Abstract: A multi-channel payment method for a multi-channel payment system comprises the payer or the payee who initiated the payment request logs in to the multi-channel payment system; the payer or the payee who initiated the payment request placing an order in the multi-channel payment system, wherein the order comprises a designated payment gateway; the multi-channel payment system determining a predicted fee of the order according to the designated payment gateway, past order records, and a real-time exchange rate; the multi-channel payment system performing an anti-money laundering verification of the order; the payer reviewing the order and the predicted fee through a multiple auditing method; and the multi-channel payment system executing payment from the payer to the payee according to the order and the designated payment gateway, and storing a payment detail of the order.

Abstract: In accordance with embodiments, a memory array is formed with a multiple patterning process. In embodiments a first trench is formed within a multiple layer stack and a first conductive material is deposited into the first trench. After the depositing the first conductive material, a second trench is formed within the multiple layer stack, and a second conductive material is deposited into the second trench. The first conductive material and the second conductive material are etched.

Abstract: A method includes depositing a dielectric cap over a gate structure. A source/drain contact is formed over a source/drain region adjacent to the gate structure. A top of the dielectric cap is oxidized. After oxidizing the top of the dielectric cap, an etch stop layer is deposited over the dielectric cap and an interlayer dielectric (ILD) layer over the etch stop layer. The ILD layer and the etch stop layer are etched to form a via opening extending though the ILD layer and the etch stop layer. A source/drain via is filled in the via opening.

Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: One or more embodiments of the present description provide a method and device for risk prediction of thermal runaway in LIB. The method includes: acquiring knowledge of a mechanism for thermal runaway in LIB; describing an evolution process of thermal runaway in LIB by adopting a fault tree; mapping a fault tree structure to a dynamic Bayesian network model for thermal runaway in LIB to obtain quantitative results of a risk of thermal runaway in LIB; and taking the quantitative results of a dynamic Bayesian network as inputs of a machine learning model to obtain prediction results of the risk of thermal runaway. By using the method in the present embodiment, an evolution trend of battery thermal runaway can be predicted by fusing multiple thermal runaway causes and multi-source data, and thus, the prediction results are relatively accurate.

Abstract: A method for forming a DRAM includes forming a bit line contact over the active area, forming a bit line over the bit line contact, and forming a hard mask layer over the bit line. The method includes forming a semiconductor material layer over the active area and forming a metal layer over the semiconductor material layer and the hard mask layer. The method includes removing the metal layer over the hard mask layer and exposing the top surface of the hard mask layer, and the remaining portion of the metal layer is between hard mask layers. The method includes removing a portion of the hard mask layer after exposing a portion of the hard mask layer. The method includes forming a capacitor contact conductive layer over the remaining portion of the metal layer after removing the portion of the hard mask layer.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A front light module includes a reflective display device, a front light guide, and a light emitting unit plate. The front light guide plate includes a micro-structure. The micro-structure has a first angle between a surface thereof close to the light emitting unit and an upper surface of the front light guide plate. The micro-structure has a second angle between a surface thereof away from the light emitting unit and the upper surface of the front light guide plate. The micro-structure has a third angle between the surface thereof close to the light emitting unit and the surface thereof away from the light emitting unit. The first angle is within a range between 30 degrees and 60 degrees, the second angle is within a range between 30 degrees and 59 degrees, and the third angle is greater than 90 degrees.

Abstract: A method comprises forming a gate dielectric cap over a gate structure; forming source/drain contacts over the semiconductor substrate, with the gate dielectric cap laterally between the source/drain contacts; depositing an etch-resistant layer over the gate dielectric cap; depositing a contact etch stop layer over the etch-resistant layer and an interlayer dielectric (ILD) layer over the contact etch stop layer; performing a first etching process to form a via opening extending through the ILD layer and terminating prior to reaching the etch-resistant layer; performing a second etching process to deepen the via opening such that one of the source/drain contacts is exposed, wherein the second etching process etches the etch-resistant layer at a slower etch rate than etching the contact etch stop layer; and depositing a metal material to fill the deepened via opening.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.

Abstract: A method for performing memory access of a Flash cell of a Flash memory includes: performing a series of sensing operations respectively corresponding to a plurality of sensing voltages, wherein a sensing voltage of a specific sensing operation of the series of sensing operations has a sensing voltage determined according to a result of an initial sensing operation of the series of sensing operations; determining a threshold voltage of the Flash cell according to at least a digital value generated by the series of sensing operations; and using the determined threshold voltage to perform soft decoding of the Flash cell.

Abstract: A method and system for detecting the location of a surface defect on a transparent film with respect to whether the surface defect is at a front or back surface of the film. By illuminating the surface defect with a light source from an oblique angle and capturing an image of the surface defect using a camera which is positioned along an axis where the light illuminates after unobstructedly reflected from the test surface of the film, and using the reflected light, an image of the surface defect is obtained. A computer executes an evaluation logic to determine whether the image of the defect contains any dark area. If there is a dark area present, the defect is judged to be on the front surface of the film. If there is no dark area present, the defect is judged to be on the back surface of the film.

Abstract: A clock and data recovery circuit includes a sampling circuit, a phase detector, a first processing circuit, a second processing circuit and an oscillator circuit. The sampling circuit is configured to sample input data according to an output clock, and generate a sampling result. The phase detector is configured to generate a detection result according to the sampling result. The first processing circuit is configured to process the sampling result to generate a first digital code. The second processing circuit is configured to accumulate a portion of the first digital code to generate a second digital code. A rate of change of a code value of the second digital code is slower than a rate of change of a code value of the first digital code. The oscillator circuit is configured to generate the output clock according to the detection result, the first digital code and the second digital code.

Abstract: This document relates to employing tongue gestures to control a computing device, and training machine learning models to detect tongue gestures. One example relates to a method or technique that can include receiving one or more motion signals from an inertial sensor. The method or technique can also include detecting a tongue gesture based at least on the one or more motion signals, and outputting the tongue gesture.

Abstract: A partitioning method for partitioning a group of power-ground (PG) cells is disclosed. The method includes: placing at least one out-boundary PG cell on a substrate, wherein power strips of the at least one out-boundary PG cell are aligned with corresponding power rails on the substrate; and placing at least one in-boundary PG cell on the substrate, wherein power strips of the at least one in-boundary PG cell are aligned with corresponding power rails on the substrate.

Abstract: A detection method and system for inspecting a defect on a semi-reflective film by way of different light sources illuminated on the semi-reflective film along the same axis. More specifically, a P-polarized light source and an S-polarized light source are used to illuminate the defect on the semi-reflective film, with an illumination direction that is between 5-45 degrees relative to the semi-reflective film. A camera module captures an image to be inspected through the phenomenon that the P-polarized light will partially pass through the semi-reflective film, and the S-polarized light will be almost completely reflected by the semi-reflective film. During the detection, the defect is determined to be located on the front surface of the semi-reflective film when the S-polarized light is present in the image, and the defect is determined to be located on the back surface of the semi-reflective film when the P-polarized light is present in the image and no S-polarized light has entered the camera module.

Abstract: A mobile device includes a housing, a first radiation element, a second radiation element, a third radiation element, a first switch element, and a second switch element. The first radiation element has a first feeding point. The second radiation element has a second feeding point. The first radiation element, the second radiation element, and the third radiation element are distributed over the housing. The first switch element is closed or open, so as to selectively couple the first radiation element to the third radiation element. The second switch element is closed or open, so as to selectively couple the second radiation element to the third radiation element. An antenna structure is formed by the first radiation element, the second radiation element, and the third radiation element.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A front light module includes a reflective display device, a front light guide, and a light emitting unit plate. The front light guide plate includes a micro-structure. The micro-structure has a first angle between a surface thereof close to the light emitting unit and an upper surface of the front light guide plate. The micro-structure has a second angle between a surface thereof away from the light emitting unit and the upper surface of the front light guide plate. The micro-structure has a third angle between the surface thereof close to the light emitting unit and the surface thereof away from the light emitting unit. The first angle is within a range between 30 degrees and 60 degrees, the second angle is within a range between 30 degrees and 59 degrees, and the third angle is greater than 90 degrees.