Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

Abstract: A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

Abstract: A fluid ejecting device including a die including a perimeter defined by a first edge, a second edge opposing the first edge, a third edge, and a fourth edge opposing the third edge, wherein the third and fourth edges are disposed at an angle to the first and second edges to form angular corners, an active area including circuitry for controlling the fluid ejecting device to eject fluid, an inactive area positioned between the perimeter and the active area, and a termination ring encircling the active area, the termination ring including sides extending parallel to the first, second, third, and fourth edges and corners coupling adjacent sides, the corners having a corner radius greater than a first distance between the first edge and one of the sides of the termination ring, and a nozzle to eject fluid.

Abstract: A thermal inkjet printhead may include a passivation layer, a bond pad formed over the passivation layer and insulating strips of a dielectric material formed over the passivation layer on opposite sides of the bond pad.

Abstract: In an embodiment, a method of forming a printhead includes forming on a front-side surface of a substrate, a thin film layer and a plurality of fluidic channels and ejection chambers. The method also includes forming a slot through the substrate from the back-side surface to the front-side surface, where the back-side and front-side surfaces generally oppose one another. The slot has a length extending along a long axis of the substrate and a width extending along a short axis of the substrate. The method includes forming recessed regions into the back-side surface of the substrate at both ends of the slot that extend beyond the length of the slot.

Abstract: A thermal inkjet printhead may include a passivation layer, a bond pad formed over the passivation layer and insulating strips of a dielectric material formed over the passivation layer on opposite sides of the bond pad.

Abstract: A fluid ejection device may include a substrate having front and back opposing surfaces and a slot extending through the substrate between the back and front surfaces and along an axis of the substrate. A recessed end region may be formed in the back surface at each end of the slot.

Abstract: A thermal inkjet printhead is described. The thermal inkjet printhead comprising a passivation layer and a plurality of bond pads formed over the passivation layer. The thermal inkjet printhead further comprises a plurality of insulating strips formed over the passivation layer. The insulating strips are formed such that two adjacent bond pads are separated by an insulating strip, from among the plurality of insulating strips. Further, each of the plurality of the insulating strips is of a dielectric material.

Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.

Abstract: A thermal inkjet printhead is described. The thermal inkjet printhead comprising a passivation layer and a plurality of bond pads formed over the passivation layer. The thermal inkjet printhead further comprises a plurality of insulating strips formed over the passivation layer. The insulating strips are formed such that two adjacent bond pads are separated by an insulating strip, from among the plurality of insulating strips. Further, each of the plurality of the insulating strips is of a dielectric material.

Abstract: An assembly for selectively etching an inkjet printhead includes a substrate and printhead layers formed on the substrate. A bonding region can provide a location on the printhead layers for an electrical bond. An ink channeling region can be defined at least in part by the printhead layers. A mask layer can partially cover the printhead layers and include a first opening positioned over the bonding region and a second opening positioned over the ink channeling region. The assembly can also include a via at the first opening and a trench at the second opening having greater depth than the via.

Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.

Abstract: In an embodiment, a method of forming a printhead includes forming on a front-side surface of a substrate, a thin film layer and a plurality of fluidic channels and ejection chambers. The method also includes forming a slot through the substrate from the back-side surface to the front-side surface, where the back-side and front-side surfaces generally oppose one another. The slot has a length extending along a long axis of the substrate and a width extending along a short axis of the substrate. The method includes forming recessed regions into the back-side surface of the substrate at both ends of the slot that extend beyond the length of the slot.

Abstract: A drop detector assembly includes an ejection element formed on a substrate to eject a fluid drop, and a light detector formed on the substrate to detect light scattered off of the fluid drop. A fluid drop ejected from a nozzle formed in a transparent nozzle plate scatters light that is detected through the transparent nozzle plate.

Abstract: A drop detector assembly includes an ejection element formed on a substrate to eject a fluid drop, and a light detector formed on the substrate to detect light scattered off of the fluid drop. A fluid drop ejected from a nozzle formed in a transparent nozzle plate scatters light that is detected through the transparent nozzle plate.

Abstract: A method of determining a healthy fluid ejection nozzle includes measuring changes in impedance across the nozzle as fluid passes through it. A printhead includes a metal probe that intersects an ink nozzle and an integrated circuit to sense a change in impedance across the nozzle through the metal probe.

Abstract: An assembly for selectively etching an inkjet printhead includes a substrate and printhead layers formed on the substrate. A bonding region can provide a location on the printhead layers for an electrical bond. An ink channeling region can be defined at least in part by the printhead layers. A mask layer can partially cover the printhead layers and include a first opening positioned over the bonding region and a second opening positioned over the ink channeling region. The assembly can also include a via at the first opening and a trench at the second opening having greater depth than the via.

Abstract: A method of determining a healthy fluid ejection nozzle includes measuring changes in impedance across the nozzle as fluid passes through it. A printhead includes a metal probe that intersects an ink nozzle and an integrated circuit to sense a change in impedance across the nozzle through the metal probe.

Abstract: A method of storing data in an array of circuit elements, said method comprising injecting a current into selected circuit elements, said current causing a persistent change in a resistance of said selected circuit elements from a first resistance to a second higher resistance indicative of a binary data bit, wherein said current does not break an electrical circuit in which said circuit element is disposed.

Abstract: In one embodiment, a method provides a bipolar junction transistor that is coupled to a first power supply. A second power supply is utilized to turn on the bipolar junction transistor. And, the bipolar junction transistor is overdriven.