Patents by Inventor Telesphor Kamgaing

Telesphor Kamgaing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210358872
    Abstract: Semiconductor packages having a die electrically connected to an antenna by a coaxial interconnect are described. In an example, a semiconductor package includes a molded layer between a first antenna patch and a second antenna patch of the antenna. The first patch may be electrically connected to the coaxial interconnect, and the second patch may be mounted on the molded layer. The molded layer may be formed from a molding compound, and may have a stiffness to resist warpage during fabrication and use of the semiconductor package.
    Type: Application
    Filed: July 28, 2021
    Publication date: November 18, 2021
    Inventors: Srinivas V. PIETAMBARAM, Rahul N. MANEPALLI, Kristof Kuwawi DARMAWIKARTA, Robert Alan MAY, Aleksandar ALEKSOV, Telesphor KAMGAING
  • Patent number: 11165129
    Abstract: Embodiments of the invention include a dispersion reduced dielectric waveguide and methods of forming such devices. In an embodiment, the dispersion reduced dielectric waveguide may include a first dielectric material that has a first Dk-value, and a second dielectric material that has a second Dk-value that is greater than the first Dk-value. In an embodiment, the dispersion reduced dielectric waveguide may also include a conductive layer formed around the first and second dielectric materials. According to an embodiment, a first portion of a bandwidth of a signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the first dielectric material, and a second portion of a bandwidth of the signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the second dielectric material.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: November 2, 2021
    Assignee: Intel Corporation
    Inventors: Georgios Dogiamis, Sasha Oster, Telesphor Kamgaing
  • Patent number: 11158917
    Abstract: Embodiments may relate to an assembly that includes a first package substrate with a first electromagnetic cavity. The assembly may further include a second package substrate with a second electromagnetic cavity that is adjacent to the first electromagnetic cavity. The first and second electromagnetic cavities may form a millimeter wave (mmWave) resonant cavity of a mmWave filter. Other embodiments may be described or claimed.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: October 26, 2021
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Feras Eid, Johanna M. Swan
  • Patent number: 11140723
    Abstract: A patch on interposer (PoINT) package is described with a wireless communications interface. Some examples include an interposer, a main patch attached to the interposer, a main integrated circuit die attached to the patch, a second patch attached to the interposer, and a millimeter wave radio die attached to the second patch and coupled to the main integrated circuit die through the interposer to communicate data between the main die and an external component.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventor: Telesphor Kamgaing
  • Publication number: 20210296175
    Abstract: Disclosed herein are methods to fabricate inorganic dies with organic interconnect layers and related structures and devices. In some embodiments, an integrated circuit (IC) structure may be formed to include an inorganic die and one or more organic interconnect layers on the inorganic die, wherein the organic interconnect layers include an organic dielectric. An example method includes forming organic interconnect layers over an inorganic interconnect substrate and forming passive components in the organic interconnect layer. The organic interconnect layers comprise a plurality of conductive metal layers through an organic dielectric material. The plurality of conductive metal layers comprises electrical pathways. the passive components are electrically coupled to the electrical pathways.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Applicant: Intel Corporation
    Inventors: Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan
  • Patent number: 11107781
    Abstract: Semiconductor packages having a die electrically connected to an antenna by a coaxial interconnect are described. In an example, a semiconductor package includes a molded layer between a first antenna patch and a second antenna patch of the antenna. The first patch may be electrically connected to the coaxial interconnect, and the second patch may be mounted on the molded layer. The molded layer may be formed from a molding compound, and may have a stiffness to resist warpage during fabrication and use of the semiconductor package.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Srinivas V. Pietambaram, Rahul N. Manepalli, Kristof Kuwawi Darmawikarta, Robert Alan May, Aleksandar Aleksov, Telesphor Kamgaing
  • Patent number: 11109428
    Abstract: A blade computing system is described with a wireless communication between blades. In one embodiment, the system includes a first blade in the enclosure having a radio transceiver to communicate with a radio transceiver of a second blade in the enclosure. The second blade has a radio transceiver to communicate with the radio transceiver of the first blade. A switch in the enclosure communicates with the first blade and the second blade and establishes a connection through the respective radio transceivers between the first blade and the second blade.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Rahul Khanna
  • Patent number: 11108433
    Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, wherein the transceiver is configured to generate a single side band (SSB) signal for communication over a waveguide and a waveguide interconnect to communicate the SSB signal over the waveguide. In an example, an SSB operator is configured to generate the SSB signal and the SSB signal can be generated by use of a finite-impulse response filter. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Henning Braunisch, Georgios Dogiamis, Jeff C. Morriss, Hyung-Jin Lee, Richard Dischler, Ajay Balankutty, Telesphor Kamgaing, Said Rami
  • Publication number: 20210265732
    Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.
    Type: Application
    Filed: May 11, 2021
    Publication date: August 26, 2021
    Inventors: Feras EID, Sasha N. OSTER, Telesphor KAMGAING, Georgios C. DOGIAMIS, Aleksandar ALEKSOV
  • Publication number: 20210265288
    Abstract: Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package. Included are a first conductive member and a second conductive member separated by a dielectric material. Also included is a conductive structure, such as a plurality of vias, that conductively couples the first conductive member and the second conductive member. Together, the first conductive member, the second conductive member, and the conductive structure form an electrically conductive side-radiating waveguide launcher enclosing shaped space within the dielectric material. The shaped space includes a narrow first end and a wide second end. An RF excitation element is disposed proximate the first end and a waveguide may be operably coupled proximate the second end of the shaped space.
    Type: Application
    Filed: September 23, 2016
    Publication date: August 26, 2021
    Applicant: INTEL CORPORATION
    Inventors: GEORGIOS DOGIAMIS, SASHA OSTER, JOHANNA SWAN, SHAWNA LIFF, ADEL ELSHERBINI, TELESPHOR KAMGAING, ALEKSANDAR ALEKSOV
  • Patent number: 11095012
    Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: August 17, 2021
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Georgios C. Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Brandon M. Rawlings, Richard J. Dischler
  • Publication number: 20210233856
    Abstract: Embodiments may relate to a microelectronic package that includes an overmold material, a redistribution layer (RDL) in the overmold material, and a die in the overmold material electrically coupled with the RDL on an active side of the die. The RDL is configured to provide electrical interconnection within the overmold material and includes at least one mold interconnect. The microelectronic package may also include a through-mold via (TMV) disposed in the overmold material and electrically coupled to the RDL by the mold interconnect. In some embodiments, the microelectronics package further includes a surface mount device (SMD) in the overmold material. The microelectronics package may also include a substrate having a face on which the overmold is disposed.
    Type: Application
    Filed: April 14, 2021
    Publication date: July 29, 2021
    Applicant: Intel Corporation
    Inventors: Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
  • Patent number: 11062947
    Abstract: Disclosed herein are inorganic dies with organic interconnect layers and related structures, devices, and methods. In some embodiments, an integrated circuit (IC) structure may include an inorganic die and one or more organic interconnect layers on the inorganic die, wherein the organic interconnect layers include an organic dielectric.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: July 13, 2021
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan
  • Patent number: 11056765
    Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) circuits and a second substrate coupled to the first substrate. The second substrate includes a first section and a second section with the second substrate being foldable in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: July 6, 2021
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Georgios C. Dogiamis, Sasha N. Oster
  • Patent number: 11050155
    Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: June 29, 2021
    Assignee: Intel Corporation
    Inventors: Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Georgios C. Dogiamis, Aleksandar Aleksov
  • Publication number: 20210193519
    Abstract: Disclosed herein are inorganic dies with organic interconnect layers and related structures, devices, and methods. In some embodiments, an integrated circuit (IC) structure may include an inorganic die and one or more organic interconnect layers on the inorganic die, wherein the organic interconnect layers include an organic dielectric.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 24, 2021
    Applicant: INTEL CORPORATION
    Inventors: Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Feras Eid, Johanna M. Swan, Shawna M. Liff
  • Publication number: 20210194966
    Abstract: Embodiments include a sensor node, an active sensor node, and a vehicle with a communication system that includes sensor nodes. The sensor node include a package substrate, a diplexer/combiner block on the package substrate, a transceiver communicatively coupled to the diplexer/combiner block, and a first mm-wave launcher coupled to the diplexer/combiner block. The sensor node may have a sensor communicatively coupled to the transceiver, the sensor is communicatively coupled to the transceiver by an electrical cable and located on the package substrate. The sensor node may include that the sensor operates at a frequency band for communicating with an electronic control unit (ECU) communicatively coupled to the sensor node. The sensor node may have a filter communicatively coupled to the diplexer/combiner block, the transceiver communicatively coupled to the filter, the filter substantially removes frequencies from RF signals other than the frequency band of the sensor.
    Type: Application
    Filed: December 30, 2017
    Publication date: June 24, 2021
    Inventors: Georgios C. DOGIAMIS, Sasha N. OSTER, Adel A. ELSHERBINI, Erich N. EWY, Johanna M. SWAN, Telesphor KAMGAING
  • Publication number: 20210194106
    Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 ?m and 1,000 ?m.
    Type: Application
    Filed: March 5, 2021
    Publication date: June 24, 2021
    Inventors: Telesphor KAMGAING, Sasha OSTER, Georgios DOGIAMIS, Johanna SWAN
  • Publication number: 20210193518
    Abstract: Disclosed herein are inorganic dies with organic interconnect layers and related structures, devices, and methods. In some embodiments, an integrated circuit (IC) structure may include an inorganic die and one or more organic interconnect layers on the inorganic die, wherein the organic interconnect layers include an organic dielectric.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 24, 2021
    Applicant: INTEL CORPORATION
    Inventors: Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan
  • Publication number: 20210194459
    Abstract: Techniques are disclosed implementing acoustic wave resonator (AWR) filter architectures to enable integrated solutions requiring significantly less passive components. The primary AWR filter topology leverages the use of parallel resonator branches, each having a relatively narrow bandwidth that may be combined to form an overall broadband filter response. This architecture may be further modified using electronically-controlled switching components to dynamically turn specific branches on or off to tune the filter, thus realizing a programmable broadband solution. Shunt resonators may also be added to the AWR filter topology, which may also be controlled with the use of electronically-controlled switching components to provide further control with respect to roll-off and the location and number of notch frequencies.
    Type: Application
    Filed: December 18, 2019
    Publication date: June 24, 2021
    Inventors: Hossein Alavi, Ibrahim Ban, Telesphor Kamgaing, Edris Mohammed, Han Wui Then, Kevin Obrien, Paul Fischer, Johanny Escobar Pelaez, Ved Gund