Patents by Inventor Terry McMahon

Terry McMahon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6933237
    Abstract: The present invention provides methods and an etched substrate. In one embodiment, a method for etching a substrate is provided which comprises creating an etch hole in the substrate using a through the substrate etch and forming a junction on an interior of the etched hole for forming a semiconductor device therein.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: August 23, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Donald W. Schulte, Terry McMahon, Chien-Hua Chen
  • Publication number: 20050127029
    Abstract: Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.
    Type: Application
    Filed: January 27, 2005
    Publication date: June 16, 2005
    Inventors: Simon Dodd, Sean McClelland, Colby Vooren, Terry McMahon, Antonio Cruz-Uribe
  • Publication number: 20050122033
    Abstract: A light device includes an electron supply defining an emitter surface. A dielectric tunneling layer is disposed between the electron supply and a cathode layer. The cathode layer has at least partial photon transparency that is substantially uniform across the emitter surface.
    Type: Application
    Filed: January 12, 2005
    Publication date: June 9, 2005
    Inventors: Zhizhang Chen, Sriram Ramamoorthi, Terry McMahon, Timothy Myers
  • Publication number: 20050012587
    Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.
    Type: Application
    Filed: July 16, 2003
    Publication date: January 20, 2005
    Inventors: Stan Leigh, Tom Abadilla, Donald Schulte, Terry McMahon
  • Publication number: 20040223034
    Abstract: A fluid ejection device having storage and methods of forming and using such fluid ejection devices are described. In one embodiment, a substrate comprises multiple heater resistors supported thereby, and configured for ejecting fluid onto a medium. One storage structure is supported by the substrate and configured to store data.
    Type: Application
    Filed: May 9, 2003
    Publication date: November 11, 2004
    Inventors: James A. Feinn, Lawrence White, Satya Prakash, Donald W. Schulte, Terry McMahon, Adam L. Ghozeil
  • Publication number: 20030235991
    Abstract: The present invention provides methods and an etched substrate. In one embodiment, a method for etching a substrate is provided which comprises creating an etch hole in the substrate using a through the substrate etch and forming a junction on an interior of the etched hole for forming a semiconductor device therein.
    Type: Application
    Filed: June 21, 2002
    Publication date: December 25, 2003
    Inventors: Donald W. Schulte, Terry McMahon, Chien-Hua Chen
  • Patent number: 6627467
    Abstract: A firing chamber is formed in a fluid ejection device. The firing chamber is substantially defined by a barrier layer and a thin film stack. The barrier layer is formed over the thin film stack. The thin film stack is on a substrate and defines the bottom of the firing chamber. A sacrificial layer is encapsulated between the thin film stack and the barrier layer. The sacrificial layer is removed.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: September 30, 2003
    Assignee: Hewlett-Packard Development Company, LP.
    Inventors: Charles Haluzak, Terry Mcmahon, Donald W. Schulte
  • Publication number: 20030082841
    Abstract: A firing chamber is formed in a fluid ejection device. The firing chamber is substantially defined by a barrier layer and a thin film stack. The barrier layer is formed over the thin film stack. The thin film stack is on a substrate and defines the bottom of the firing chamber. A sacrificial layer is encapsulated between the thin film stack and the barrier layer. The sacrificial layer is removed.
    Type: Application
    Filed: October 31, 2001
    Publication date: May 1, 2003
    Inventors: Charles Haluzak, Terry Mcmahon, Donald W. Schulte