Abstract: The purpose of the present invention is to provide a device for optical frequency domain reflectometry and a method thereof that can measure a reflectance distribution with less spatial resolution degradation due to a phase noise, without using a wideband receiving system even when a long-distance measurement is performed.

Abstract: A semiconductor memory device includes two first electrode films, a first column and a second insulating film. The two first electrode films extend in a first direction and are separated from each other in a second direction. The first column is provided between the two first electrode films and has a plurality of first members and a plurality of insulating members. Each of the first members and each of the insulating members are arranged alternately in the first direction. One of the plurality of first members has a semiconductor pillar, a second electrode film and a first insulating film provided between the semiconductor pillar and the second electrode film. The semiconductor pillar, the first insulating film and the second electrode film are arranged in the second direction. The second insulating film is provided between the first column and one of the two first electrode films.

Abstract: To provide a curable resin composition of which a cured product has excellent heat-resistance and dielectric properties, and a cured product thereof, and a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor apparatus having both excellent heat resistance and dielectric properties. The invention has an indane scaffold represented by the following general formula (1): in formula (1), Ra's are each independently an alkyl group, an alkyloxy group or an alkylthio group, which has 1 to 10 carbon atoms, an aryl group, an aryloxy group or an arylthio group, which has 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group, and q represents an integer value of 0 to 4.

Abstract: A power cutoff device includes a relay unit including a switch having a connecting state to be electrically conductive and a cutoff state to be electrically non-conductive, a cutoff unit connected in series to the switch, a current detector configured to detect an object current flowing through the cutoff unit, and a controller configured to control the relay unit and the cutoff unit. The cutoff unit has a connecting state to be electrically conductive and an irreversible cutoff state to be electrically conductive. The controller is configured to obtain a changing rate of the object current with respect to time. The controller is configured to cause the switch to be in the connecting state and cause the cutoff unit to be in the connecting state if determining that the changing rate is not greater than a changing-rate threshold.

Abstract: A semiconductor memory device includes two first electrode films, a first column and a second insulating film. The two first electrode films extend in a first direction and are separated from each other in a second direction. The first column is provided between the two first electrode films and has a plurality of first members and a plurality of insulating members. Each of the first members and each of the insulating members are arranged alternately in the first direction. One of the plurality of first members has a semiconductor pillar, a second electrode film and a first insulating film provided between the semiconductor pillar and the second electrode film. The semiconductor pillar, the first insulating film and the second electrode film are arranged in the second direction. The second insulating film is provided between the first column and one of the two first electrode films.

Abstract: The purpose of the present invention is to provide a device for optical frequency domain reflectometry and a method thereof that can measure a reflectance distribution with less spatial resolution degradation due to a phase noise, without using a wideband receiving system even when a long-distance measurement is performed.

Abstract: An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

Abstract: It is an object of the present invention to provide an aerial optical fiber cable inspection method, an aerial optical fiber cable inspection device, and a program which can identify a cable sagging section from vibration sensing results. In the aerial optical fiber cable inspection method according to the present invention, a vibration distribution waveform along the longitudinal direction of an aerial optical fiber cable measured using an optical fiber vibration sensing device is received as an input, a standard deviation of the amplitude of vibration at each position in the vibration distribution waveform is calculated, and a section with a standard deviation larger than that of other sections is identified as a cable sagging section.

Abstract: An object is to provide an optical fiber route search method, an optical fiber route search device, and a program that can efficiently confirm a path of an optical fiber that is installed over a long distance or across a large range. The optical fiber route search method according to the present invention carries out optical measurement that performs distributed measurement of the state of an optical fiber while applying a disturbance to the optical fiber in a portion in which wires of the optical fiber are parallel to each other, branch out, or intersect with each other (a proximity portion), and determines that the position in which the number of singularities (peaks or intensity fluctuations) fluctuates (becomes plural) is the position of the proximity portion from a distribution diagram obtained through the optical measurement.

Abstract: A manhole position identification method of the present invention includes: measuring, from an end of an optical fiber, a temporal variation in scattering light from the optical fiber when an impact blow is applied to a cover of a manhole located on a path of the optical fiber, so as to obtain temporal variations in a scattering light intensity distribution in a longitudinal direction of the optical fiber; determining an occurrence of vibration due to the impact blow based on the temporal variations at positions in the scattering light intensity distribution, so as to identify an impact blow position on the optical fiber; and associating the impact blow position on the optical fiber with a map position of the manhole whose cover has received the impact blow, so as to identify a position of the manhole expressed in terms of optical fiber length from the end.

Abstract: A vibration distribution measurement system includes a frequency sweep light source that outputs frequency sweep light, an optical splitter that splits the frequency sweep light into probe light and local light, an optical mixer that mixes backscattered light from the sensing fiber as signal light with the local light, the backscattered light being obtained by causing the probe light to be incident on the sensing fiber, and an analysis unit that analyzes a beat signal obtained from output light of the optical mixer. The analysis unit estimates a distance offset from a measurement result obtained by measuring a distribution waveform of the signal light by measuring the beat signal at a measurement time sufficiently shorter than a cycle of the vibration of the sensing fiber, and measures a distribution of a vibration at any position by compensating for the distance offset.

Abstract: Provided are a curable composition capable of both exhibiting a low shrinkage percentage during curing and forming a cured product having a low elastic modulus under high temperature conditions, a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition. The curable composition includes an active ester compound (A) that is an esterification product of a phenolic compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and a curing agent. Also provided are a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition.

Abstract: A semiconductor device includes a first semiconductor layer that is an electrically-conductive polycrystalline semiconductor layer and a second semiconductor layer on the first semiconductor layer. The second semiconductor layer is an electrically-conductive polycrystalline semiconductor layer having a smaller average grain size than the first semiconductor layer. A plurality of electrode layers are stacked on the second semiconductor layer at intervals in a first direction. A third semiconductor layer extends in the first direction through the first semiconductor layer, the second semiconductor layer, and each of the electrode layers and contacts the second semiconductor layer. A charge storage layer is between the plurality of electrode layers and the third semiconductor layer.

Abstract: A semiconductor memory device includes two first electrode films, a first column and a second insulating film. The two first electrode films extend in a first direction and are separated from each other in a second direction. The first column is provided between the two first electrode films and has a plurality of first members and a plurality of insulating members. Each of the first members and each of the insulating members are arranged alternately in the first direction. One of the plurality of first members has a semiconductor pillar, a second electrode film and a first insulating film provided between the semiconductor pillar and the second electrode film. The semiconductor pillar, the first insulating film and the second electrode film are arranged in the second direction. The second insulating film is provided between the first column and one of the two first electrode films.

Abstract: Provided are an active ester composition capable of exhibiting high curability and forming a cured product with various excellent properties such as low dielectric properties, a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition. The active ester composition includes, as essential components, an active ester compound (A) and a phenolic hydroxyl group-containing compound (B), in which the active ester compound (A) is an esterification product of a compound having one phenolic hydroxyl group in the molecular structure (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2). Also provided are a cured product thereof, and a semiconductor encapsulating material and a printed wiring board which are obtained using the active ester composition.

Abstract: A semiconductor memory device includes two first electrode films, a first column and a second insulating film. The two first electrode films extend in a first direction and are separated from each other in a second direction. The first column is provided between the two first electrode films and has a plurality of first members and a plurality of insulating members. Each of the first members and each of the insulating members are arranged alternately in the first direction. One of the plurality of first members has a semiconductor pillar, a second electrode film and a first insulating film provided between the semiconductor pillar and the second electrode film. The semiconductor pillar, the first insulating film and the second electrode film are arranged in the second direction. The second insulating film is provided between the first column and one of the two first electrode films.

Abstract: Provided are an active ester resin capable of having low cure shrinkage and forming a cured product having a low dielectric loss tangent, a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material. The active ester resin includes a product of reaction of essential raw materials including: a phenolic hydroxyl group-containing compound (A); a polynaphthol resin (B) having a molecular structure in which naphthol compound (b) moieties are linked with an aromatic ring- or cyclo ring-containing structural moiety (?); and an aromatic polycarboxylic acid or an acid halide thereof (C). Also provided are a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material.

Abstract: An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

Abstract: A semiconductor device includes a first semiconductor layer that is an electrically-conductive polycrystalline semiconductor layer and a second semiconductor layer on the first semiconductor layer. The second semiconductor layer is an electrically-conductive polycrystalline semiconductor layer having a smaller average grain size than the first semiconductor layer. A plurality of electrode layers are stacked on the second semiconductor layer at intervals in a first direction. A third semiconductor layer extends in the first direction through the first semiconductor layer, the second semiconductor layer, and each of the electrode layers and contacts the second semiconductor layer. A charge storage layer is between the plurality of electrode layers and the third semiconductor layer.

Abstract: A control unit makes a connection state between a connection device connected to a connection management device and an electronic device when a determination unit determines that identification information of the connection device connected to the connection management device has been registered in a connection work plan and a connection history of a connection order preceding a connection order of the connection device is “connected”, and does not make the connection state between the connection device connected to the connection management device and the electronic device when it is determined that the connection history of the connection order preceding the connection order of the connection device is “unconnected”.