection portions opposed to each other and extending along the mounting surface. The solder forms solder fillets located around the pair of the connection portions and extending along the mounting surface. A first fillet width of one solder fillet among the solder fillets located in an inside region between the pair of the connection portions is larger than a second fillet width of another one solder among the solder fillets located in an outside region on an opposite side to the inside region across the connection portions.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 20, 2021
    Applicant: Yazaki Corporation
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Publication number: 20210136925
    Abstract: A connection structure includes: a circuit body including a flexible printed circuit having a wiring pattern; and a conductive body including a connection portion. The connection portion has a flat-plate shape and is connected to a mounting surface of the circuit body. The wiring pattern has a number of connection target portions each extending in a preset direction to cross the connection portion and is longer than a width of the connection portion in the preset direction. The connection portion and the connection target portions are electrically connected using a conductive adhesive to connect the wiring pattern and the conductive body.
    Type: Application
    Filed: November 5, 2020
    Publication date: May 6, 2021
    Inventors: Yoshiaki Ichikawa, Tatsuya Oga, Mariko Nakagawa, Tomoji Yasuda
  • Patent number: 10959324
    Abstract: A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: a band-shaped main strip to be located to extend in a stacking direction of cells; a band-shaped first branch strip branched from the main strip and extending toward a corresponding busbar; and a second branch strip branched from the main strip and extending toward an external device. The first branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a busbar connection portion disposed closer to an end of the first branch strip than the bent portion and connected to the corresponding busbar. The second branch strip has a device connection portion to be connected to the external device.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: March 23, 2021
    Assignee: Yazaki Corporation
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Publication number: 20210043909
    Abstract: A method for manufacturing a laminated bus bar includes a first base member forming process of forming a plurality of first through-holes in a conductive flat plate-shaped first base member, a second base member forming process of forming a conductive flat plate-shaped second base member, a laminating process of forming a laminated body configured by laminating and fixing flat surfaces of the first base member and the second base member on and to each other, and a punching process of forming, in the second base member of the laminated body, second through-holes forming pairs with the first through-holes, the second through-holes being smaller than the first through-holes in portions overlapping with the first through-holes in a lamination direction of the first base member and the second base member.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 11, 2021
    Inventors: Tatsuya Oga, Yoshiaki Ichikawa, Mariko Nakagawa
  • Publication number: 20200396830
    Abstract: A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: a band-shaped main strip to be located to extend in a stacking direction of cells; a band-shaped first branch strip branched from the main strip and extending toward a corresponding busbar; and a second branch strip branched from the main strip and extending toward an external device. The first branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a busbar connection portion disposed closer to an end of the first branch strip than the bent portion and connected to the corresponding busbar. The second branch strip has a device connection portion to be connected to the external device.
    Type: Application
    Filed: May 13, 2020
    Publication date: December 17, 2020
    Applicant: Yazaki Corporation
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Publication number: 20200395589
    Abstract: A circuit body includes a flexible circuit board including: a conductor wiring pattern for electrical connection; and a pair of protective layers sandwiching the wiring pattern to isolate the wiring pattern from outside. The wiring pattern has a conduction portion exposed to the outside through an opening located on at least one of the pair of the protective layers and to be electrically connected to an external terminal. The conduction portion has at least two overlap portions located around the opening and sandwiched between the pair of the protective layers in a thickness direction of the flexible circuit board.
    Type: Application
    Filed: May 13, 2020
    Publication date: December 17, 2020
    Applicant: Yazaki Corporation
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Publication number: 20200395590
    Abstract: A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: conductor layers and protective layers to form a multiple-layered structure of wiring patterns; a band-shaped main strip to be located to extend in a stacking direction of cells; and a band-shaped branch strip branched from the main strip. The branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a connection portion disposed closer to an end of the branch strip than the bent portion and connected to the corresponding busbar. The bent portion has a thin-layer portion having a shape formed by removing, from the flexible circuit board, a part of the protective layers corresponding to a part of the conductor layers without being used as the wiring pattern in the branch strip.
    Type: Application
    Filed: May 13, 2020
    Publication date: December 17, 2020
    Applicant: Yazaki Corporation
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Publication number: 20200373541
    Abstract: A conductive module includes a plurality of conductive terminal connection components for electrical connection with an electrode terminal; a conductive component that electrically connects a battery cell and an electrical connection target; and an electrical connection structure for each terminal connection component that electrically connects the terminal connection component and the conductive component. The conductive component includes a conductor for each terminal connection component formed using a dissimilar metal material which is a different type from the terminal connection component. The electrical connection structure is formed using a similar metal material which is the same type as the conductor.
    Type: Application
    Filed: April 17, 2020
    Publication date: November 26, 2020
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Publication number: 20200365865
    Abstract: A bus bar module is used to be attached to a battery assembly having a plurality of unit battery cells stacked each other. The bus bar module includes bus bars each to be connected to each of the plurality of the unit battery cells; a heating body capable of heating the battery assembly; and a holder holding the bus bars and the heating body. The heating body is configured to be disposed between a pair of electrode portions of each of the plurality of the unit battery cells.
    Type: Application
    Filed: April 13, 2020
    Publication date: November 19, 2020
    Applicant: Yazaki Corporation
    Inventors: Tomoji Yasuda, Yoshiaki Ichikawa, Tatsuya Oga
  • Patent number: 10242768
    Abstract: A wire harness exterior member includes a flexible tube portion, an inflexible tube portion, and a post-attached part attached to a boundary between the flexible tube portion and the inflexible tube portion. The post-attached part is attached such that at least a portion of an attaching surface of a rigid attaching portion overlaps the flexible tube portion.
    Type: Grant
    Filed: January 2, 2015
    Date of Patent: March 26, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Shinichi Inao, Hideomi Adachi, Takeshi Ogue, Tatsuya Oga, Masaaki Suguro, Yoshiaki Ozaki, Hiroyuki Yoshida
  • Patent number: 9972418
    Abstract: An exterior member has an exterior member body having a base color, and an identification mark having an identification color different from the base color. The identification mark includes at least one of a plurality of line marks provided parallel to each other, and a line mark provided continuously and spirally.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: May 15, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Shinichi Inao, Hideomi Adachi, Takeshi Ogue, Tatsuya Oga, Masaaki Suguro, Yoshiaki Ozaki, Hiroyuki Yoshida
  • Patent number: 9947439
    Abstract: A wire harness includes at least one conductive path, and an exterior member that accommodates and protects the conductive path. The exterior member is a molded resin component made of a resin material which has a black color or a dark color close to the black color.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: April 17, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Shinichi Inao, Hideomi Adachi, Takeshi Ogue, Tatsuya Oga, Masaaki Suguro, Yoshiaki Ozaki, Hiroyuki Yoshida
  • Patent number: 9873391
    Abstract: A wire harness includes a conductive path. The conductive path includes a conductor and a sheath that covers the conductor. The sheath includes a first sheath part arranged correspondingly to a route restriction section where route restriction is required and a second sheath part arranged correspondingly to a different section other than the route restriction section. The first sheath part is formed thicker than the second sheath part, and the first sheath part has rigidity.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: January 23, 2018
    Assignee: Yazaki Corporation
    Inventors: Masaaki Suguro, Hideomi Adachi, Tatsuya Oga
  • Patent number: 9875824
    Abstract: A waterproofing structure includes one or multiple insulated core wires; a shielding member configured to collectively cover the one or multiple insulated core wires; a sheath provided on the outside of the shielding member; and a waterproofing member provided at a target part of waterproofing. The target part of waterproofing is positioned where a sheath end portion is formed by cutting away the sheath to a predetermined length, and the shielding member is exposed from the sheath end portion. The waterproofing member is shaped to include a bottomed cylindrical body including a bottom portion, and one or multiple tubular portions which open up the bottom portion and continue with an outer surface of the bottom portion.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: January 23, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Tatsuya Oga, Hidehiko Kuboshima, Hideomi Adachi
  • Patent number: 9868407
    Abstract: A wire harness has at least one electrically conducting path and an exterior member accommodating the electrically conducting path to protect the electrically conducting path. The exterior member has a heat reflecting portion provided at at least a portion of an outer surface of the exterior member to reflect external heat.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: January 16, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Shinichi Inao, Hideomi Adachi, Takeshi Ogue, Tatsuya Oga, Masaaki Suguro, Yoshiaki Ozaki, Hiroyuki Yoshida
  • Patent number: 9849846
    Abstract: A wire harness includes electrical wires and an outer covering member. The outer covering member includes tube portions different in cross-sectional shape and size and a guiding shape portion between adjacent tube portions. The guiding shape portion guides the electrical wires when inserted. A cap is provided to each one end of the electrical wires, and the electrical wires are passed through the guiding shape portion with the caps facing frontward. A wire harness and a method for inserting electric conductive paths through the wire harness can enhance workability related to the electrical conductive paths and an outer covering member while suiting the wire harness to the shapes and the usage environments.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: December 26, 2017
    Assignee: YAZAKI CORPORATION
    Inventor: Tatsuya Oga
  • Patent number: 9840211
    Abstract: A wire harness includes an electrical pathway and a pipe like exterior member that covers the electrical pathway. The exterior member includes a low rigidity portion which is flexible and a high rigidity portion which is unflexible and has a rigidity higher than the low rigidity portion, and the low rigidity portion and the high rigidity portion are successively arranged in an extending direction of the electrical pathway.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: December 12, 2017
    Assignee: YAZAKI CORPORATION
    Inventors: Takeshi Ogue, Hideomi Adachi, Shinichi Inao, Tatsuya Oga, Hiroyuki Yoshida, Masaaki Suguro