Abstract: A power-supply wiring structure for a multilayer wiring according to an embodiment of the present invention includes one intermediate wiring layer with a first direction set as a priority wiring direction including a position converting and connecting wire, which has crossing-position forming sections formed in crossing positions of upper-layer power supply wires and lower-layer power supply wires of the same kind and projecting sections projecting from the crossing-position forming sections to sides of upper-layer power supply wires of different kinds, and includes a wire connecting section that connects between the upper layer wires and the crossing-position forming section and connects between the projecting section and the lower layer wires via vias.

Abstract: This disclosure concerns a semiconductor circuit design method for designing a clock wiring structure supplying a clock to a flip-flop by using a computer. The semiconductor circuit design method comprises setting the flip-flop based on circuit information on a semiconductor integrated circuit; obtaining a control signal controlling the flip-flop; calculating a first evaluation value indicating a power consumption and a magnitude of a clock skew time when clock gating is applied to the flip-flop; setting a gated clock structure clock-gating the flip-flop when the first evaluation value is higher than a first threshold; calculating a second evaluation value indicating the power consumption and a magnitude of a cell area when a low power flip-flop lower in power consumption than the flip-flop is applied to the flip-flop; and replacing the flip-flop by the lower power flip-flop when the second evaluation value is higher than a second threshold.

Abstract: A semiconductor layout design apparatus has an inter-block connection information extracting part, a block global placement part and a cell placement setting part. The inter-block connection information extracting part configured to extract the number of wiring connections between a plurality of blocks including standard cells and macrocells based on a net list, library information, floor plan information and technology information. The block global placement part configured to roughly place the plurality of blocks in a placement region on a semiconductor substrate. The cell placement setting part configured to set placement positions of the macrocells in the block based on a positioning relationship with the other block and the number of the wiring connections with the other block with respect to each of the plurality of blocks roughly placed by the block global placement part.

Abstract: A semiconductor layout design apparatus has an inter-block connection information extracting part, a cell initial placement part and an evaluation value. The inter-block connection information extracting part configured to extract the number of wiring connections between a plurality of blocks including standard cells and macrocells based on a net list, library information, floor plan information and technology information. The cell initial placement part configured to initially place the standard cells and the macrocells in an placement region to generate an initial floor plan. The evaluation value calculating part configured to calculate an evaluation value of the floor plan based on distances between a plurality of blocks including the standard cells and the macrocells initially placed by the cell initial placement part and the extracted number of the wiring connections between a plurality of blocks.