Abstract: A media casting device detects facial feature points of a beauty advisor and detects the beauty advisor performing a sequence of operations relating to application of cosmetic products on a facial region of the beauty advisor. The media casting device detects a corresponding timestamp for each operation and detects a position of a cosmetic product with respect to facial feature points of the beauty advisor during each of the sequence of operations. The media casting device detects a cosmetic product utilized by the beauty advisor during each of the sequence of operations and generates metadata comprising the sequence of operations, the position of each cosmetic product, the corresponding timestamps, and each detected cosmetic product. The media casting device then transmits the metadata to a client device.

Abstract: A method for relieving vaulted expansion of a cement-stabilized base layer through precut seams. The method firstly establishes an RBFN model according to a large number of observation results of a vaulted expansion amount of the cement-stabilized base layer under different conditions (such as temperature and a stress release structure) in Xinjiang and similar regions; and on such a basis, the vaulted expansion amount of the cement-stabilized base layer to be designed is predicted. When the vaulted expansion amount is greater than a control requirement, the RBFN model is configured to design a reasonable width and a reasonable interval of the precut wide expansion seams to ensure that the vaulted expansion amount of the cement-stabilized base layer is less than a control value. Based on the design of the RBFN model, the present invention provides a corresponding construction method for the precut wide expansion seams.

Abstract: A flame-retardant three-dimension-molded object and a manufacturing method thereof are disclosed. The manufacturing method includes steps of: (a) providing a molded body including plural first pores and plural second pores, wherein the plural first pores communicate inward from an outer surface of the molded body, the first pores and the second pores are partially connected to each other, and a first average pore width of the first pores is greater than a second average pore width of the second pores; (b) immersing the molded body in a flame-retardant solution composed of a flame retardant and a solvent for an immersion time under a negative pressure, so that the flame-retardant solution is introduced into the plural first pores and the plural of second pores; and (c) removing the solvent contained in the plurality of first pores and the plurality of second pores, so as to obtain the flame-retardant three-dimensional-molded object.

Abstract: In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.

Abstract: In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.

Abstract: An isolated antibody, comprising: heavy chain complementary determining regions CDR1, CDR2, and CDR3 of a heavy chain variable region sequence selected from SEQ ID NOs: 2, 6, 10, and 14; and light chain complementary determining regions CDR1, CDR2, and CDR3 of a light chain variable region sequence selected from SEQ ID NOs: 4, 8, 12, and 16; wherein the antibody binds specifically to a RSPO3 protein.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die electrically coupled to the first redistribution structure, a die attach material interposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure and covering the semiconductor die and the die attach material. A bottom of the semiconductor die is embedded in the die attach material, and a thickness of a portion of the die attach material disposed over a spacing of conductive traces of the first redistribution structure is greater than a thickness of another portion of the die attach material disposed over the conductive traces of the first redistribution structure and underlying the bottom of the semiconductor die.

Abstract: The present invention discloses a method for relieving vaulted expansion of a cement-stabilized base layer through precut seams. The method firstly establishes an RBFN model according to a large number of observation results of a vaulted expansion amount of the cement-stabilized base layer under different conditions (such as temperature and a stress release structure) in Xinjiang and similar regions; and on such a basis, the vaulted expansion amount of the cement-stabilized base layer to be designed is predicted. When the vaulted expansion amount is greater than a control requirement, the RBFN model is configured to design a reasonable width and a reasonable interval of the precut wide expansion seams to ensure that the vaulted expansion amount of the cement-stabilized base layer is less than a control value. Based on the design of the RBFN model, the present invention provides a corresponding construction method for the precut wide expansion seams.

Abstract: A manufacturing method of a semiconductor package includes at least the following steps. A rear surface of a semiconductor die is attached to a patterned dielectric layer of a first redistribution structure through a die attach material, where a thickness of a portion of the die attach material filling a gap between the rear surface of the semiconductor die and a recessed area of the patterned dielectric layer is greater than a thickness of another portion of the die attach material interposed between the rear surface of the semiconductor die and a non-recessed area of the patterned dielectric layer. An insulating encapsulant is formed on the patterned dielectric layer of the first redistribution structure to cover the semiconductor die and the die attach material. Other methods for forming a semiconductor package are also provided.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die electrically coupled to the first redistribution structure, a die attach material interposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure and covering the semiconductor die and the die attach material. A bottom of the semiconductor die is embedded in the die attach material, and a thickness of a portion of the die attach material disposed over a spacing of conductive traces of the first redistribution structure is greater than a thickness of another portion of the die attach material disposed over the conductive traces of the first redistribution structure and underlying the bottom of the semiconductor die.

Abstract: A manufacturing method of a semiconductor package includes at least the following steps. A dielectric layer is formed on a conductive pattern and in a space between the conductive pattern, where a concave area of the dielectric layer is formed corresponding to the space between the conductive pattern. A semiconductor die is disposed on the concave area of the dielectric layer with a die attach material interposed therebetween. A pressure is applied to the die attach material so that the concave area of the dielectric layer is filled with the die attach material, and a portion of the die attach material is extruded from the concave area to expand wider than an area of the semiconductor die. An insulating encapsulant is formed on the dielectric layer to cover the semiconductor die. Other methods for forming a semiconductor package are also provided.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die disposed on the first redistribution structure, a die attach material disposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure. A first shortest distance from a midpoint of a bottom edge of the semiconductor die to a midpoint of an bottom edge of an extruded region of the die attach material in a width direction of the semiconductor die is greater than a second shortest distance between an endpoint of the bottom edge of the semiconductor die to an endpoint of the bottom edge of the extruded region of the die attach material. The insulating encapsulant encapsulates the semiconductor die and the die attach material. An inclined interface is between the insulating encapsulant and the extruded region of the die attach material.

Abstract: A printer clean system includes a base, an ink stack assembly, a scraper assembly, a power transmission device and a driving device. The ink stack assembly is disposed on a first accommodation groove. The scraper assembly is disposed on a second accommodation groove. The power transmission device is connected with the driving device, the ink stack assembly, and the scraper assembly. When the power transmission device is rotated to a first angle, the ink stack assembly is brought to an ink stack clean position. When the power transmission device is rotated to a second angle, the scraper assembly is brought to a scraper clean position. When the power transmission device is rotated to a third angle, the ink stack assembly is located at an ink stack return position, and the scraper assembly is located at a scraper return position. Therefore, the pollution can be avoided.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die disposed on the first redistribution structure, a die attach material disposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure. A first shortest distance from a midpoint of a bottom edge of the semiconductor die to a midpoint of an bottom edge of an extruded region of the die attach material in a width direction of the semiconductor die is greater than a second shortest distance between an endpoint of the bottom edge of the semiconductor die to an endpoint of the bottom edge of the extruded region of the die attach material. The insulating encapsulant encapsulates the semiconductor die and the die attach material. An inclined interface is between the insulating encapsulant and the extruded region of the die attach material.

Abstract: A manufacturing method of a semiconductor package includes at least the following steps. A dielectric layer is formed on a conductive pattern and in a space between the conductive pattern, where a concave area of the dielectric layer is formed corresponding to the space between the conductive pattern. A semiconductor die is disposed on the concave area of the dielectric layer with a die attach material interposed therebetween. A pressure is applied to the die attach material so that the concave area of the dielectric layer is filled with the die attach material, and a portion of the die attach material is extruded from the concave area to expand wider than an area of the semiconductor die. An insulating encapsulant is formed on the dielectric layer to cover the semiconductor die. Other methods for forming a semiconductor package are also provided.

Abstract: A printer clean system includes a clean base, an ink stack assembly, a scraper assembly, a power transmission device and a driving device. The ink stack assembly is disposed on a first accommodation groove. The scraper assembly is disposed on a second accommodation groove. The power transmission device is connected with the driving device, the ink stack assembly, and the scraper assembly. When the power transmission device is rotated to a first angle, the ink stack assembly is brought to an ink stack clean position. When the power transmission device is rotated to a second angle, the scraper assembly is brought to a scraper clean position. When the power transmission device is rotated to a third angle, the ink stack assembly is located at an ink stack return position, and the scraper assembly is located at a scraper return position. Therefore, the pollution can be avoided.

Abstract: In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.

Abstract: An ink cartridge clean device including a housing, a work platform, at least one ink stack and at least one ink absorption pad clean element. The housing has a first sidewall and a second sidewall opposite to each other, and an accommodation groove is defined by the housing. The work platform is disposed in the accommodation groove and has two lateral surfaces opposite to each other, and each lateral surface has at least one stopper. The ink stack is disposed on the work platform, and has an ink absorption pad. The ink absorption pad clean element is rotatably connected with the first sidewall and the second sidewall. When the work platform is adjusted from a first position to a second position, the ink absorption pad clean element is rotated, so that the corresponding ink absorption pad is cleaned, thereby preventing the residual ink from contaminating or blocking the ink cartridge.

Abstract: A semiconductor package and a manufacturing method thereof are provided with the following steps, attaching a rear surface of a semiconductor die on a first redistribution structure by a die attach material, wherein the semiconductor die is pressed so that the die attach material is extruded laterally out and climbs upwardly to cover a sidewall of the semiconductor die, and after attaching, the die attach material comprises an extruded region surrounding the semiconductor die, a first shortest distance from a midpoint of an bottom edge of semiconductor die to a midpoint of an bottom edge of extruded region in a width direction is greater than a second shortest distance between an endpoint of the bottom edge of semiconductor die to an endpoint of the bottom edge of extruded region; and forming an insulating encapsulant on the first redistribution structure to encapsulate the semiconductor die and the die attach material.

Abstract: A semiconductor package and a manufacturing method thereof are provided with the following steps, attaching a rear surface of a semiconductor die on a first redistribution structure by a die attach material, wherein the semiconductor die is pressed so that the die attach material is extruded laterally out and climbs upwardly to cover a sidewall of the semiconductor die, and after attaching, the die attach material comprises an extruded region surrounding the semiconductor die, a first shortest distance from a midpoint of an bottom edge of semiconductor die to a midpoint of an bottom edge of extruded region in a width direction is greater than a second shortest distance between an endpoint of the bottom edge of semiconductor die to an endpoint of the bottom edge of extruded region; and forming an insulating encapsulant on the first redistribution structure to encapsulate the semiconductor die and the die attach material.