Patents by Inventor Telesphor Kamgaing

Telesphor Kamgaing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PHYSICAL VAPOR DEPOSITION SEEDING FOR HIGH ASPECT RATIO VIAS IN GLASS CORE TECHNOLOGY
    Publication number: 20220406616
    Abstract: Embodiments disclosed herein include package substrates and methods of fabricating such substrates. In an embodiment, a package substrate comprises a core with a first surface and a second surface opposite from the first surface. The package substrate further comprises a via hole through the core. In an embodiment the via hole comprises a first portion, a second portion, and a perforated ledge between the first portion and the second portion. In an embodiment, the package substrate further comprises a via filling the via hole.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 22, 2022
    Inventors: Veronica STRONG, Aleksandar ALEKSOV, Georgios C. DOGIAMIS, Telesphor KAMGAING, Neelam PRABHU GAUNKAR
  • CONTACTLESS COMMUNICATION USING A WAVEGUIDE EXTENDING THROUGH A SUBSTRATE CORE
    Publication number: 20220407205
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to contactless transmission within a package that combines radiating elements with vertical transitions in the package, in particular to a waveguide within a core of the package that is surrounded by a metal ring. A radiating element on one side of the substrate core and above the waveguide surrounded by the metal ring communicates with another radiating element on the other side of the substrate core and below the waveguide surrounded by the metal ring. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 22, 2022
    Inventors: Telesphor KAMGAING, Neelam PRABHU GAUNKAR, Georgios C. DOGIAMIS, Johanna M. SWAN
  • COMPACT SURFACE TRANSMISSION LINE WAVEGUIDES WITH VERTICAL GROUND PLANES
    Publication number: 20220407202
    Abstract: Embodiments disclosed herein include coplanar waveguides and methods of forming coplanar waveguides. In an embodiment, a coplanar waveguide comprises a core, and a signal trace on the core. In an embodiment, the signal trace has a first edge and a second edge. In an embodiment, a first ground trace is over the core, and the first ground trace is adjacent to the first edge of the signal trace. In an embodiment, a first ground via plane is below the first ground trace. The coplanar waveguide may further comprise a second ground trace over the core, and the second ground trace is adjacent to the second edge of the signal trace. In an embodiment, a second ground via plane below the second ground trace.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Inventors: Telesphor KAMGAING, Neelam PRABHU GAUNKAR, Georgios C. DOGIAMIS, Veronica STRONG, Aleksandar ALEKSOV
  • CAPACITORS IN A GLASS SUBSTRATE
    Publication number: 20220406523
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to creating capacitors at the interface of a glass substrate. These capacitors may be three-dimensional (3-D) capacitors formed using trenches within the glass core of the substrate using laser-assisted etching techniques. A first electrode may be formed on the glass, including on the surface of trenches or other features etched in the glass, followed by a deposition of a dielectric material or a capacitive material. A second electrode may then be formed on top of the dielectric material. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Inventors: Telesphor KAMGAING, Veronica STRONG, Neelam PRABHU GAUNKAR, Aleksandar ALEKSOV, Georgios C. DOGIAMIS, Hiroki TANAKA
  • GLASS-BASED CAVITY AND CHANNELS FOR COOLING OF EMBEDDED DIES AND 3D INTEGRATED MODULES USING PACKAGE SUBSTRATES WITH GLASS CORE
    Publication number: 20220406686
    Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a buildup layer is over the first surface of the core. In an embodiment, a channel is through the core, where the channel extends in a direction that is substantially parallel to the first surface.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 22, 2022
    Inventors: Aleksandar ALEKSOV, Telesphor KAMGAING, Neelam PRABHU GAUNKAR, Georgios C. DOGIAMIS, Veronica STRONG
  • IN-PACKAGE MMWAVE ANTENNAS AND LAUNCHERS USING GLASS CORE TECHNOLOGY
    Publication number: 20220407216
    Abstract: Embodiments disclosed herein include package substrates with antennas on the core. In an embodiment, a package substrate comprises a core with a first surface and a second surface. In an embodiment, a first conductive plane is formed into the core, where the first conductive plane is substantially orthogonal to the first surface, and a second conductive plane is formed into the core, where the second conductive plane is substantially orthogonal to the first surface. In an embodiment, an antenna is on the core, where the antenna is between the first conductive plane and the second conductive plane.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 22, 2022
    Inventors: Georgios C. DOGIAMIS, Telesphor KAMGAING, Neelam PRABHU GAUNKAR, Aleksandar ALEKSOV, Veronica STRONG
  • PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE
    Publication number: 20220404568
    Abstract: Embodiments disclosed herein include electronic packages with a core that includes an optical waveguide and methods of forming such electronic packages. In an embodiment, a package substrate comprises a core, and a photonics die embedded in the core. In an embodiment, the electronic package further comprises an optical waveguide embedded in the core. In an embodiment, the optical waveguide optically couples the photonics die to an edge of the core.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Inventors: Aleksandar ALEKSOV, Telesphor KAMGAING, Veronica STRONG, Neelam PRABHU GAUNKAR, Georgios C. DOGIAMIS
  • LAYER TRANSFER ON NON-SEMICONDUCTOR SUPPORT STRUCTURES
    Publication number: 20220406754
    Abstract: Embodiments of the present disclosure relate to methods of fabricating IC devices using layer transfer and resulting IC devices, assemblies, and systems. An example method includes fabricating a device layer over a semiconductor support structure, the device layer comprising a plurality of frontend devices; attaching the semiconductor support structure with the device layer to a carrier substrate so that the device layer is closer to the carrier substrate than the semiconductor support structure; removing at least a portion of the semiconductor support structure to expose the device layer; and bonding a support structure of a non-semiconductor material having a dielectric constant that is smaller than a dielectric constant of silicon (e.g., a glass wafer) to the exposed frontend layer. The carrier substrate may then be removed.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Applicant: Intel Corporation
    Inventors: Abhishek A. Sharma, Wilfred Gomes, Telesphor Kamgaing
  • MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE
    Publication number: 20220407212
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related creating millimeter wave components within a glass core of a substrate within a semiconductor package. These millimeter wave components, which include resonators, isolators, directional couplers, and circulators, may be combined to form other structures such as filters or multiplexers. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Inventors: Neelam PRABHU GAUNKAR, Georgios C. DOGIAMIS, Telesphor KAMGAING, Veronica STRONG, Aleksandar ALEKSOV
  • PACKAGE SUBSTRATE WITH GLASS CORE HAVING VERTICAL POWER PLANES FOR IMPROVED POWER DELIVERY
    Publication number: 20220406696
    Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment the package substrate comprises a core and buildup layers on the core. In an embodiment, first level interconnect (FLI) pads are on a topmost buildup layer, and the FLI pads have a pitch. In an embodiment, a plurality of vertically oriented planes are embedded in the core, and the vertically oriented planes are spaced at the pitch.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 22, 2022
    Inventors: Aleksandar ALEKSOV, Telesphor KAMGAING, Veronica STRONG, Georgios C. DOGIAMIS, Neelam PRABHU GAUNKAR
  • IN-PACKAGE MAGNETIC SWITCHING USING GLASS CORE TECHNOLOGY
    Publication number: 20220406991
    Abstract: Embodiments disclosed herein comprise package substrates and methods of forming such package substrates. In an embodiment, a package substrate comprises a core, where the core comprises glass. In an embodiment, an opening if formed through the core. In an embodiment, a magnetic region is disposed in the opening.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 22, 2022
    Inventors: Neelam PRABHU GAUNKAR, Telesphor KAMGAING, Veronica STRONG, Georgios C. DOGIAMIS, Aleksandar ALEKSOV
  • GLASS PACKAGE CORE WITH PLANAR STRUCTURES
    Publication number: 20220406725
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to glass interposers or substrates that may be created using a glass etching process to enable highly integrated modules. Planar structures, which may be vertical planar structures, created within the glass interposer may be used to provide shielding for conductive vias in the glass interposer, to increase the signal density within the glass substrate and to reduce cross talk. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Inventors: Telesphor KAMGAING, Veronica STRONG, Neelam PRABHU GAUNKAR, Georgios C. DOGIAMIS, Aleksandar ALEKSOV, Johanna M. SWAN
  • INTEGRATED RF PASSIVE DEVICES ON GLASS
    Publication number: 20220408562
    Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a glass core, and a vertically oriented inductor embedded in the glass core. In an embodiment, the inductor comprises vertical vias through the glass core, and where the vertical vias are electrically coupled together by conductive traces over a surface of the glass core to provide a plurality of conductive turns.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 22, 2022
    Inventors: Telesphor KAMGAING, Georgios C. DOGIAMIS, Neelam PRABHU GAUNKAR, Veronica STRONG, Aleksandar ALEKSOV
  • RF FILTERS AND MULTIPLEXERS MANUFACTURED IN THE CORE OF A PACKAGE SUBSTRATE USING GLASS CORE TECHNOLOGY
    Publication number: 20220407199
    Abstract: Embodiments disclosed herein include package substrates with filter architectures. In an embodiment, a package substrate comprises a core with a first surface and a second surface, and a filter embedded in the core. In an embodiment, the filter comprises a ground plane, where the ground plane is substantially orthogonal to the first surface of the core, and a resonator adjacent to the ground plane.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 22, 2022
    Inventors: Aleksandar ALEKSOV, Neelam PRABHU GAUNKAR, Veronica STRONG, Georgios C. DOGIAMIS, Telesphor KAMGAING
  • DIE COUPLING USING A SUBSTRATE WITH A GLASS CORE
    Publication number: 20220406721
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to via structures and/or planar structures within a glass core of a substrate to facilitate high-speed signaling with a die coupled with the substrate. In embodiments, the substrate may be coupled with an interposer to enable high-speed signaling between a compute die (or tile) and a storage die (or tile) that may be remote to the substrate. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Inventors: Telesphor KAMGAING, Johanna M. SWAN
  • Through-substrate waveguide
    Patent number: 11532574
    Abstract: Embodiments may relate to a semiconductor package that includes a die and a package substrate. The package substrate may include one or more cavities that go through the package substrate from a first side of the package substrate that faces the die to a second side of the package substrate opposite the first side. The semiconductor package may further include a waveguide communicatively coupled with the die. The waveguide may extend through one of the one or more cavities such that the waveguide protrudes from the second side of the package substrate. Other embodiments may be described or claimed.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: December 20, 2022
    Assignee: Intel Coropration
    Inventors: Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Gilbert W. Dewey, Hyung-Jin Lee
  • Microelectronic package communication using radio interfaces connected through wiring
    Patent number: 11525970
    Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: December 13, 2022
    Assignee: Intel Corporation
    Inventors: Shawna Liff, Adel A. Elsherbini, Telesphor Kamgaing, Sasha N. Oster, Gaurav Chawla
  • PACKAGE HAVING THICK GLASS CORE WITH HIGH ASPECT RATIO VIAS
    Publication number: 20220394849
    Abstract: Embodiments disclosed herein include package substrates for electronic packaging applications. In an embodiment, a package substrate comprises a first glass layer, where the first glass layer comprises a first via through the first glass layer, and the first via has an hourglass shaped cross-section. The package substrate may further comprise a second glass layer over the first glass layer, where the second glass layer comprises a second via through the second glass layer, and where the second via has the hourglass shaped cross-section. In an embodiment, the first via is electrically coupled to the second via.
    Type: Application
    Filed: June 4, 2021
    Publication date: December 8, 2022
    Inventor: Telesphor KAMGAING
  • PACKAGE SUBSTRATE INCLUDING CORE WITH TRENCH VIAS AND PLANES
    Publication number: 20220394858
    Abstract: Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an embodiment, the laser changes the morphology of the exposed region. The method may further comprise etching the core substrate, where the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate. The method may further comprise disposing a via in the hole.
    Type: Application
    Filed: June 4, 2021
    Publication date: December 8, 2022
    Inventor: Telesphor KAMGAING
  • INDUCTORS IN TRENCHES WITHIN A SUBSTRATE
    Publication number: 20220384560
    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to inductors located within a substrate. An inductor may be created in a glass core using a laser-assisted etching of glass interconnects techniques to create trenches or vias within the glass substrate, into which conductive material may be plated or filled to create the inductor. In embodiments, the inductors may be low equivalent series resistance (ESR) compact air-core inductors. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 1, 2022
    Inventor: Telesphor KAMGAING