Patents by Inventor Terry McMahon

Terry McMahon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10421275
    Abstract: A fluid ejecting device including a die including a perimeter defined by a first edge, a second edge opposing the first edge, a third edge, and a fourth edge opposing the third edge, wherein the third and fourth edges are disposed at an angle to the first and second edges to form angular corners, an active area including circuitry for controlling the fluid ejecting device to eject fluid, an inactive area positioned between the perimeter and the active area, and a termination ring encircling the active area, the termination ring including sides extending parallel to the first, second, third, and fourth edges and corners coupling adjacent sides, the corners having a corner radius greater than a first distance between the first edge and one of the sides of the termination ring, and a nozzle to eject fluid.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: September 24, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Donald W Schulte, Terry McMahon, Tony Fuller, Stan E Leigh
  • Publication number: 20190248157
    Abstract: In some examples, a heater assembly for a pattern forming system includes a support, and heating elements mounted on the support, where the heating elements are to, in response to activation of the heating element, produce heat directed towards a target to form a pattern on the target. A heat sink is thermally connected to the heating elements and comprising a pattern of heat dissipation surfaces comprising channels to dissipate heat produced by the heating elements.
    Type: Application
    Filed: October 20, 2016
    Publication date: August 15, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Reynaldo V Villavelez, Terry McMahon, Donald W Schulte
  • Patent number: 10369788
    Abstract: A fluid ejection device may include a substrate having front and back opposing surfaces and a slot extending through the substrate between the back and front surfaces and along an axis of the substrate. A recessed end region may be formed in the back surface at each end of the slot.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: August 6, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Terry McMahon, Donald W. Schulte, David Douglas Hall
  • Publication number: 20190210362
    Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.
    Type: Application
    Filed: March 15, 2019
    Publication date: July 11, 2019
    Inventors: Stanley J. Wang, Terry McMahon, Mohammed S. Shaarawi, Donald W. Schulte
  • Publication number: 20190210366
    Abstract: A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.
    Type: Application
    Filed: August 3, 2016
    Publication date: July 11, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Anthony M Fuller, Terry McMahon, Donald W Schulte, Amy Gault
  • Patent number: 10272671
    Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: April 30, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Stanley J. Wang, Terry McMahon, Mohammed S. Shaarawi, Donald W. Schulte
  • Publication number: 20180222181
    Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 9, 2018
    Inventors: Stanley J. Wang, Terry McMahon, Mohammed S. Shaarawi, Donald W. Schulte
  • Publication number: 20170313065
    Abstract: A fluid ejecting device including a die including a perimeter defined by a first edge, a second edge opposing the first edge, a third edge, and a fourth edge opposing the third edge, wherein the third and fourth edges are disposed at an angle to the first and second edges to form angular corners, an active area including circuitry for controlling the fluid ejecting device to eject fluid, an inactive area positioned between the perimeter and the active area, and a termination ring encircling the active area, the termination ring including sides extending parallel to the first, second, third, and fourth edges and corners coupling adjacent sides, the corners having a corner radius greater than a first distance between the first edge and one of the sides of the termination ring, and a nozzle to eject fluid.
    Type: Application
    Filed: October 30, 2014
    Publication date: November 2, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Donald W Schulte, Terry McMahon, Tony Fuller, Stan E Leigh
  • Patent number: 9782969
    Abstract: A thermal inkjet printhead may include a passivation layer, a bond pad formed over the passivation layer and insulating strips of a dielectric material formed over the passivation layer on opposite sides of the bond pad.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: October 10, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Stan E. Leigh, Terry Mcmahon, Thomas P. Abadilla
  • Patent number: 9707586
    Abstract: In an embodiment, a method of forming a printhead includes forming on a front-side surface of a substrate, a thin film layer and a plurality of fluidic channels and ejection chambers. The method also includes forming a slot through the substrate from the back-side surface to the front-side surface, where the back-side and front-side surfaces generally oppose one another. The slot has a length extending along a long axis of the substrate and a width extending along a short axis of the substrate. The method includes forming recessed regions into the back-side surface of the substrate at both ends of the slot that extend beyond the length of the slot.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: July 18, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Terry McMahon, Donald W. Schulte, David Douglas Hall
  • Publication number: 20170190178
    Abstract: A thermal inkjet printhead may include a passivation layer, a bond pad formed over the passivation layer and insulating strips of a dielectric material formed over the passivation layer on opposite sides of the bond pad.
    Type: Application
    Filed: March 16, 2017
    Publication date: July 6, 2017
    Inventors: Stan E. Leigh, Terry Mcmahon, Thomas P. Abadilla
  • Publication number: 20170157925
    Abstract: A fluid ejection device may include a substrate having front and back opposing surfaces and a slot extending through the substrate between the back and front surfaces and along an axis of the substrate. A recessed end region may be formed in the back surface at each end of the slot.
    Type: Application
    Filed: December 15, 2016
    Publication date: June 8, 2017
    Inventors: Rio Rivas, Ed Friesen, Terry McMahon, Donald W. Schulte, David Douglas Hall
  • Patent number: 9630410
    Abstract: A thermal inkjet printhead is described. The thermal inkjet printhead comprising a passivation layer and a plurality of bond pads formed over the passivation layer. The thermal inkjet printhead further comprises a plurality of insulating strips formed over the passivation layer. The insulating strips are formed such that two adjacent bond pads are separated by an insulating strip, from among the plurality of insulating strips. Further, each of the plurality of the insulating strips is of a dielectric material.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: April 25, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Stan E. Leigh, Terry Mcmahon, Tom P. Abdilla
  • Patent number: 9570384
    Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: February 14, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Lawrence H. White, Robert Vina, Terry Mcmahon, James R. Przybyla
  • Publication number: 20160339703
    Abstract: A thermal inkjet printhead is described. The thermal inkjet printhead comprising a passivation layer and a plurality of bond pads formed over the passivation layer. The thermal inkjet printhead further comprises a plurality of insulating strips formed over the passivation layer. The insulating strips are formed such that two adjacent bond pads are separated by an insulating strip, from among the plurality of insulating strips. Further, each of the plurality of the insulating strips is of a dielectric material.
    Type: Application
    Filed: January 29, 2014
    Publication date: November 24, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Stan E. Leigh, Terry Mcmahon, Tom P. Abdilla
  • Patent number: 9259932
    Abstract: An assembly for selectively etching an inkjet printhead includes a substrate and printhead layers formed on the substrate. A bonding region can provide a location on the printhead layers for an electrical bond. An ink channeling region can be defined at least in part by the printhead layers. A mask layer can partially cover the printhead layers and include a first opening positioned over the bonding region and a second opening positioned over the ink channeling region. The assembly can also include a via at the first opening and a trench at the second opening having greater depth than the via.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: February 16, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Lawrence H. White, Robel Vina, Sara Jensen Homeijer, Terry Mcmahon
  • Publication number: 20150340331
    Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.
    Type: Application
    Filed: August 5, 2015
    Publication date: November 26, 2015
    Inventors: Lawrence H. White, Robert Vina, Terry Mcmahon, James R. Przybyla
  • Publication number: 20150001316
    Abstract: In an embodiment, a method of forming a printhead includes forming on a front-side surface of a substrate, a thin film layer and a plurality of fluidic channels and ejection chambers. The method also includes forming a slot through the substrate from the back-side surface to the front-side surface, where the back-side and front-side surfaces generally oppose one another. The slot has a length extending along a long axis of the substrate and a width extending along a short axis of the substrate. The method includes forming recessed regions into the back-side surface of the substrate at both ends of the slot that extend beyond the length of the slot.
    Type: Application
    Filed: March 16, 2012
    Publication date: January 1, 2015
    Inventors: Rio Rivas, Ed Friesen, Terry McMahon, Donald W. Schulte, David Douglas Hall
  • Patent number: 8770707
    Abstract: A drop detector assembly includes an ejection element formed on a substrate to eject a fluid drop, and a light detector formed on the substrate to detect light scattered off of the fluid drop. A fluid drop ejected from a nozzle formed in a transparent nozzle plate scatters light that is detected through the transparent nozzle plate.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: July 8, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Alexander Govyadinov, Andrew L. Van Brocklin, Donald W. Schulte, Terry McMahon
  • Publication number: 20130182031
    Abstract: A drop detector assembly includes an ejection element formed on a substrate to eject a fluid drop, and a light detector formed on the substrate to detect light scattered off of the fluid drop. A fluid drop ejected from a nozzle formed in a transparent nozzle plate scatters light that is detected through the transparent nozzle plate.
    Type: Application
    Filed: September 2, 2010
    Publication date: July 18, 2013
    Inventors: Alexander Govyadinov, Andrew L. Van Brocklin, Donald W. Schulte, Terry McMahon