Abstract: Provided are a conductive fabric and a manufacturing method thereof. The conductive fabric has a structure in which warp yarns and weft yarns are interwoven with each other, wherein at least one of the warp yarns and the weft yarns includes carbon nanotube fibers, the carbon nanotube fibers contain N-doped carbon nanotubes, the nitrogen content in each of the carbon nanotube fibers is between 1 wt% to 5 wt% based on the total weight of the carbon nanotube fiber, and the content of the N-doped carbon nanotubes in the conductive fabric is at least 0.1 wt% based on the total weight of the conductive fabric.

Abstract: Provided are a flame retardant fabric and a manufacturing method thereof. The flame retardant fabric has a structure in which warp yarns and weft yarns are interwoven with each other, wherein at least one of the warp yarns and the weft yarns includes carbon nanotube fibers, and the content of carbon nanotubes in the flame retardant fabric is at least 0.02 wt. % based on the total weight of the flame retardant fabric.

Abstract: Provided are a hydrophilic fabric and a manufacturing method thereof. The hydrophilic fabric has a structure in which warp yarns and weft yarns are interwoven with each other, wherein at least one of the warp yarns and the weft yarns includes carbon nanotube fibers, the carbon nanotube fibers contain N-doped carbon nanotubes, the nitrogen content in each of the N-doped carbon nanotubes is between 1 at. % and 10 at. %, and the content of the N-doped carbon nanotubes in the hydrophilic fabric is at least 1 wt. % based on the total weight of the hydrophilic fabric.

Abstract: A fabric with carbon nanotube fibers is provided. The fabric has a structure in which warp yarns and weft yarns are interwoven with each other, wherein at least one of the warp yarns and the weft yarns includes carbon nanotube fibers.

Abstract: A manufacturing method of a fabric with carbon nanotube fibers is provided. The method includes the following steps. Carbon nanotubes are grown on a substrate. A drawing processing is performed on the carbon nanotubes to form carbon nanotube fibers. A spinning processing is performed on the carbon nanotube fibers to form carbon nanotube fiber yarns. A weaving process is performed on the carbon nanotube fiber yarns.

Abstract: A transistor structure disposed on a substrate includes a gate electrode, an organic semiconductor layer, a gate insulation layer and a patterned metal layer. The gate insulation layer is disposed between the gate and the organic semiconductor layer. The patterned metal layer has a conductive oxidation surface and is divided into a source electrode and a drain electrode. A portion of the organic semiconductor layer is exposed between the source electrode and the drain electrode. The conductive oxidation surface directly contacts with the organic semiconductor layer.

Abstract: A display panel having a wireless charging function is provided, and the display panel includes a first substrate, an induction coil layer, a display pixel layer, and a second substrate. The induction coil layer is disposed on the first substrate. The induction coil layer includes at least one induction coil. The induction coil layer is adapted for collaborating with a wireless charging power supply, such that the induction coil layer executes the wireless charging function. The display pixel layer is disposed on the induction coil layer. The second substrate is disposed on the display pixel layer.

Abstract: Disclosed herein is a method for manufacturing an array substrate. The method includes forming a source electrode and a drain electrode on a substrate. A semiconductor layer, an organic insulating layer, and a gate electrode layer are sequentially formed to cover the substrate, the source electrode, and the drain electrode. A patterned photoresist layer is formed on the gate electrode layer. The exposed portion of the gate electrode layer, and a portion of the organic insulative layer and a portion of the semiconductor layer thereunder are removed to form a gate electrode. An organic passivation layer is formed on the gate electrode, the source electrode, and the drain electrode. The organic passivation layer has a contact window to expose a portion of the drain electrode. A pixel electrode is formed on the organic passivation layer and the exposed portion of the drain electrode.

Abstract: A metal oxide semiconductor structure, the structure including: a substrate; a gate electrode, deposited on the substrate; a gate insulation layer, deposited over the gate electrode and the substrate; an IGZO layer, deposited on the gate insulation layer and functioning as a channel; a source electrode, deposited on the gate insulation layer and being at one side of the IGZO layer; a drain electrode, deposited on the gate insulation layer and being at another side of the IGZO layer; a first passivation layer, deposited over the source electrode, the IGZO layer, and the drain electrode; a second passivation layer, deposited over the first passivation layer; and an opaque resin layer, deposited over the source electrode, the second passivation layer, and the drain electrode.

Abstract: A vertical transistor and a manufacturing method thereof are provided herein. The manufacturing method includes forming a first patterned conductive layer on a substrate; forming a patterned metal oxide layer on the first patterned conductive layer, in which the patterned metal oxide layer includes a first patterned insulator layer, a second patterned insulator layer, and a second patterned conductive layer; forming a semiconductor layer; and forming a third patterned conductive layer. The first patterned insulator layer, the second patterned insulator layer, and the second patterned conductive layer are made by using a single metal oxide material. The oxygen concentration of the second patterned conductive layer is different from the oxygen concentrations of the first patterned insulator layer and the second patterned insulator layer.

Abstract: Disclosed herein is a method for manufacturing an array substrate. The method includes forming a source electrode and a drain electrode on a substrate. A semiconductor layer, an organic insulating layer, and a gate electrode layer are sequentially formed to cover the substrate, the source electrode, and the drain electrode. A patterned photoresist layer is formed on the gate electrode layer. The exposed portion of the gate electrode layer, and a portion of the organic insulative layer and a portion of the semiconductor layer thereunder are removed to form a gate electrode. An organic passivation layer is formed on the gate electrode, the source electrode, and the drain electrode. The organic passivation layer has a contact window to expose a portion of the drain electrode. A pixel electrode is formed on the organic passivation layer and the exposed portion of the drain electrode.

Abstract: An organic light-emitting diode display device includes a substrate, a light-absorption layer, an active array structure, and an organic light-emitting diode. The substrate has a first and a second surface opposite to each other. The light-absorption layer is disposed on the first surface, and has at least one opening exposing a portion of the first surface. The active array structure is positioned on the second surface, and includes at least one data line, at least one gate line, and at least one switching device electrically connected to the gate and data lines. The light-absorption layer overlaps at least one of the data line and the gate line when viewed in a direction perpendicular to the substrate. The organic light-emitting diode is electrically connected to the switching device, and the organic light-emitting diode overlaps the opening when viewed in the direction perpendicular to the substrate.

Abstract: A thin file transistor includes a gate electrode, a source electrode, a drain electrode, a gate-insulating layer, and an oxide semiconductor layer. The oxide semiconductor layer includes indium-gallium-zinc oxide with a formula of InxGayZnzOw, in which x, y and z satisfy the following formulas 1.5?(y/x)?2 and 1.5?(y/z)?2. The gate-insulating layer is positioned between the gate electrode and the oxide semiconductor layer. The source electrode and the drain electrode are respectively connected to two different sides of the oxide semiconductor layer.

Abstract: A semiconductor structure includes a top gate, an oxide semiconductor channel layer, a first dielectric layer, a second dielectric layer, a source and a drain. The oxide semiconductor channel layer is disposed between the top gate and a substrate. The first dielectric layer is disposed between the top gate and the oxide semiconductor channel layer. The second dielectric layer is disposed between the first dielectric layer and the oxide semiconductor channel layer. The source and the drain are disposed on two opposite sides of the oxide semiconductor channel layer and located between the first dielectric layer and the substrate. A portion of the oxide semiconductor channel layer is exposed between the source and the drain. A portion of the first dielectric layer and a portion of the second dielectric layer directly contact with and entirely cover the portion of the oxide semiconductor channel layer.

Abstract: A thin film transistor is disclosed. The drain and source electrode layer of the thin film transistor is disposed on the substrate, in which the drain and source electrode layer is divided into a drain region and a source region. The semiconductor layer and the first insulating layer are disposed on the drain and source electrode layer, in which the first insulating layer has an upper limit of thickness. The second insulating layer is disposed on the semiconductor layer and the first insulating layer, in which the second insulating layer has a lower limit of thickness. The gate electrode layer is disposed on the second insulating layer. The passivation layer is disposed on the gate electrode layer, and the pixel electrode layer is disposed on the passivation layer.

Abstract: An active device circuit substrate includes a substrate, a plurality of active devices, and a first planarization layer. Each active device includes a gate electrode, a channel layer stacked with the gate electrode, a source electrode, and a drain electrode. The source electrode and the drain electrode are disposed on the channel layer and located on opposite sides of the channel layer to define a channel area of the channel layer. The active devices include a first active device and a second active device. The first active device is disposed between the first planarization layer and the substrate, and the first planarization layer is disposed between the first active device and the second active device. A minimum linear distance between the channel area of the first active device and the channel area of the second active device along a direction parallel to the substrate is not smaller than 5 ?m.

Abstract: A capacitor structure of capacitive touch panel including a first electrode layer, a first material layer, a second material layer and a second electrode layer is provided. The first material layer is disposed on the first electrode layer, and the material of the first material layer is selected from one of a semiconductor material and an insulating material. The second material layer is disposed on the first material layer, and the material of the second material layer is selected from another one of the semiconductor material and the insulating material. The second electrode layer is disposed on the second material layer.

Abstract: A threshold voltage sensing circuit applied in a display panel includes a first sensor and a second sensor. The first sensor positioned in the display panel receives an operation signal at a regular time point after start-up and continuously receives multiple driving signals which are the same as those received by the pixel circuits of the display panel and outputs a first output voltage accordingly. The second sensor positioned in the display panel receives the driving signals at a regular time point after start-up and outputs a second output voltage accordingly. When the voltage difference between the first output voltage and the second output voltage is beyond a variation standard, the low level of the gate voltage of the pixel circuit is adjusted.

Abstract: A reflective display device includes a drive array substrate, an electrophoretic display film, a reflective optical film and a light source module. The electrophoretic display film is disposed on the drive array substrate and includes a plurality of display mediums. The reflective optical film is disposed on the electrophoretic display film. The light source module is disposed beside the reflective optical film. A light emitting from the light source module is reflected to the electrophoretic display film by the reflective optical film. The light source module includes a plurality of first-color light sources, a plurality of second-color light sources and a plurality of third-color light sources which are switched on in sequence. The reflective display device is in a color display mode when the light source module is turned on. The reflective display device is in a monochrome display mode when the light source module is turned off.

Abstract: A thin film transistor (TFT) structure includes a metal oxide semiconductor layer, a gate, a source, a drain, a gate insulation layer, and a passivation layer. The metal oxide semiconductor layer has a crystalline surface which is constituted by a plurality of grains separated from one another. An indium content of the grains accounts for at least 50% of all metal elements of the crystalline surface of the metal oxide semiconductor layer. The gate is disposed on one side of the metal oxide semiconductor layer. The source and the drain are disposed on the other side of the metal oxide semiconductor layer. The gate insulation layer is disposed between the gate and the metal oxide semiconductor layer. The passivation layer is disposed on the gate insulation layer, and the crystalline surface of the metal oxide semiconductor layer is in direct contact with the gate insulation layer or the passivation layer.