Abstract: The present invention provides a transmitter including a mixer, a harmonic impedance adjustment circuit and an amplifier. The mixer is configured to mix a first baseband signal with a first oscillation signal to generate a first mixed signal to a first node, and to mix a second baseband signal with a second oscillation signal to generate a second mixed signal to a second node. The harmonic impedance adjustment circuit is coupled between the first node and the second node, and is configured to reduce harmonic components of the first mixed signal and the second mixed signal to generate an adjusted first mixed signal and an adjusted second mixed signal. The amplifier is coupled to the harmonic impedance adjustment circuit, and is configured to generate an amplified signal according to the adjusted first mixed signal and the adjusted second mixed signal.

Abstract: A dynamic adjustment method for RS reception is provided. The dynamic adjustment method for RS reception includes the following steps. A processor of an apparatus may detect at least one channel condition to generate a detection result. Then, the processor may determine an RS reception scheduling based on the detection result. Then, the processor may perform an RS reception based on the RS reception scheduling to receive RSs from a network node.

Abstract: An embodiment semiconductor device may include an electrical interconnect layer, a bonding pad electrically coupled to the electrical interconnect layer, a stacked film structure including a first film partially covering a surface of the bonding pad and a second film partially covering the first film, a first aperture formed in the first film over a portion of the surface of the bonding pad, a second aperture formed in the second film such that the second aperture is larger than the first aperture and is formed over the first aperture such that the first aperture is located entirely below an area of the second aperture, and a solder material portion formed in contact with the bonding pad. The solder material portion may include a first width that is less than a size of the second aperture such that the solder material portion does not contact the second film.

Abstract: An obstacle avoidance mechanism applied to a sweeping robot, the sweeping robot comprises a body, a baffle and a road wheel, the baffle is arranged on an exterior side of the body, the baffle is arranged at a first distance from the body, the obstacle avoidance mechanism comprises a shield module and a photosensitive module. When the baffle collides with the an obstacle object, the light path of the photosensitive module is blocked by the shield module, so as to send out a first signal to make the road wheel stop moving forward or turn, and realize the obstacle avoidance function of the sweeping robot and enhance its service life.

Abstract: An anti-collision mechanism comprises a body, a collision baffle, a magnetic element, and a magnetic field sensor, and the anti-collision mechanism is configured to be applicable to a sweeping robot. The magnetic field sensor is arranged at a distance from the magnetic element, the magnetic field sensor is configured to detect a change in the magnetic field intensity caused by a change in the distance between the magnetic field sensor and the magnetic element. When the collision occurs, the magnetic element is closer to the magnetic field sensor to make the magnetic field intensity change, thus generating signals to stop or turn the sweeping robot, which can realize the obstacle avoidance of the sweeping robot and enhance the service life. The sweeping robot is also provided.

Abstract: A chip package structure includes an interposer structure that contains a package-side redistribution structure, an interposer core assembly, and a die-side redistribution structure. The interposer core assembly includes at least one silicon substrate interposer, and each of the at least one silicon substrate interposer includes a respective silicon substrate, a respective set of through-silicon via (TSV) structures vertically extending through the respective silicon substrate, a respective set of interconnect-level dielectric layers embedding a respective set of metal interconnect structures, and a respective set of metal bonding structures that are electrically connected to the die-side redistribution structure. The chip package structure includes at least two semiconductor dies that are attached to the die-side redistribution structure, and an epoxy molding compound (EMC) multi-die frame that laterally encloses the at least two semiconductor dies.

Abstract: A chip package structure includes an interposer structure that contains a package-side redistribution structure, an interposer core assembly, and a die-side redistribution structure. The interposer core assembly includes at least one silicon substrate interposer, and each of the at least one silicon substrate interposer includes a respective silicon substrate, a respective set of through-silicon via (TSV) structures vertically extending through the respective silicon substrate, a respective set of interconnect-level dielectric layers embedding a respective set of metal interconnect structures, and a respective set of metal bonding structures that are electrically connected to the die-side redistribution structure. The chip package structure includes at least two semiconductor dies that are attached to the die-side redistribution structure, and an epoxy molding compound (EMC) multi-die frame that laterally encloses the at least two semiconductor dies.

Abstract: A computing device captures a live video of a user's head and generates a virtual mirror displaying the live video of the user's head. The computing device tracks ear regions on the user's head and performs virtual application of a set of earrings on the ear regions on the user's head. The computing device monitors for a target motion among a plurality of predefined target motions by the user. When at least one target motion is detected, the computing device changes the set of earrings with another set of earrings.

Abstract: Isolated antibodies that bind specifically to R-spondin 3 (RSPO3) are described. Also described herein are compositions containing the antibodies and methods of using the antibodies to treat cancer and detect RSPO3.

Abstract: In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, a redistribution structure, and an adhesive residue. The encapsulating material encapsulates a first part of a side surface of the semiconductor device. The redistribution structure is disposed over the semiconductor device and a first side of the encapsulating material. The adhesive residue is disposed over a second side of the encapsulating material opposite to the first side and surrounding the semiconductor device, wherein the adhesive residue encapsulates a second part of the side surface of the semiconductor device.

Abstract: In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.

Abstract: A manufacturing method of a semiconductor package includes at least the following steps. A rear surface of a semiconductor die is attached to a patterned dielectric layer of a first redistribution structure through a die attach material, where a thickness of a portion of the die attach material filling a gap between the rear surface of the semiconductor die and a recessed area of the patterned dielectric layer is greater than a thickness of another portion of the die attach material interposed between the rear surface of the semiconductor die and a non-recessed area of the patterned dielectric layer. An insulating encapsulant is formed on the patterned dielectric layer of the first redistribution structure to cover the semiconductor die and the die attach material. Other methods for forming a semiconductor package are also provided.

Abstract: A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to the first side of the interposer wafer adjacent the integrated circuit die. The stiffener structure covers the second electrical connectors in a plan view. The integrated circuit die and the stiffener structure are encapsulated with a first encapsulant. The interposer wafer and the stiffener structure are singulated to form a stacked structure.

Abstract: A chip package structure includes an interposer structure that contains a package-side redistribution structure, an interposer core assembly, and a die-side redistribution structure. The interposer core assembly includes at least one silicon substrate interposer, and each of the at least one silicon substrate interposer includes a respective silicon substrate, a respective set of through-silicon via (TSV) structures vertically extending through the respective silicon substrate, a respective set of interconnect-level dielectric layers embedding a respective set of metal interconnect structures, and a respective set of metal bonding structures that are electrically connected to the die-side redistribution structure. The chip package structure includes at least two semiconductor dies that are attached to the die-side redistribution structure, and an epoxy molding compound (EMC) multi-die frame that laterally encloses the at least two semiconductor dies.

Abstract: The present invention relates to a photo-induced cationic polymerized pure vegetable oil-based polymer and a preparation method and use thereof. The preparation method comprises the following steps: mixing a dry oil, an epoxy vegetable oil and an initiator uniformly, irradiating to initiate a photo-curing reaction, and then placing at ambient temperature, and continuing to a heat-curing reaction so as to obtain a photo-induced cationic polymerized pure vegetable oil-based polymer. In the present invention, vegetable oil resources which are low in price, widespread, and easy to regenerate are used to prepare the pure vegetable oil-based polymers instead of the fossil-derived monomers completely, thereby achieving the efficient use of vegetable oils. In the present invention, an unconventional photo-induced heat frontal polymerization technology is used to prepare the pure vegetable oil-based polymer, thereby achieving a photo-thermal dual curing reaction of a vegetable oil system without heating.

Abstract: A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to the first side of the interposer wafer adjacent the integrated circuit die. The stiffener structure covers the second electrical connectors in a plan view. The integrated circuit die and the stiffener structure are encapsulated with a first encapsulant. The interposer wafer and the stiffener structure are singulated to form a stacked structure.

Abstract: The present invention provides a transmitter including a mixer, a harmonic impedance adjustment circuit and an amplifier. The mixer is configured to mix a first baseband signal with a first oscillation signal to generate a first mixed signal to a first node, and to mix a second baseband signal with a second oscillation signal to generate a second mixed signal to a second node. The harmonic impedance adjustment circuit is coupled between the first node and the second node, and is configured to reduce harmonic components of the first mixed signal and the second mixed signal to generate an adjusted first mixed signal and an adjusted second mixed signal. The amplifier is coupled to the harmonic impedance adjustment circuit, and is configured to generate an amplified signal according to the adjusted first mixed signal and the adjusted second mixed signal.

Abstract: A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to the first side of the interposer wafer adjacent the integrated circuit die. The stiffener structure covers the second electrical connectors in a plan view. The integrated circuit die and the stiffener structure are encapsulated with a first encapsulant. The interposer wafer and the stiffener structure are singulated to form a stacked structure.

Abstract: A media casting device detects facial feature points of a beauty advisor and detects the beauty advisor performing a sequence of operations relating to application of cosmetic products on a facial region of the beauty advisor. The media casting device detects a corresponding timestamp for each operation and detects a position of a cosmetic product with respect to facial feature points of the beauty advisor during each of the sequence of operations. The media casting device detects a cosmetic product utilized by the beauty advisor during each of the sequence of operations and generates metadata comprising the sequence of operations, the position of each cosmetic product, the corresponding timestamps, and each detected cosmetic product. The media casting device then transmits the metadata to a client device.