Abstract: Thermally stable, glassy polymeric materials were prepared from maleimideacetylene terminated monomeric materials by several methods. The monomers were heated to self-polymerize. The A-B structure of the monomer allowed it to polymerize with either bismaleimide monomers/oligomers or bis-acetylene monomers/oligomers. Copolymerization can also take place by mixing bismaleimide and bisacetylene monomers/oligomers with the maleimide-acetylene terminated monomers to yield homogenous glassy polymers.

Abstract: The invention is a novel polyimide prepared from 3,4'-oxydianiline (3,4'-ODA) and 4,4'-oxydiphthalic anhydride (ODPA), in 2-methoxyethyl ether (diglyme). The polymer has been prepared in ultra high molecular weight and in a controlled molecular weight form which has a 2.5 percent offset is stoichiometry (excess diamine) with a 5.0 percent level of phthalic anhydride as an endcap. This controlled molecular weight form allows for greatly improved processing of the polymer for moldings, adhesive bonding, and composite fabrication. The higher molecular weight version affords tougher films and coatings. The overall polymer structure groups in the dianhydride, the diamine, and a metal linkage in the diamine affords adequate flow properties for making this polymer useful as a molding powder, adhesive, and matrix resin.

Abstract: A process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15% by weight of additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.

Abstract: A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH.sub.3).sub.2 group in its molecular structure, and the other reactant contains at least one --CH.sub.3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.

Abstract: The process of the present invention includes first treating a polyamide-acid (such as LARC-TPI polyamide-acid) in an amide-containing solvent (such as N-methylpyrrolidone) with an aprotic organic base (such as triethylamine), followed by dehydrating with an organic dehydrating agent (such as acetic anhydride). The level of crystallinity in the linear aromatic polyimide so produced is maximized without any degradation in the molecular weight thereof.

Abstract: A slow positron beam generator uses a conductive source residing between two test films. Moderator pieces are placed next to the test films on the opposite side of the conductive source. A voltage potential is applied between the moderator pieces and the conductive source. Incident energetic positrons are, first, emitted from the conductive source, second, passed through test film, and then, third, isotropically strike moderator pieces before diffusing out of the moderator pieces as slow positrons. The slow positrons diffusing out of moderator pieces are attracted to the conductive source which is held at an appropriate potential below the moderator pieces. The slow positrons have to pass through the test films before reaching the conductive source. A voltage is adjusted so that the potential difference between the moderator pieces and the conductive source forces the positrons to stop in the test films.

Abstract: Composite materials with matrices of tough, thermoplastic aromatic polyimides are obtained by blending semi-crystalline polyimide powders with polyamic acid solutions to form slurries, which are used in turn to prepare prepregs, the consolidation of which into finished composites is characterized by excellent melt flow during processing.

Abstract: A high temperature polyimide composition prepared by reacting 4,4'-isophthaloyldiphthalic anhydride with metaphenylenediamine is employed to prepare matrix resins, adhesives, films, coatings, moldings, and laminates.

Abstract: Novel copolyimides are prepared by reacting one or more aromatic dianhydrides with a meta-substituted phenylene diamine and an aromatic bridged diamine. The incorporation of meta-substituted phenylene diamine derived units and bridged aromatic diamine derived units into the linear aromatic polymer backbone results in a copolyimide of improved flexibility, processability, and melt-flow characteristics. The novel copolyimides are especially useful as thermoplastic hot-melt adhesives.

Abstract: A novel series of polymers and copolymers based on a polyimide backbone with the incorporation of carbonate moieties along the backbone. The process for preparing these polymers and copolymers is also disclosed as is a novel series of dinitrodiphenyl carbonates and diaminodiphenyl carbonates. The novel polymers and copolymers exhibit high temperature capability and because of the carbonate unit, many exhibit a high degree of order and/or crystallinity.

Abstract: Semi-2-interpenetrating polymer networks (semi-2-IPNs) of improved qualities are prepared by combining a linear polymer and a cross-linkable oligomer which have identical recurring units. Linear and crosslinking components having identical structures in their backbones are mutually soluble and will thus form one homogenous phase unlike other network system. A novel semi-2-IPN of the present invention is prepared by combining a linear polyimidesulfone with a cross-linking acetylene-terminated polyimidesulfone. This combination results in a semi-2-IPN of improved strength, adhesion, and processability.

Abstract: Siloxane-containing addition polyimides having improved physical property characteristics of flexibility, drape, tack and toughness and the process for preparing and utilizing same are disclosed.

Abstract: An aromatic condensation polyimide film that is approximately 90% transparent at 500 nm, useful for thermal protective coatings and the like and the process for preparing same are disclosed. An essential feature of the invention for achieving maximum optical transparency films requires utilizing recrystallized and/or sublimated specific aromatic diamines and dianhydride monomers and introducing bulky electron-withdrawing groups and separator groups into the polymer molecular structure. The incorporation of bulky electron-withdrawing groups in the diamine portion of the polymer structure serves to reduce the formation of inter-chain and intra-chain charge transfer complexes which normally cause large absorptions in the UV-visible range. Incorporation of separator atoms into either the diamine or dianhydride monomers serves to reduce the amount of conjugation and inter-and intra-chain electronic interactions and thereby lessen charge transfer complex formation.

Abstract: An aromatic condensation polyimide film that is approximately 90% transparent at 500 nm, useful for thermal protective coatings and the like, and the processes for preparing same by thermal and chemical conversion are disclosed. An essential feature of the invention for achieving maximum optical transparency films requires utilizing recrystallized and/or sublimated specific aromatic diamines and dianhydride monomers and introducing phenoxy or thiophenyl separator groups and isomeric m,m'- or o,p'-oriented diamines into the polymer molecular structure. The incorporation of these groups in the polymer structure serves to separate the chromaphoric centers and reduce the formation of inter-chain and intra-chain charge transfer complexes which normally cause absorptions in the UV-visible range.

Abstract: A process of endcapping a polyimide system with an endcapping agent in order to achieve a controlled decrease in molecular weight and melt viscosity along with predictable fracture resistance of the molded products is disclosed. The uncapped system is formed by combining an equimolar ratio of 4,4'-bis(3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA) and 1,3-bis(aminophenoxy)benzene (APB) dissolved in bis(2-methoxyethyl)ether. The endcapped system is formed by dissolving APB in bis-(2-methoxyethyl)ether, adding the endcapping agent, and then adding the BDSDA. By varying the amount of endcapping from 0 to 4%, molecular weight is decreased from 13,900 to 8660. At a processing temperature of 250.degree. C., there is a linear relationship between molecular weight and viscosity, with the viscosity decreasing by two orders of magnitude as the molecular weight decreased from 13,900 to 8660. A greater drop in viscosity is noted at higher temperatures.

Abstract: High temperature polyimide film laminates and a process for fabricating large-area, void-free polyimide laminate structures wherein multiple-ply polyimide film laminates may be constructed without decreasing the individual film strength and wherein layers of metal foil may be laminated between polyimide film layers to yield a flexible high temperature resistant structure having capabilities for use as flexible electric circuits, in aerospace applications, and the like.

Abstract: A product and the process for preparing the same to improve the moisture resistance properties of epoxidized TGMDA and DGEBA resin systems by chemically incorporating chromium (III) ions therein without impairing the mechanical strength properties of the resins.

Abstract: A rubber-toughened addition-type polyimide composition having excellent high temperature bonding characteristics in the fully cured state and improved peel strength and adhesive fracture resistance physical property characteristics is disclosed. The process for making the improved adhesive involves preparing the rubber-containing amic acid prepolymer by chemically reacting an amine-terminated elastomer and an aromatic diamine with an aromatic dianhydride with which a reactive chain stopper anhydride has been mixed, and utilizing solvent or mixture of solvents for the reaction.

Abstract: A process for preparing a thermoplastic poly(imidesulfone) is disclosed. This resulting material has thermoplastic properties which are generally associated with polysulfones but not polyimides, and solvent resistant which is generally associated with polyimides but not polysulfones. This system is processable in the 250.degree.-350.degree. C. range for molding, adhesive and laminating applications. This unique thermoplastic poly(imidesulfone) is obtained by incorporating an aromatic sulfone moiety into the backbone of an aromatic linear polyimide by dissolving a quantity of a 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) in a solution of 3,3'-diaminodiphenylsulfone and bis(2-methoxyethyl)ether, precipitating the reactant product in water, filtering and drying the recovered poly(amide-acid sulfone) and converting it to the poly(imidesulfone) by heating.

Abstract: The invention relates to a hot melt adhesive attachment pad for releasably securing distinct elements together and particularly useful in the construction industry or a spatial vacuum environment. The attachment pad consists primarily of a cloth 11 selectively impregnated with a charge of hot melt adhesive 12, a thermo-foil heater 13 and a thermo-cooler 14. These components are securely mounting in a mounting assembly 17 and 18. In operation, the operator activates the heating cycle transforming the hot melt adhesive to a substantially liquid state, positions the pad against the attachment surface, and activates the cooling cycle solidifying the adhesive and forming a strong, releasable bond.