Abstract: An electrical receptacle connector includes a metallic shell, a terminal module in the metallic shell, a baffle plate at a rear portion of the metallic shell, and conductive ground legs. Accordingly, the baffle plate is at the rear portion of the metallic shell, and the conductive ground legs are at two sides of the metallic shell. Therefore, during the connector transmits data, the produced noises are shielded by the baffle plate, and the current formed by the noises is guided to a circuit board through the conductive ground legs, thus the noises are grounded and diminished. The conductive ground legs are adjacent to the baffle plate. Hence, the current flowing through the baffle plate is guided to the circuit board through the conductive ground legs, with a shorter path. Therefore, the current would not have antenna effect easily on the path, and the noise spreading can be reduced.

Abstract: The present invention provides pad arrangements, termination circuits, clock/data recovery circuits, and deserialization architecture for a physical layer circuitry including a four-signal or six-signal physical medium attachment sublayer (PMA).

Abstract: An electrical receptacle connector includes a metallic shell, a terminal module in the metallic shell, a baffle plate at a rear portion of the metallic shell, and conductive ground legs. Accordingly, the baffle plate is at the rear portion of the metallic shell, and the conductive ground legs are at two sides of the metallic shell. Therefore, during the connector transmits data, the produced noises are shielded by the baffle plate, and the current formed by the noises is guided to a circuit board through the conductive ground legs, thus the noises are grounded and diminished. The conductive ground legs are adjacent to the baffle plate. Hence, the current flowing through the baffle plate is guided to the circuit board through the conductive ground legs, with a shorter path. Therefore, the current would not have antenna effect easily on the path, and the noise spreading can be reduced.

Abstract: A semiconductor package structure including an encapsulating layer, a package substrate, and a conductive shielding layer is provided. The package substrate has a device region covered by the encapsulating layer and an edge region surrounding the device region and exposed from the encapsulating layer. The package substrate includes an insulating layer and a patterned conductive layer in a level of the insulating layer. The patterned conductive layer includes conductors in and along the edge region. The edge region is partially exposed from the conductors, as viewed from a top-view perspective. The conductive shielding layer covers and surrounds the encapsulating layer and is electrically connected to the conductors.

Abstract: The present invention provides pad arrangements, termination circuits, clock/data recovery circuits, and deserialization architecture for a physical layer circuitry including a four-signal or six-signal physical medium attachment sublayer (PMA).

Abstract: A package includes a first dielectric layer, a device die over and attached to the first dielectric layer, an active through-via and a dummy through-via, and an encapsulating material encapsulating the device die, the active through-via, and the dummy through-via. The package further includes a second dielectric layer over and contacting the device die, the active through-via, and the dummy through-via. An active metal cap is over and contacting the second dielectric layer and electrically coupling to the active through-via. The active metal cap overlaps the active through-via. A dummy metal cap is over and contacting the second dielectric layer. The dummy metal cap overlaps the dummy through-via. The dummy metal cap is separated into a first portion and a second portion by a gap. A redistribution line passes through the gap between the first portion and the second portion of the dummy metal cap.

Abstract: Methods and systems of indoor positioning of a user and delivery of information thereto are described. A system may include a communication device and a plurality of networked devices. The communication device may receive incoming information which is intended for receipt by a user, and transmit a request signal responsive to the receiving of the incoming information. Each of the networked devices may receive the request signal, and determine which one of the networked devices is situated to notify the user of the incoming information. The networked device situated to notify the user may proceed to notify the user of the incoming information.

Abstract: A transmission cable including a signal wire and a shielding layer is provided. The signal wire is configured to transmit a differential signal provided by an eDP interface or a V-by-one interface. The shielding layer is configured to cover the signal wire. An end of the signal wire receives the differential signal provided by the eDP interface or the V-by-one interface, and another end of the signal wire outputs the differential signal provided by the eDP interface or the V-by-one interface. In addition, a display system is also provided.

Abstract: A circuit in a physical unit (PHY) is disclosed, the circuit comprising two trios and a combo wire therebetween, wherein each of said trios includes three wires, and wherein said combo wire is configurable as a signal, floating, or any dc voltage, furthermore, a Quad-IO block is designed for transmit data in two D-PHY lanes with the combo wire configured as a signal wire or a C-PHY trio with the combo wire configured as a shielding wire, such that the same Quad-IO block can be instantiated multiple times in a physical unit for meeting different bandwidth requirements as well as for placing pads along a same direction for preventing performance difference between D-PHY lanes or C-PHY trios.

Abstract: A semiconductor package includes a carrier substrate having a top surface, a semiconductor die mounted on the top surface, a plurality of bonding wires connecting the semiconductor die to the carrier substrate, an insulating material coated on the bonding wires, and a molding compound covering the top surface and encapsulating the semiconductor die, the plurality of bonding wires, and the insulating material.

Abstract: An electrical connector is provided, including a plastic core having a frame and at least one partition plate integrally formed with the frame for defining a plurality of recesses, a first connector received in one of the recesses, and a second connector received in another one of the recesses. As such, the instant disclosure only needs to solder the electrical connector to a circuit board of an electronic product so as for the electronic product to obtain a plurality of connector ports, thus greatly reducing the fabrication time.

Abstract: A storage can includes a can having a restriction portion extending inward from the inner periphery of the can. The restriction portion includes multiple blocks extending from a top thereof and a gap is formed between any two adjacent blocks. A base is removably inserted into the can and has multiple first protrusions. Multiple holes are defined through the inner bottom of the base and located alternatively between the first protrusions. A mounting member is rotatably mounted to the top of the base and has multiple second protrusions which are located alternatively to the first protrusions when the mounting member is mounted to the top of the base. Food is ground between the first and second protrusions by rotating the mounting member, and the ground food drops through the holes and is received in the can. A cap is mounted to the can and has a sealing member.

Abstract: A package includes a first dielectric layer, a device die over and attached to the first dielectric layer, an active through-via and a dummy through-via, and an encapsulating material encapsulating the device die, the active through-via, and the dummy through-via. The package further includes a second dielectric layer over and contacting the device die, the active through-via, and the dummy through-via. An active metal cap is over and contacting the second dielectric layer and electrically coupling to the active through-via. The active metal cap overlaps the active through-via. A dummy metal cap is over and contacting the second dielectric layer. The dummy metal cap overlaps the dummy through-via. The dummy metal cap is separated into a first portion and a second portion by a gap. A redistribution line passes through the gap between the first portion and the second portion of the dummy metal cap.

Abstract: A method of correcting a layout pattern is provided in the present invention. The method includes the following steps. A layout pattern including at least two adjacent rectangular sub patterns is provided. The layout pattern is then input into a computer system. An optical proximity correction including a bevel correction is then performed. The bevel correction includes forming a bevel at a corner of at least one of the two adjacent rectangular sub patterns, wherein the bevel is formed by chopping the corner, and moving the bevel toward an interaction of two neighboring segments of the bevel if a distance between the bevel and the other rectangular sub pattern is larger than a minimum value. The angle between a surface of the bevel and a surface of the rectangular sub pattern is not rectangular. The layout pattern is output to a mask after the optical proximity correction.

Abstract: A white LED chip includes a P-type layer, a tunneling structure, an N-type layer, an N-type electrode, and a P-type electrode. The tunneling structure is disposed over the P-type layer. The tunneling structure includes a first barrier layer, an active layer and a second barrier layer. The first barrier layer includes a first material layer, the active layer includes a second material layer, and the second barrier layer includes a third material layer. The N-type layer is disposed over the tunneling structure. An energy gap of the second material layer is lower than an energy gap of the first material layer and an energy gap of the third material layer. Each of the first material layer, the second material layer and the third material layer is a metal oxide layer, a metal nitride layer or a metal oxynitride layer.

Abstract: An operating method for controlling a wearable electronic device is provided. The operating method obtains an environmental variable (which is indicative of the current environment) and determines an appearance variable (e.g., a user's favorite color) based on the environment variable, by referring to information about different appearances predetermined to be suitable for different environmental conditions. The operating method also generates a control signal for adjusting the appearance of at least one non-panel region of the wearable electronic device based on the appearance variable. This causes the adjusted appearance of the non-panel region of the wearable electronic device to change based on the current environment.

Abstract: A phone number switching method and an associated apparatus are provided, where the phone number switching method may be applied to a first electronic device. For example, the phone number switching method may include the steps of: determining whether a predetermined activity corresponding to both of the first electronic device and a second electronic device occurs, to generate a determination result; and according to the determination result, selectively sending a switching request from the first electronic device to a service provider, wherein a phone number is previously associated to a first subscriber identity module (SIM) within the first electronic device by the service provider, and the switching request asks for re-associating the phone number to a second SIM within the second electronic device.

Abstract: A semiconductor chip package includes a substrate; a semiconductor die mounted on the substrate, wherein the semiconductor die comprises a bond pad disposed on an active surface of the semiconductor die, and a passivation layer covering perimeter of the bond pad, wherein a bond pad opening in the passivation layer exposes a central area of the bond pad; a conductive paste post printed on the exposed central area of the bond pad; and a bonding wire secured to a top surface of the conductive paste post. The conductive paste post comprises copper paste.

Abstract: An airtight container, comprises a container body, a lid member covering the container body, a sieve disposed on the container body and facing the lid member, and a seal control member movable disposed in a channel of the lid member, operable sealing an opening on the channel of the lid member. Wherein the opening is uncovered when pressing the control member, and covering the lid member on the container body such that forming the negative air pressure in the container after releasing the button.

Abstract: Methods and systems of an intelligent nanny assistant are described. A method may involve periodically or continuously receiving image-related data from a monitoring system that monitors an environment. The method may also involve determining a subject in the environment as a subject of concern and determining a range of sight of the subject of concern. The method may further involve retrieving information related to one or more objects of interest of the subject of concern. The method may involve controlling one or more devices in the environment to provide the information in a way that attracts the subject of concern to move away from a predefined area of the environment.