Patents by Inventor Telesphor Kamgaing

Telesphor Kamgaing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12165994
    Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate, a plurality of integrated circuit devices electrically attached to the package substrate, wherein each integrated circuit device of the plurality of integrated circuit devices includes an active surface and a backside surface, and wherein a first integrated circuit device and a second integrated circuit device of the plurality of integrated circuit devices includes radio frequency logic circuitry and a radio frequency antenna formed in or attached thereto, and a radio frequency waveguide on the backside surface of the first integrated circuit device and on the backside surface of the second integrated circuit device.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: December 10, 2024
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Kristof Darmawikarta, Benjamin Duong, Telesphor Kamgaing, Miranda Ngan, Srinivas Pietambaram
  • Patent number: 12166261
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: December 10, 2024
    Assignee: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing
  • Publication number: 20240405433
    Abstract: Disclosed herein are antenna modules, electronic assemblies, and communication devices. An example antenna module includes an IC component, an antenna patch support over a face of the IC component, and a stack of antenna patches vertically arranged at least partially above one another, where a first antenna patch of the stack is an antenna patch closest to the IC component, and a second antenna patch of the stack is an antenna patch closest to the first antenna patch. The first antenna patch is on the face of the IC component while the second and further antenna patches of the stack are on or in the antenna patch support and are electrically isolated from all electrically conductive material pathways in the antenna patch support and in the IC component.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 5, 2024
    Applicant: Intel Corporation
    Inventors: Telesphor Kamgaing, Georg Seidemann, Harald Gossner, Thomas Wagner, Bernd Waidhas, Tae Young Yang
  • Patent number: 12155133
    Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: November 26, 2024
    Assignee: Intel Corporation
    Inventors: Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Georgios C. Dogiamis, Aleksandar Aleksov
  • Patent number: 12155372
    Abstract: Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: November 26, 2024
    Assignee: Intel Corporation
    Inventors: Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
  • Patent number: 12150271
    Abstract: Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: November 19, 2024
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov, Richard Dischler
  • Publication number: 20240364000
    Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, and a dielectric layer is over the second surface of the die and the first pad. In an embodiment, an antenna module is over the dielectric layer, where the antenna module comprises a second pad that is aligned over the first pad.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Bernd WAIDHAS, Thomas WAGNER, Georg SEIDEMANN, Harald GOSSNER, Telesphor KAMGAING, Shuhei YAMADA, Tae Young YANG
  • Publication number: 20240363567
    Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, where a top surface of the first pad is substantially coplanar with the second surface. In an embodiment, the die module comprises an antenna module with a third surface and a fourth surface. In an embodiment, a second pad is on the third surface of the antenna module, where a bottom surface of the second pad is substantially coplanar with the third surface. In an embodiment, the top surface of the first pad directly contacts the bottom surface of the second pad.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Bernd WAIDHAS, Thomas WAGNER, Georg SEIDEMANN, Harald GOSSNER, Telesphor KAMGAING, Shuhei YAMADA, Tae Young YANG
  • Publication number: 20240364002
    Abstract: An antenna device includes integrated polymer nanocomposite (PNC) devices coupling an antenna on a substrate to both ground and signal terminals. The PNC devices may include PNC material between two electrodes. The PNC devices may be integrated into the antenna device with the substrate including at least one electrode of each of the PNC devices. One PNC device may convey a signal to or from the antenna, e.g., between the antenna and a signal terminal. Another PNC device may convey an electrostatic discharge (ESD) pulse to a ground terminal. The antenna device may include or be coupled to an integrated circuit (IC) die. The IC die may couple to the signal and ground terminals, e.g., opposite the substrate from the antenna.
    Type: Application
    Filed: April 25, 2023
    Publication date: October 31, 2024
    Applicant: Intel Corporation
    Inventors: Harald Gossner, Thomas Wagner, Bernd Waidhas, Georg Seidemann, Tae Young Yang, Telesphor Kamgaing
  • Publication number: 20240363556
    Abstract: An antenna device includes an antenna on a substrate, a low-impedance electrostatic discharge (ESD) path for an ESD pulse from the antenna to a ground terminal, and a signal path between the antenna and either a signal terminal or an integrated circuit (IC) die. The ESD and signal paths may each include separate vias through the substrate. A capacitor may couple a signal to or from the antenna and the signal terminal (or IC die) but block low-frequency power (such as an ESD pulse). The ESD path has an electrical length of a quarter of the wavelength and so may present a high impedance to ground for the signal. The antenna device may include or be coupled to an IC die. The IC die may couple to the signal and ground terminals, e.g., opposite the substrate from the antenna.
    Type: Application
    Filed: April 25, 2023
    Publication date: October 31, 2024
    Applicant: Intel Corporation
    Inventors: Harald Gossner, Thomas Wagner, Bernd Waidhas, Georg Seidemann, Tae Young Yang, Telesphor Kamgaing
  • Publication number: 20240364023
    Abstract: Embodiments disclosed herein include a communication module. In an embodiment, the communication module comprises a package substrate, and a die on the package substrate. In an embodiment, a plurality of antennas are around the die. In an embodiment, the plurality of antennas are coupled to the die by a plurality of traces, and heights of each of the plurality of antennas is greater than a thickness of the traces.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Thomas WAGNER, Georg SEIDEMANN, Tae Young YANG, Harald GOSSNER, Telesphor KAMGAING, Bernd WAIDHAS
  • Publication number: 20240355752
    Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core with a first surface and a second surface, where the core comprises a glass layer. In an embodiment, a first routing layer is over the first surface of the core, where the first routing layer comprises traces with a first width. In an embodiment, a second routing layer is over the second surface of the core, where the second routing layer comprises traces with a second width that is smaller than the first width.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 24, 2024
    Inventor: Telesphor KAMGAING
  • Patent number: 12126067
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: October 22, 2024
    Assignee: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing
  • Patent number: 12126068
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: October 22, 2024
    Assignee: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing
  • Patent number: 12107314
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: October 1, 2024
    Assignee: Intel Corporation
    Inventors: Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Diego Correas-Serrano
  • Publication number: 20240322775
    Abstract: Disclosed herein are electronic assemblies, integrated circuit (IC) packages, and communication devices implementing three-dimensional power combiners. An electronic assembly may include a first die, comprising a first transmission line, and a second die, comprising a second transmission line. Each die includes a first face and an opposing second face, and the second die is stacked above the first die so that the first face of the second die is coupled to the second face of the first die. The electronic assembly further includes a first conductive pathway between one end of the first transmission line and a first connection point at the first face of the first die, a second conductive pathway between one end of the second transmission line and a second connection point at the first face of the first die, and a third conductive pathway between the other ends of the first and second transmission lines.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 26, 2024
    Applicant: Intel Corporation
    Inventors: Telesphor Kamgaing, Peter Baumgartner, Steven Callender, Richard Geiger, Harald Gossner, Jonathan Jensen
  • Publication number: 20240312869
    Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device. In this arrangement, heat can become trapped inside the device. A microfluidic cooling layer is formed near a top or front the device, e.g., over the semiconductor devices and any front side interconnect structures, to transfer heat away from the semiconductor devices.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 19, 2024
    Applicant: Intel Corporation
    Inventors: Tongyan Zhai, Telesphor Kamgaing, Min Suet Lim
  • Patent number: 12088360
    Abstract: Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: September 10, 2024
    Assignee: Intel Corporation
    Inventors: Henning Braunisch, Georgios Dogiamis, Diego Correas-Serrano, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Cooper S. Levy, Chintan S. Thakkar, Stefano Pellerano
  • Publication number: 20240266745
    Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.
    Type: Application
    Filed: March 28, 2024
    Publication date: August 8, 2024
    Inventors: Feras EID, Sasha N. OSTER, Telesphor KAMGAING, Georgios C. DOGIAMIS, Aleksandar ALEKSOV
  • Patent number: 12040776
    Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes an acoustic wave resonator (AWR) die. The RF FEM may further include an active die coupled with the package substrate of the RF FEM. When the active die is coupled with the package substrate, the AWR die may be between the active die and the package substrate. Other embodiments may be described or claimed.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: July 16, 2024
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Johanna M. Swan