Patents by Inventor Telesphor Kamgaing

Telesphor Kamgaing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12205908
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to a transceiver architecture for inter-die communication on-package using mm-wave/THz interconnects. In particular, amplifier-less transceivers are used in combination with on-package low loss transmission lines to provide inter-die communication. In embodiments, signals on the interconnect may be transmitted between up conversion mixers and down conversion mixers without any additional amplification. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: January 21, 2025
    Assignee: Intel Corporation
    Inventor: Telesphor Kamgaing
  • Publication number: 20250007145
    Abstract: Embodiments disclosed herein include communication dies for mm-wave and/or sub-terahertz wavelength communications. In an embodiment, a communications die comprises a substrate with a first face and a second face. In an embodiment, edge surfaces connect the first face to the second face. In an embodiment, a circuitry element is on the first face, and an antenna on at least one of the edge surfaces.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 2, 2025
    Inventors: Peter BAUMGARTNER, Richard GEIGER, Georgios C. DOGIAMIS, Steven CALLENDER, Telesphor KAMGAING, Jonathan C. JENSEN, Harald GOSSNER
  • Publication number: 20250008685
    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. An example apparatus includes a fan module for an electronic device. The fan module includes a first cover; a second cover; an input/output (IO) board adjacent the second cover, the second cover and IO board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the IO board.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 2, 2025
    Inventors: Jeff Ku, Nirmala Bailur, Min Suet Lim, Tongyan Zhai, Chee Chun Yee, Ruander Cardenas, Lance Lin, Eng Huat Goh, Javed Shaikh, Jun Liao, Kavitha Nagarajan, Tin Poay Chuah, Martin M. Chang, Shantanu D. Kulkarni, Telesphor Kamgaing
  • Patent number: 12183961
    Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: December 31, 2024
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Georgios C. Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Brandon M. Rawlings, Richard J. Dischler
  • Publication number: 20240429588
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems. In one aspect, a microelectronic support for millimeter-wave communication includes a millimeter-wave communication transmission line, wherein the transmission line includes a trace in a metal layer, wherein the trace is electrically coupled to a via by a via pad in the metal layer; and a ground plane in the metal layer, wherein one or more metal portions contact the via pad and the ground plane.
    Type: Application
    Filed: September 4, 2024
    Publication date: December 26, 2024
    Applicant: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing
  • Publication number: 20240421062
    Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die and a substrate including a glass core. The apparatus also includes a pluggable interconnect including a portion of the glass core. The pluggable interconnect includes a transmission line extending along the portion of the glass core.
    Type: Application
    Filed: June 13, 2023
    Publication date: December 19, 2024
    Inventors: Tolga Acikalin, Shuhei Yamada, Telesphor Kamgaing, Tae Young Yang
  • Publication number: 20240421465
    Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die. The example apparatus further includes a package substrate supporting the semiconductor die. The package substrate includes a glass core. The example apparatus also includes an antenna within the glass core.
    Type: Application
    Filed: June 13, 2023
    Publication date: December 19, 2024
    Inventors: Tolga Acikalin, Tae Young Yang, Shuhei Yamada, Telesphor Kamgaing
  • Patent number: 12165994
    Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate, a plurality of integrated circuit devices electrically attached to the package substrate, wherein each integrated circuit device of the plurality of integrated circuit devices includes an active surface and a backside surface, and wherein a first integrated circuit device and a second integrated circuit device of the plurality of integrated circuit devices includes radio frequency logic circuitry and a radio frequency antenna formed in or attached thereto, and a radio frequency waveguide on the backside surface of the first integrated circuit device and on the backside surface of the second integrated circuit device.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: December 10, 2024
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Kristof Darmawikarta, Benjamin Duong, Telesphor Kamgaing, Miranda Ngan, Srinivas Pietambaram
  • Patent number: 12166261
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: December 10, 2024
    Assignee: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing
  • Publication number: 20240405433
    Abstract: Disclosed herein are antenna modules, electronic assemblies, and communication devices. An example antenna module includes an IC component, an antenna patch support over a face of the IC component, and a stack of antenna patches vertically arranged at least partially above one another, where a first antenna patch of the stack is an antenna patch closest to the IC component, and a second antenna patch of the stack is an antenna patch closest to the first antenna patch. The first antenna patch is on the face of the IC component while the second and further antenna patches of the stack are on or in the antenna patch support and are electrically isolated from all electrically conductive material pathways in the antenna patch support and in the IC component.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 5, 2024
    Applicant: Intel Corporation
    Inventors: Telesphor Kamgaing, Georg Seidemann, Harald Gossner, Thomas Wagner, Bernd Waidhas, Tae Young Yang
  • Patent number: 12155372
    Abstract: Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: November 26, 2024
    Assignee: Intel Corporation
    Inventors: Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
  • Patent number: 12155133
    Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: November 26, 2024
    Assignee: Intel Corporation
    Inventors: Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Georgios C. Dogiamis, Aleksandar Aleksov
  • Patent number: 12150271
    Abstract: Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: November 19, 2024
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov, Richard Dischler
  • Publication number: 20240363556
    Abstract: An antenna device includes an antenna on a substrate, a low-impedance electrostatic discharge (ESD) path for an ESD pulse from the antenna to a ground terminal, and a signal path between the antenna and either a signal terminal or an integrated circuit (IC) die. The ESD and signal paths may each include separate vias through the substrate. A capacitor may couple a signal to or from the antenna and the signal terminal (or IC die) but block low-frequency power (such as an ESD pulse). The ESD path has an electrical length of a quarter of the wavelength and so may present a high impedance to ground for the signal. The antenna device may include or be coupled to an IC die. The IC die may couple to the signal and ground terminals, e.g., opposite the substrate from the antenna.
    Type: Application
    Filed: April 25, 2023
    Publication date: October 31, 2024
    Applicant: Intel Corporation
    Inventors: Harald Gossner, Thomas Wagner, Bernd Waidhas, Georg Seidemann, Tae Young Yang, Telesphor Kamgaing
  • Publication number: 20240364002
    Abstract: An antenna device includes integrated polymer nanocomposite (PNC) devices coupling an antenna on a substrate to both ground and signal terminals. The PNC devices may include PNC material between two electrodes. The PNC devices may be integrated into the antenna device with the substrate including at least one electrode of each of the PNC devices. One PNC device may convey a signal to or from the antenna, e.g., between the antenna and a signal terminal. Another PNC device may convey an electrostatic discharge (ESD) pulse to a ground terminal. The antenna device may include or be coupled to an integrated circuit (IC) die. The IC die may couple to the signal and ground terminals, e.g., opposite the substrate from the antenna.
    Type: Application
    Filed: April 25, 2023
    Publication date: October 31, 2024
    Applicant: Intel Corporation
    Inventors: Harald Gossner, Thomas Wagner, Bernd Waidhas, Georg Seidemann, Tae Young Yang, Telesphor Kamgaing
  • Publication number: 20240363567
    Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, where a top surface of the first pad is substantially coplanar with the second surface. In an embodiment, the die module comprises an antenna module with a third surface and a fourth surface. In an embodiment, a second pad is on the third surface of the antenna module, where a bottom surface of the second pad is substantially coplanar with the third surface. In an embodiment, the top surface of the first pad directly contacts the bottom surface of the second pad.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Bernd WAIDHAS, Thomas WAGNER, Georg SEIDEMANN, Harald GOSSNER, Telesphor KAMGAING, Shuhei YAMADA, Tae Young YANG
  • Publication number: 20240364023
    Abstract: Embodiments disclosed herein include a communication module. In an embodiment, the communication module comprises a package substrate, and a die on the package substrate. In an embodiment, a plurality of antennas are around the die. In an embodiment, the plurality of antennas are coupled to the die by a plurality of traces, and heights of each of the plurality of antennas is greater than a thickness of the traces.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Thomas WAGNER, Georg SEIDEMANN, Tae Young YANG, Harald GOSSNER, Telesphor KAMGAING, Bernd WAIDHAS
  • Publication number: 20240364000
    Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, and a dielectric layer is over the second surface of the die and the first pad. In an embodiment, an antenna module is over the dielectric layer, where the antenna module comprises a second pad that is aligned over the first pad.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Bernd WAIDHAS, Thomas WAGNER, Georg SEIDEMANN, Harald GOSSNER, Telesphor KAMGAING, Shuhei YAMADA, Tae Young YANG
  • Publication number: 20240355752
    Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core with a first surface and a second surface, where the core comprises a glass layer. In an embodiment, a first routing layer is over the first surface of the core, where the first routing layer comprises traces with a first width. In an embodiment, a second routing layer is over the second surface of the core, where the second routing layer comprises traces with a second width that is smaller than the first width.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 24, 2024
    Inventor: Telesphor KAMGAING
  • Patent number: 12126068
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: October 22, 2024
    Assignee: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing