Abstract: Methods for fabricating a printhead are described. In one embodiment, a method includes forming on a substrate using a single fabrication technique multiple resistors, some of the resistors to be used as heater resistors configured to eject fluid and some of the resistors to be used as storage resistors that store data, annealing the heater resistors, and intentionally not annealing at least one of the storage resistors, wherein the annealed storage resistors have a first state representing a first digital value and the unannealed storage resistors have a second state representing a second digital value, such that the values associated with the storage resistors can be read by an appropriate detection circuit.

Abstract: A method of storing data in an array of circuit elements, said method comprising injecting a current into selected circuit elements, said current causing a persistent change in a resistance of said selected circuit elements from a first resistance to a second higher resistance indicative of a binary data bit, wherein said current does not break an electrical circuit in which said circuit element is disposed.

Abstract: A fluid ejection device having storage and methods of forming and using such fluid ejection devices are described. In one embodiment, a substrate comprises multiple heater resistors supported thereby, and configured for ejecting fluid onto a medium. One storage structure is supported by the substrate and configured to store data.

Abstract: A fluid ejection device having storage and methods of forming and using such fluid ejection devices are described. In one embodiment, a substrate comprises multiple heater resistors supported thereby, and configured for ejecting fluid onto a medium. One storage structure is supported by the substrate and configured to store data.

Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.

Abstract: A semiconductor structure, fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate is formed from a conductive layer.

Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.

Abstract: A drop generator includes a substrate, and a mandrel that is disposed on the substrate for shaping the drop generator chamber. The mandrel is covered by the orifice member and thereafter removed.

Abstract: The present invention includes as one embodiment an ink jet printhead having a circuit with plural resistors and a power bus. The printhead includes a metal stack formed within the circuit, which is comprised of a first metal layer and a second metal layer and at least one power via. The power via is formed within the circuit as an interface between the first metal layer and the second metal layer and acts as a separation barrier between conductive portions of the resistors and the power bus.

Abstract: In one embodiment, a method provides a bipolar junction transistor that is coupled to a first power supply. A second power supply is utilized to turn on the bipolar junction transistor. And, the bipolar junction transistor is overdriven.

Abstract: A semiconductor structure, fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate is formed from a conductive layer.

Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.

Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced etch stops in the first side of the substrate, etching into the substrate from the second side toward the first side to the spaced etch stops, and etching into the substrate between the spaced etch stops from the second side. Etching into the substrate to the spaced etch stops includes forming a first portion of the opening and etching into the substrate between the spaced etch stops includes forming a second portion of the opening.

Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.

Abstract: The present invention provides methods and an etched substrate. In one embodiment, a method for etching a substrate is provided which comprises creating an etch hole in the substrate using a through the substrate etch and forming a junction on an interior of the etched hole for forming a semiconductor device therein.

Abstract: Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.

Abstract: A light device includes an electron supply defining an emitter surface. A dielectric tunneling layer is disposed between the electron supply and a cathode layer. The cathode layer has at least partial photon transparency that is substantially uniform across the emitter surface.

Abstract: A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region has a configuration that causes a void to be opened at a point of localized heating due to current crowding within the current flow region and that causes the void to propagate across the current flow region.

Abstract: A fluid ejection device having storage and methods of forming and using such fluid ejection devices are described. In one embodiment, a substrate comprises multiple heater resistors supported thereby, and configured for ejecting fluid onto a medium. One storage structure is supported by the substrate and configured to store data.