Patents by Inventor Tetsuhiro Iwai

Tetsuhiro Iwai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180130643
    Abstract: A plasma processing apparatus includes: a base that has an electrode body provided with a placing surface on which a substrate is placed and a pedestal which supports the electrode body; a lid that is liftable and lowerable with respect to the base and forms a sealed space for performing plasma processing on the substrate placed on the placing surface by being lowered to come into close contact with the pedestal; a cover that is provided integrally with the lid and covers at least a part of an outer edge of the substrate placed on the placing surface when the sealed space is formed; and a guide that is disposed around the electrode body.
    Type: Application
    Filed: October 27, 2017
    Publication date: May 10, 2018
    Inventors: TETSUHIRO IWAI, MOTOKO HARA
  • Publication number: 20180096824
    Abstract: A plasma processing apparatus comprises a base including an electrode body having a seat surface for setting a substrate held on a conveying carrier, and a platform for supporting the electrode body, and a lid configured to be moved up and down relative to the base, wherein the lid is moved down and appressed on the platform to define a closed space and a plasma is generated within the closed space to implement a plasma processing for the substrate set on the seat surface. The substrate is held on the holding sheet and set on the seat surface with the holding sheet therebetween. The plasma processing apparatus further comprises a guide being provided along a circumference of the electrode body for alignment of the frame, and a cover provided with the lid for covering at least the frame of the conveying carrier when the closed space is defined.
    Type: Application
    Filed: September 11, 2017
    Publication date: April 5, 2018
    Inventors: Tetsuhiro IWAI, Motoko HARA
  • Publication number: 20180061680
    Abstract: Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.
    Type: Application
    Filed: November 6, 2017
    Publication date: March 1, 2018
    Inventor: Tetsuhiro IWAI
  • Publication number: 20180019099
    Abstract: A plasma processing apparatus includes: a vessel which includes a reaction chamber, atmosphere within the reaction chamber capable of being depressurized; a lower electrode which supports an object to be processed within the reaction chamber; a dielectric member which includes a first surface and a second surface opposite to the first surface, and which closes an opening of the vessel such that the first surface opposes an outside of the reaction chamber and the second surface opposes the object to be processed; and a coil which opposes the first surface of the dielectric member, and which generates plasma within the reaction chamber. The dielectric member has a groove formed in the first surface of the dielectric member, and at least a part of the coil is disposed in the groove.
    Type: Application
    Filed: September 25, 2017
    Publication date: January 18, 2018
    Inventors: Tetsuhiro IWAI, Shogo OKITA
  • Patent number: 9842750
    Abstract: Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: December 12, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Tetsuhiro Iwai
  • Patent number: 9786472
    Abstract: A plasma processing apparatus performs plasma processing on a substrate held by a carrier. The carrier includes a frame disposed around the substrate and a holding sheet which holds the substrate and the frame. The plasma processing apparatus includes: a chamber; a stage which is disposed within the chamber and has an upper surface on which the carrier is mounted; a gas hole which is provided at a position of the upper surface opposing a bottom surface of the frame and through which cooling gas is supplied between the stage and the carrier; and a plasma exciting unit which generates plasma within the chamber.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: October 10, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tetsuhiro Iwai, Shogo Okita, Syouzou Watanabe
  • Patent number: 9583355
    Abstract: The plasma processing apparatus is provided with a chamber 11, a plasma source 13 which generates plasma inside the chamber 11, a stage 16 which is provided inside the chamber 11 and places a carrier 5 thereon, a cover 31 which is arranged above the stage 16 to cover a holding sheet 6 and a frame 7 and has a window 33 which is formed on a central part thereof to penetrate the cover 31 in the thickness direction, and a drive mechanism 38 which changes the position of the cover 31 relative to the stage 16 between a first position which is away from the stage 16 and allows the carrier 5 to be placed on and removed from the stage 16 and a second position which allows the cover 31 to cover the holding sheet 6 and the frame 7 of the carrier 5 placed on the stage 16 and a substrate 2 held on the holding sheet 6 to be exposed through the window 33.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: February 28, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Nobuhiro Nishizaki, Atsushi Harikai, Tetsuhiro Iwai, Mitsuru Hiroshima
  • Publication number: 20160300739
    Abstract: Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.
    Type: Application
    Filed: June 21, 2016
    Publication date: October 13, 2016
    Inventor: Tetsuhiro IWAI
  • Publication number: 20160240352
    Abstract: A plasma processing apparatus performs plasma processing on a substrate held by a carrier. The carrier includes a frame disposed around the substrate and a holding sheet which holds the substrate and the frame. The plasma processing apparatus includes: a chamber; a stage which is disposed within the chamber and has an upper surface on which the carrier is mounted; a gas hole which is provided at a position of the upper surface opposing a bottom surface of the frame and through which cooling gas is supplied between the stage and the carrier; and a plasma exciting unit which generates plasma within the chamber.
    Type: Application
    Filed: October 2, 2015
    Publication date: August 18, 2016
    Inventors: Tetsuhiro IWAI, Shogo OKITA, Syouzou WATANABE
  • Patent number: 9401286
    Abstract: Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: July 26, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Tetsuhiro Iwai
  • Publication number: 20160118284
    Abstract: A plasma processing apparatus includes: a vessel which includes a reaction chamber, atmosphere within the reaction chamber capable of being depressurized; a lower electrode which supports an object to be processed within the reaction chamber; a dielectric member which comprises a first surface and a second surface opposite to the first surface, and which closes an opening of the vessel such that the first surface opposes an outside of the reaction chamber and the second surface opposes the object to be processed; and a coil which opposes the first surface of the dielectric member, and which generates plasma within the reaction chamber. An electrode pattern and an insulation film which covers the electrode pattern are formed on the second surface of the dielectric member.
    Type: Application
    Filed: October 21, 2015
    Publication date: April 28, 2016
    Inventors: Tetsuhiro IWAI, Shogo OKITA, Syouzou WATANABE
  • Publication number: 20160118229
    Abstract: A plasma processing apparatus includes: a vessel which includes a reaction chamber, atmosphere within the reaction chamber capable of being depressurized; a lower electrode which supports an object to be processed within the reaction chamber; a dielectric member which includes a first surface and a second surface opposite to the first surface, and which closes an opening of the vessel such that the first surface opposes an outside of the reaction chamber and the second surface opposes the object to be processed; and a coil which opposes the first surface of the dielectric member, and which generates plasma within the reaction chamber. The dielectric member has a groove formed in the first surface of the dielectric member, and at least a part of the coil is disposed in the groove.
    Type: Application
    Filed: September 25, 2015
    Publication date: April 28, 2016
    Inventors: Tetsuhiro IWAI, Shogo OKITA
  • Patent number: 8945411
    Abstract: The present invention is to achieve a reduction both in size of a plasma processing apparatus and an installation area thereof. A dry etching apparatus includes a stock unit that includes a cassette storing a tray that can be conveyed and that stores substrates. In a conveying unit storing a conveying apparatus of the tray, a rotary stage is provided. Rotational angular position adjustment of the tray is performed by rotating the rotary stage placed on the tray before being subjected to dry etching and detecting a notch by a notch detecting sensor.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: February 3, 2015
    Assignee: Panasonic Corporation
    Inventor: Tetsuhiro Iwai
  • Publication number: 20140335696
    Abstract: The plasma processing apparatus is provided with a chamber 11, a plasma source 13 which generates plasma inside the chamber 11, a stage 16 which is provided inside the chamber 11 and places a carrier 5 thereon, a cover 31 which is arranged above the stage 16 to cover a holding sheet 6 and a frame 7 and has a window 33 which is formed on a central part thereof to penetrate the cover 31 in the thickness direction, and a drive mechanism 38 which changes the position of the cover 31 relative to the stage 16 between a first position which is away from the stage 16 and allows the carrier 5 to be placed on and removed from the stage 16 and a second position which allows the cover 31 to cover the holding sheet 6 and the frame 7 of the carrier 5 placed on the stage 16 and a substrate 2 held on the holding sheet 6 to be exposed through the window 33.
    Type: Application
    Filed: April 23, 2014
    Publication date: November 13, 2014
    Applicant: Panasonic Corporation
    Inventors: Nobuhiro NISHIZAKI, Atsushi HARIKAI, Tetsuhiro IWAI, Mitsuru HIROSHIMA
  • Publication number: 20140332497
    Abstract: The plasma processing apparatus is provided with a plasma source 13 which generates plasma inside a chamber 11, a stage 16 which is provided inside the chamber 11 and places a carrier 5 thereon, a cover 31 which is arranged above the stage 16 to cover a holding sheet 6 and a frame 7 and has a window 33 which is formed to penetrate the cover 31 in the thickness direction, and a drive mechanism 38 which changes the position of the cover 31 relative to the stage 16 between a first position and a second position. The second position does not allow the cover 31 to make contact with the holding sheet 6, the frame 7 and a substrate 2. The cover 31 includes at least a ceiling surface 36b which extends in parallel to the upper face of the frame 7 and an inclined surface 36c which is inclined to gradually come close to the upper face of the holding sheet 6 exposed at the inner diameter side of the frame 7.
    Type: Application
    Filed: April 23, 2014
    Publication date: November 13, 2014
    Applicant: Panasonic Corporation
    Inventors: Nobuhiro NISHIZAKI, Atsushi HARIKAI, Tetsuhiro IWAI, Mitsuru HIROSHIMA
  • Publication number: 20130295775
    Abstract: Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.
    Type: Application
    Filed: July 10, 2013
    Publication date: November 7, 2013
    Inventor: Tetsuhiro IWAI
  • Patent number: 8513097
    Abstract: Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.
    Type: Grant
    Filed: October 9, 2008
    Date of Patent: August 20, 2013
    Assignee: Panasonic Corporation
    Inventor: Tetsuhiro Iwai
  • Publication number: 20130180953
    Abstract: The present invention is to achieve a reduction both in size of a plasma processing apparatus and an installation area thereof. A dry etching apparatus includes a stock unit that includes a cassette storing a tray that can be conveyed and that stores substrates. In a conveying unit storing a conveying apparatus of the tray, a rotary stage is provided. Rotational angular position adjustment of the tray is performed by rotating the rotary stage placed on the tray before being subjected to dry etching and detecting a notch by a notch detecting sensor.
    Type: Application
    Filed: March 26, 2012
    Publication date: July 18, 2013
    Inventor: Tetsuhiro Iwai
  • Patent number: 7994026
    Abstract: A plasma dicing apparatus in which a semiconductor wafer with a protective sheet stuck thereonto covering the entire circuit-forming surface and with an etching-resistant mask member stuck on the back surface opposite to the circuit-forming surface is mounted on a mounting stage; plasma etching is performed using the mask member as a mask; and the semiconductor wafer is diced into plural semiconductor chips. The plasma dicing apparatus includes a ring-shaped frame member retaining the outer circumference of the mask member extending off the outer circumference of the semiconductor wafer. The mounting stage is composed of a wafer supporting part supporting a semiconductor wafer and a frame member supporting part supporting the frame member. This facilitates carrying a semiconductor wafer into and out of the vacuum chamber.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: August 9, 2011
    Assignee: Panasonic Corporation
    Inventors: Atsushi Harikai, Kiyoshi Arita, Tetsuhiro Iwai
  • Publication number: 20100216313
    Abstract: Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.
    Type: Application
    Filed: October 9, 2008
    Publication date: August 26, 2010
    Applicant: Panasonic Corproation
    Inventor: Tetsuhiro Iwai